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Analog Devices Inc./Maxim Integrated MAX5072ETJ+

Part No.:
MAX5072ETJ+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
32-WFQFN Exposed Pad
Datasheet:
AetrixMAX5072ETJ+.pdf
Description:
IC REG BUCK BOOST ADJ DL 32TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,279

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Product details

Overview

The MAX5072ETJ+ from Maxim Integrated is a dual-output DC-DC converter IC with integrated high-side n-channel power MOSFETs, configurable per channel as buck (3.3V/2A and 2.5V/1A) or boost (up to 28V) regulators. It operates from 5.5V–23V input, delivers ±1% output voltage accuracy, and supports 200kHz–2.2MHz programmable switching frequency for xDSL modem power management.

For engineers reviewing the MAX5072ETJ+ datasheet, MAX5072ETJ+ pinout, MAX5072ETJ+ application, or MAX5072ETJ+ equivalent, key selection criteria include out-of-phase operation for reduced input ripple, digital soft-start for monotonic power-up, integrated power-good and dying-gasp outputs, and thermal shutdown protection in automotive-grade (-40°C to +85°C) operation.

Technical Context

The MAX5072ETJ+ implements two independent voltage-mode PWM controllers with 180° out-of-phase switching to minimize input capacitor RMS ripple current and EMI. Each converter uses internal transconductance error amplifiers (gM = 1.2–2.9 mS), programmable oscillator (via ROSC resistor), and digital soft-start (2048 clock cycles, 64-step ramp).

It integrates a 5.2V VL linear regulator (4.9–5.5V output, 40mA load), 2.0V BYPASS reference (±2mV load regulation), and uncommitted comparators (PFI/PFO) for power-fail detection with 0.78V trip and 20mV hysteresis - all supporting xDSL system-level sequencing and fault response.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range5.5V to 23V - enables use of low-cost AC adapters in xDSL modems without external pre-regulation.
Output Voltage Range0.8V (buck) to 28V (boost) - supports wide range of core, I/O, and interface rail requirements.
Max Output Current2A (Converter 1, buck), 1A (Converter 2, buck) - defined at VOUT = 3.3V/2.5V, VIN = 12V, ensuring stable PoL delivery.
Switching Frequency200kHz to 2.2MHz - programmable via ROSC to avoid xDSL band harmonics and optimize efficiency/size trade-offs.
Thermal Performance2.7W dissipation at +70°C ambient in 32-pin thin QFN - enables high-power density without forced airflow in compact modems.
Voltage Accuracy±1% over -40°C to +85°C - ensures reliable regulation across automotive temperature range without calibration.
Protection FeaturesShort-circuit (buck), max duty-cycle limit (boost), thermal shutdown, and dying-gasp output - provides autonomous fault containment during line transients or brownouts.

Pinout & Package

The MAX5072ETJ+ is housed in a thermally enhanced 32-pin thin QFN package (5mm × 5mm, exposed pad), rated for -40°C to +85°C operation and capable of dissipating 2.7W at +70°C ambient.

