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Analog Devices Inc./Maxim Integrated MAX4996ETG+
- Part No.:
- MAX4996ETG+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 24-WFQFN Exposed Pad
- Datasheet:
-
MAX4996ETG+.pdf
- Description:
- IC SWITCH DPDT X 3 4OHM 24TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:160
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Product details
Overview
The MAX4996ETG+ from Maxim Integrated is a triple DPDT analog switch IC designed for high-frequency signal routing in portable electronics, featuring 2.0Ω (typ) on-resistance, 6pF (typ) on-capacitance, and rail-to-rail signal handling across a +2.5V to +5.5V supply - enabling SD card, USB, and UART signal switching in space-constrained designs.
For engineers reviewing the MAX4996ETG+ datasheet, MAX4996ETG+ pinout, MAX4996ETG+ application, or MAX4996ETG+ equivalent, this device delivers low-leakage switching (±250nA on-leakage), sub-100µs turn-on time, high off-isolation (–60dB at 1MHz), and precise break-before-make timing (10µs) critical for glitch-free data path reconfiguration.
Technical Context
The MAX4996ETG+ implements three independent DPDT switch pairs controlled by dedicated CB12, CB34, and CB56 logic inputs, each selecting between normally open (NO_) and normally closed (NC_) paths for corresponding COM_ terminals. Its BiCMOS process ensures stable on-resistance flatness (≤0.5Ω variation over 0V–VCC) and minimal capacitance asymmetry across all six channels.
An active-high EN input enables global shutdown, reducing supply current to 0.1µA (max) and placing all COM_ outputs in high-impedance state. Logic thresholds (VIH = 1.4V, VIL = 0.5V) support direct interfacing with 1.8V/2.8V/3.3V processors without level-shifting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-Resistance (RON) | 2.0Ω typical - ensures minimal voltage drop and signal attenuation in high-current analog/data paths. |
| On-Capacitance (CCOM_ON) | 6pF typical - preserves signal integrity up to 670MHz bandwidth for high-speed SD/USB signals. |
| Off-Isolation | –60dB at 1MHz - suppresses crosstalk between active and inactive signal paths in multiplexed interfaces. |
| Supply Voltage Range | +2.5V to +5.5V - supports direct operation from Li-ion battery (3.0–4.2V) or regulated 3.3V/5V rails. |
| Shutdown Current | 0.1µA max - enables ultra-low-power sleep mode in battery-powered handheld devices. |
| Operating Temperature | –40°C to +85°C - qualified for industrial and mobile end-equipment environments. |
| Package | 24-pin TQFN-EP (3.5mm × 3.5mm) - provides thermal efficiency via exposed paddle and PCB area savings vs. SOIC/QFP. |
Pinout & Package
MAX4996ETG+ uses a 24-pin thin quad flat no-lead package with exposed paddle (TQFN-EP, package code T243A3-1), measuring 3.5mm × 3.5mm × 0.8mm. The exposed paddle must be soldered to a solid ground plane for optimal thermal performance and EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | CB12 / CB34 / CB56 | Digital control inputs selecting NO_/NC_ path for switch pairs 1–2, 3–4, and 5–6 respectively. |
| 4–6, 16–18 | COM4 / COM5 / COM6 / COM3 / COM2 / COM1 | Common analog terminals - bidirectional signal ports connected to host processor or peripheral. |
| 7–12, 19–24 | NC6–NC1 / NO1–NO6 | Normally closed and normally open analog terminals - routed to SD card, USB PHY, or UART transceivers. |
| 13 | GND | Ground reference and return path for analog/digital signals and power supply. |
| 14 | VCC | +2.5V to +5.5V analog/digital supply - requires local 0.1µF ceramic bypass capacitor. |
| 15 | EN | Active-high enable input - drives all switches into high-Z state when low, reducing ICC to ≤0.5µA. |
| EP | Exposed Paddle | Internally connected to GND - must be soldered to PCB ground plane for thermal dissipation and noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog signal range | 0V to VCC - supports full-swing digital and analog signals without clipping in SD/UART applications. |