Pin/TerminalCircuit RoleDesign Meaning
1 CLKOUTPhase-shifted clock output45° phase delay vs. SOURCE2; enables four-phase operation when cascading two MAX5072ETJ+ ICs in master-slave configuration.
2 BST2/VDD2Bootstrap/bypass supply for Converter 2Drives high-side gate in buck mode (via flying cap) or powers driver in boost mode (0.1µF to PGND).
3,4 DRAIN2Internal MOSFET drain connectionHigh-side switch node in buck; low-side switch node in boost - defines topology-dependent PCB routing path.
5 EN2Active-high enable for Converter 2Independent shutdown control; used with EN1 for precise power sequencing in multi-rail systems.
6 FB2Feedback input for Converter 2Connects to resistive divider; sets output voltage with 0.788–0.812V reference (±1.5% over temp) for ±1% regulation.
7 COMP2Compensation node for Converter 2External RC network stabilizes control loop; transconductance amplifier (gM = 1.2–2.9 mS) enables robust transient response.
8 PFOOpen-drain power-fail outputGoes low when PFI < 0.78V; signals input undervoltage condition (e.g., dying-gasp event) to host controller or backup circuitry.
9 SYNCExternal synchronization inputAccepts 400–4400kHz TTL clock; forces fSW = fSYNC/2 with 100ns minimum pulse width and 45° phase alignment.
10 PFIPower-fail comparator inputUncommitted noninverting input; configured via resistor divider to detect VIN drop - also usable for OVP or custom POR logic.
11 OSCOscillator frequency setROSC resistor (5.6kΩ–56kΩ) programs fOSC = 25×10⁹/ROSC; determines fSW = fOSC/2 with ±15% accuracy.
12 V+Main input supplyPrimary power source (5.5–23V); bypassed to SGND with ≥0.1µF ceramic cap to suppress high-frequency noise.
13,14 VL5.2V internal LDO outputPowers BST1/VDD1 and BST2/VDD2 gates; regulated 4.9–5.5V at 40mA ensures stable high-side drive under load.
15 BYPASS2.0V precision referenceLow-noise 2.00V ±2mV output; used for sub-0.8V feedback or analog biasing - bypassed with ≥0.22µF ceramic cap.
16 MRActive-low manual resetInitiates 180ms RST timeout; internal 44kΩ pullup allows direct GPIO connection without external components.
17 RSTOpen-drain power-on resetAsserts low until both outputs exceed 92.5% of setpoint and hold for 180ms - ensures clean system boot sequencing.
18 COMP1Compensation node for Converter 1Matches COMP2 function; supports type-II/type-III compensation networks for stable buck/boost loop dynamics.
19 FB1Feedback input for Converter 1Same reference tolerance as FB2; enables independent output programming (e.g., 3.3V core + 2.5V I/O) with monotonic soft-start.
20 EN1Active-high enable for Converter 1Synchronized or staggered startup with EN2; tied to VL for always-on operation or controlled by system supervisor.
21,22 DRAIN1Internal MOSFET drain connectionTopology-dependent node: high-side in buck (connects to V+), low-side in boost (connects to inductor/diode junction).
23 BST1/VDD1Bootstrap/bypass supply for Converter 1Functionally identical to BST2/VDD2; requires dedicated 0.1µF ceramic cap to PGND in boost mode.
24 FSEL1Converter 1 frequency selectGrounding reduces fSW1 to half fSW2; prevents beat frequencies when operating converters at different switching rates.
25 PGOOD1Converter 1 power-good outputOpen-drain signal asserts high only when VOUT1 > 92.5% of setpoint - used for inter-rail enable sequencing (e.g., enable Converter 2 after Converter 1 stabilizes).
26,27 SOURCE1Internal MOSFET source connectionBuck: connects to switched inductor node; Boost: connects to PGND - defines return path for high-side/low-side conduction.
28,30 PGNDPower groundReturn for high-current paths (V+, VL bypass, rectifier anode); must tie to SGND at single point near capacitors.
29 SGNDSignal groundAnalog reference for FB/COMP/OSC; connected to exposed pad for thermal and noise performance - critical for stability.
31,32 SOURCE2Internal MOSFET source connectionFunctionally identical to SOURCE1; completes buck/boost current loop with matching layout constraints.
EP (exposed pad)Thermal and electrical groundSoldered to SGND plane; reduces θJA and improves thermal dissipation - mandatory for 2.7W operation at +70°C.

Key Features

FeatureDesign Value
Dual independent buck/boost convertersEnables flexible multi-rail generation (e.g., 3.3V core + 12V line driver) from single IC - eliminates need for discrete controllers and external MOSFETs.
180° out-of-phase switchingReduces input capacitor RMS ripple current by ~30%, allowing smaller/cheaper bulk capacitance and lower EMI filter cost in space-constrained xDSL designs.
Digital soft-start (2048-cycle ramp)Eliminates output overshoot and inrush current spikes during power-up - prevents damage to downstream logic and avoids false resets in sensitive systems.
Integrated 5.2V VL regulator & 2.0V BYPASS referenceRemoves need for external bias supplies; VL drives bootstrap circuits, BYPASS enables sub-0.8V outputs or precision analog functions without added ICs.
Four-phase master-slave capabilityCLKOUT-to-SYNC chaining of two MAX5072ETJ+ ICs doubles effective input ripple frequency - cuts required input capacitance by 50% in high-current applications.
Dying-gasp PFI/PFO with hysteresisProvides deterministic early-warning shutdown before input collapse - critical for saving state or initiating graceful disconnect in broadband equipment during AC loss.

Applications

xDSL ModemsxDSL Routers

Use Scenario: Powering ADSL/VDSL line card, PHY, and DSP subsystems from universal AC adapter (5.5–23V).

IC Role / Device Role / Timing Role: Dual-output DC-DC controller managing 3.3V/2A core rail and 2.5V/1A I/O rail with synchronized soft-start and power-good sequencing.

Use Value: Eliminates discrete buck controllers and external MOSFETs while meeting ±1% regulation and 200kHz–2.2MHz EMI compliance across global mains voltages.

Use Scenario: Generating isolated 12V boost rail for Ethernet PHY and 3.3V buck rail for CPU/memory in compact residential gateway.

IC Role / Device Role / Timing Role: Configurable dual converter delivering [email protected] (boost) and [email protected] (buck) with 180° phase shift to minimize input ripple on shared 12V bus.

Use Value: Reduces input capacitor count by 30% and simplifies layout versus two separate converters - critical for CE-certified small-form-factor designs.

Point-of-Load DC-DC ConvertersIndustrial Broadband Access Equipment

Use Scenario: Local regulation of FPGA I/O banks and analog front-end supplies in telecom line cards with tight thermal constraints.

IC Role / Device Role / Timing Role: High-efficiency buck converter (VIN=12V, VOUT=2.5V/1A) operating at 1.25MHz to shrink inductor size while maintaining >80% efficiency.

Use Value: Achieves 2.7W dissipation in 5mm×5mm QFN at +70°C ambient - enables fanless operation in dense backplane modules.

Use Scenario: Power management for outdoor DSLAM line cards exposed to -40°C to +85°C ambient with frequent AC brownouts.

IC Role / Device Role / Timing Role: Dual converter with dying-gasp PFI detection, thermal shutdown, and automotive-grade temp rating ensuring fail-safe behavior during grid instability.

Use Value: Guarantees 180ms RST timeout and monotonic soft-start across full temperature range - prevents lockup or data corruption during cold starts or voltage sags.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output DC-DC controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM5119MT/NOPBTwo-channel synchronous buck controller (no integrated MOSFETs); requires external high-side/low-side FETs; supports 3V–65V input.Higher input voltage range but adds BOM cost and layout complexity; lacks integrated VL regulator, BYPASS reference, and dying-gasp comparator.Select when >23V input or synchronous rectification is required; not drop-in due to external FET dependency and missing integrated features.
TPS54229EDDARSingle-channel 2A synchronous buck converter; no boost capability; fixed 570kHz fSW; no out-of-phase or multi-IC sync support.Requires two ICs for dual-rail generation; no PFI/PFO, CLKOUT, or RST sequencing - limited to basic PoL applications.Select for cost-sensitive single-rail designs where dual topology flexibility and system-level fault management are unnecessary.

Compared with LM5119MT/NOPB and TPS54229EDDAR, the MAX5072ETJ+ uniquely integrates dual buck/boost MOSFETs, 180° phase control, dying-gasp detection, and system-level sequencing (RST/PGOOD/PFO) in a single 5mm×5mm package - reducing total solution size and component count for xDSL and broadband access systems.

Availability

The MAX5072ETJ+ is available at Aetrix Electronics and suitable for xDSL modems, xDSL routers, point-of-load DC-DC converters, industrial broadband access equipment, and telecom line card power management requiring stable component supply across extended temperature ranges.

Supply support for MAX5072ETJ+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for communications, computing, and industrial markets.

The MAX5072ETJ+ belongs to Maxim's high-density power management product line, designed specifically for broadband access equipment requiring dual-rail flexibility, EMI-conscious switching, and robust system-level fault response in compact form factors.

FAQ

What input voltage range does the MAX5072ETJ+ support, and how does it impact xDSL modem design?