| Break-before-make timing | 10µs guaranteed - prevents momentary short-circuits during signal path reconfiguration in hot-swap scenarios. |
| Low on-resistance flatness | ≤0.5Ω variation over 0V–VCC - maintains consistent insertion loss across signal amplitude range. |
| High-frequency bandwidth | 670MHz –3dB - enables clean switching of SD2.0 clock (up to 50MHz) and USB 2.0 data (480MHz). |
| Logic-compatible control | VIH = 1.4V, VIL = 0.5V - allows direct connection to 1.8V I/O domains without external level shifters. |
Applications
| SD Card Interface Switching | USB 2.0 Data Path Multiplexing |
|---|---|
|
Use Scenario: Sharing a single SDIO interface between two SD cards or between an SD card and embedded eMMC in smartphones. IC Role / Device Role / Timing Role: Triple DPDT analog switch routing CLK/CMD/DAT lines under baseband processor control. Use Value: Enables dual-card support without adding extra SDIO controllers, preserving PCB real estate and BOM cost. |
Use Scenario: Selecting between onboard USB device and external USB host in portable media players or docking stations. IC Role / Device Role / Timing Role: Bidirectional signal switch for D+/D– lines with <10µs break-before-make to prevent bus contention. Use Value: Eliminates need for separate USB transceivers per port, reducing power and layout complexity. |
| UART Signal Re-Routing | GPS/Baseband Coexistence Management |
|
Use Scenario: Dynamically assigning UART TX/RX lines between GPS module, Bluetooth chip, and application processor in wearables. IC Role / Device Role / Timing Role: Low-capacitance analog switch isolating unused UART paths while maintaining signal fidelity. Use Value: Prevents cross-talk and ground bounce between concurrent serial peripherals operating at different voltages. |
Use Scenario: Isolating GPS RF front-end from cellular baseband during simultaneous transmit/receive in smartphones. IC Role / Device Role / Timing Role: High-off-isolation (–60dB) switch disconnecting GPS antenna path during LTE transmission bursts. Use Value: Mitigates desense and improves GPS sensitivity by >3dB through controlled RF path isolation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX4996LETG+ | Active-low EN input (vs. active-high in MAX4996ETG+); identical RON, CCOM, bandwidth, and pinout. | Requires inverted enable logic from host MCU - suitable where system-level control favors low-active signaling. | Select MAX4996LETG+ only if existing firmware/hardware already drives EN low to enable; otherwise MAX4996ETG+ simplifies integration. |
| TMUX1574RTER | Quad SPDT (not triple DPDT); 4.5Ω RON, 9pF CCOM, 300MHz bandwidth; 16-pin WQFN. | Lacks native DPDT topology - requires two devices to replicate MAX4996ETG+'s six-pole switching capability. | Choose TMUX1574RTER only for lower-channel-count applications or where smaller footprint outweighs topology mismatch. |
Compared with MAX4996LETG+, the MAX4996ETG+ eliminates need for external inverters in enable logic; versus TMUX1574RTER, it delivers integrated triple DPDT functionality in one 24-pin package - reducing component count, board area, and inter-device skew in multi-signal-path systems.
Availability
MAX4996ETG+ is available at Aetrix Electronics and suitable for SD card switching, USB signal routing, and UART reconfiguration requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for consumer electronics and industrial handheld designs.
Supply support for MAX4996ETG+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding applications in communications, computing, and portable electronics.
The MAX4996 series targets high-frequency analog switching in battery-powered devices, emphasizing ultra-low leakage, rail-to-rail operation, and compact packaging to meet stringent size and power constraints in mobile platforms.
FAQ
What is the maximum analog signal voltage range supported by the MAX4996ETG+?