The MAX5072ETJ+ supports a 5.5V to 23V input voltage range, enabling direct operation from low-cost universal AC adapters without intermediate pre-regulation. This simplifies power architecture in xDSL modems by eliminating external buck converters or LDOs, reducing BOM count and board area while maintaining ±1% output regulation across the full input range - critical for global mains compatibility and brownout resilience.

How does the 180° out-of-phase operation of the MAX5072ETJ+ reduce input capacitor requirements?

The MAX5072ETJ+'s 180° out-of-phase switching aligns the input current peaks of its two converters to occur at opposite times within each cycle, reducing RMS input ripple current by up to 30%. This allows designers to use fewer or lower-rated input capacitors - lowering cost, size, and EMI filtering complexity - which is especially valuable in space-constrained xDSL modem and router designs where board real estate is at a premium.

Can the MAX5072ETJ+ be configured for boost operation, and what are the practical output limits?

Yes, each channel of the MAX5072ETJ+ can be independently configured as a boost converter with output voltage programmable up to 28V. In boost mode, Converter 2 delivers up to 0.5A at 12V (efficiency >70% at 2.2MHz), making it suitable for powering line drivers or auxiliary rails. The maximum duty-cycle limit and internal MOSFET RDS(on) (330–690mΩ) define practical current limits - higher output voltages require careful inductor and diode selection to maintain efficiency and thermal performance.

What is the role of the PFI and PFO pins on the MAX5072ETJ+, and how are they used in dying-gasp applications?

The PFI (power-fail input) and PFO (power-fail output) pins on the MAX5072ETJ+ implement a dying-gasp function: PFI monitors input voltage via a resistor divider, and when it falls below 0.78V (with 20mV hysteresis), PFO goes low to signal imminent power loss. This allows xDSL modems to save configuration data, initiate graceful disconnect, or trigger backup power - all before VIN collapses completely. PFI is uncommitted, enabling reuse for OVP or other comparator-based protections.

Does the MAX5072ETJ+ include built-in protection features, and how do they enhance system reliability?

Yes, the MAX5072ETJ+ integrates short-circuit protection (for buck mode), maximum duty-cycle limiting (for boost mode), thermal shutdown (+150°C trip with 30°C hysteresis), and overvoltage lockout on VL (3.95–4.25V). These features autonomously contain faults without external circuitry - preventing damage during output shorts, input surges, or thermal overload. Combined with digital soft-start and monotonic power-up, they ensure robust, maintenance-free operation in unattended broadband equipment deployed in harsh environments.

MAX5072ETJ+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
32-WFQFN Exposed Pad
Packaging:
Tube
Product Status:
Active
Function:
Step-Up, Step-Down
Output Configuration:
Positive
Topology:
Buck, Boost
Output Type:
Adjustable
Number of Outputs:
2
Voltage - Input (Min):
4.5V
Voltage - Input (Max):
23V
Voltage - Output (Min/Fixed):
0.8V
Voltage - Output (Max):
28V
Current - Output:
1.38A (Switch), 2.3A (Switch)
Frequency - Switching:
200kHz ~ 2.2MHz
Synchronous Rectifier:
No
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFN (5x5)

MAX5072ETJ+ FAQ

1.How can I place an order for MAX5072ETJ+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX5072ETJ+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX5072ETJ+ reliable?

The price and inventory of MAX5072ETJ+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX5072ETJ+ is usually 5 days.

3.What payment methods are accepted for MAX5072ETJ+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX5072ETJ+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX5072ETJ+?

MAX5072ETJ+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX5072ETJ+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX5072ETJ+?

For technical support, including MAX5072ETJ+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX5072ETJ+ requirements.

6.How does Aetrix verify that MAX5072ETJ+ is sourced from the original manufacturer or authorized distributors?

All MAX5072ETJ+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX5072ETJ+ meets industry standards.

7.What is the process for return or replacement of MAX5072ETJ+?

All MAX5072ETJ+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX5072ETJ+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX5072ETJ+ part is unused and in its original packaging.

Return procedure for MAX5072ETJ+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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