The MAX4996ETG+ supports analog signals from 0V to VCC, where VCC ranges from +2.5V to +5.5V. This rail-to-rail capability allows full-swing signal handling without distortion - essential for SDIO, USB, and UART signals that swing across the entire supply domain. The device maintains low on-resistance flatness (<0.5Ω variation) across this range, ensuring consistent performance regardless of signal DC offset.
Does the MAX4996ETG+ require external level-shifting when interfaced with a 1.8V microcontroller?
No, the MAX4996ETG+ does not require external level-shifting for 1.8V microcontrollers. Its logic inputs accept VIH ≥ 1.4V and VIL ≤ 0.5V, making them compatible with standard 1.8V CMOS outputs. Driving CB12/CB34/CB56 and EN directly from a 1.8V GPIO ensures proper switching while keeping supply current below 2µA - a key advantage for low-power portable designs using the MAX4996ETG+.
How does the MAX4996ETG+ achieve high off-isolation in high-frequency applications?
The MAX4996ETG+ achieves –60dB off-isolation at 1MHz through optimized BiCMOS switch architecture and low 2.5pF NO_/NC_ off-capacitance. Its symmetrical layout minimizes parasitic coupling between adjacent channels, and the 6pF typical COM_ on-capacitance ensures minimal loading on active paths. These characteristics collectively suppress crosstalk in dense layouts common in smartphones and PDAs using the MAX4996ETG+ for SD/USB multiplexing.
Can the MAX4996ETG+ be used in bidirectional signal paths such as USB D+/D– lines?
Yes, the MAX4996ETG+ supports fully bidirectional signal routing - NO_, NC_, and COM_ terminals are interchangeable as inputs or outputs. Its low 2.0Ω on-resistance and 670MHz –3dB bandwidth preserve signal integrity for USB 2.0 differential pairs, while the 10µs break-before-make interval prevents bus contention. This makes the MAX4996ETG+ suitable for USB data path switching in portable media players and docking solutions.
What is the thermal performance of the MAX4996ETG+ in its TQFN-EP package?
The MAX4996ETG+ in its 24-pin TQFN-EP package has θJA = 65.1°C/W and θJC = 5.4°C/W when mounted on a four-layer JEDEC-standard board. The exposed paddle must be soldered to a large internal ground plane to realize these values - enabling continuous power dissipation up to 1228mW at +70°C ambient. This thermal design supports reliable operation in thermally constrained handheld enclosures using the MAX4996ETG+.
MAX4996ETG+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Packaging:
- Tube
- Product Status:
- Active
- Switch Circuit:
- DPDT
- Multiplexer/Demultiplexer Circuit:
- 2:2
- Number of Circuits:
- 3
- On-State Resistance (Max):
- 4Ohm
- Channel-to-Channel Matching (ΔRon):
- 100mOhm
- Voltage - Supply, Single (V+):
- 2.5V ~ 5.5V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 100µs, 6µs
- -3db Bandwidth:
- 670MHz
- Charge Injection:
- -
- Channel Capacitance (CS(off), CD(off)):
- 2.5pF, 4pF
- Current - Leakage (IS(off)) (Max):
- 250nA
- Crosstalk:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TQFN (4x4)
MAX4996ETG+ FAQ
1.How can I place an order for MAX4996ETG+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX4996ETG+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX4996ETG+ reliable?
The price and inventory of MAX4996ETG+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX4996ETG+ is usually 5 days.
3.What payment methods are accepted for MAX4996ETG+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX4996ETG+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX4996ETG+?
MAX4996ETG+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX4996ETG+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX4996ETG+?
For technical support, including MAX4996ETG+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX4996ETG+ requirements.
6.How does Aetrix verify that MAX4996ETG+ is sourced from the original manufacturer or authorized distributors?
All MAX4996ETG+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX4996ETG+ meets industry standards.
7.What is the process for return or replacement of MAX4996ETG+?
All MAX4996ETG+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX4996ETG+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX4996ETG+ part is unused and in its original packaging.
Return procedure for MAX4996ETG+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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