Analog Devices Inc./Maxim Integrated MAX6476TA30BD3+
- Part No.:
- MAX6476TA30BD3+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
MAX6476TA30BD3+.pdf
- Description:
- IC REG LIN POS ADJ 300MA 8TDFN
- Quantity:
- Payment:

- Shipping:

Inventory:785
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX6476TA30BD3+ from Maxim Integrated is a 300mA low-dropout linear regulator with integrated microprocessor reset circuit, fixed 3.0V output, ±2.0% output voltage accuracy over -40°C to +85°C, 114mV dropout at 300mA load, and 150ms minimum reset timeout. It features active-low push-pull RESET, shutdown current of 0.1µA (typ), and remote feedback (FB) pin for external NPN transistor use in higher-current applications.
For engineers reviewing the MAX6476TA30BD3+ datasheet, MAX6476TA30BD3+ pinout, MAX6476TA30BD3+ application, or MAX6476TA30BD3+ equivalent, key selection considerations include its 3.0V fixed output with -7.5% reset threshold, FB-based remote sensing capability, 8-pin TDFN-EP package with exposed pad, and suitability for battery-powered portable systems requiring regulated power and reliable processor supervision.
Technical Context
The MAX6476TA30BD3+ integrates a precision LDO regulator core and a fully self-contained reset supervisor sharing the same bandgap reference. Its FB pin enables remote voltage sensing at the load, decoupling regulation from PCB trace IR drop - critical for stable 3.0V supply to microprocessors under dynamic load.
This variant belongs to the MAX6475/MAX6476/MAX6483/MAX6484 subgroup, distinguished by FB (not SET) as the feedback terminal, absence of manual reset (MR), inclusion of shutdown (SHDN), and support for external NPN pass transistors. Reset assertion occurs when FB falls below 92.5% of nominal VOUT (i.e., 2.775V for 3.0V output), with guaranteed 150ms minimum timeout (D3 suffix).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.0V ±2.0% over -40°C to +85°C - ensures stable core logic supply within microprocessor tolerance bands. |
| Max Output Current | 300mA guaranteed - sufficient for mid-power microcontrollers, Bluetooth modules, and USB peripherals. |
| Dropout Voltage | 114mV at 300mA - enables operation down to VIN = 3.114V, extending battery runtime in single-cell Li-ion or 3× alkaline systems. |
| Reset Threshold | 92.5% of VOUT (2.775V) - triggers reset before supply violates -7.5% microprocessor spec, preventing erratic execution. |
| Reset Timeout | 150ms (min) - provides adequate stabilization time for clocks and memory after power recovery. |
| Supply Current | 82µA operating / 0.1µA shutdown - minimizes quiescent drain in always-on or sleep-mode battery systems. |
| Package | 8-pin TDFN-EP (3mm × 3mm, 0.75mm height) with exposed thermal pad - supports high-power-density layouts and efficient heat dissipation. |
Pinout & Package
MAX6476TA30BD3+ uses an 8-pin TDFN-EP package with exposed paddle (EP), rated for -40°C to +85°C operation. The EP must be soldered to PCB ground plane for thermal management and electrical grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (IN) | Regulator input | Accepts 2.5V–5.5V input; bypass to GND with 0.1µF capacitor to suppress high-frequency noise. |
| 2 (GND) | Ground reference & thermal path | Primary return path; connects internally to EP - must be tied to large copper area for thermal dissipation. |
| 3 (SHDN) | Active-low shutdown control | Pulling low disables regulator and reduces supply current to ≤1µA; connect to VIN for normal operation. |
| 4 (RESET) | Active-low push-pull reset output | Drives µP reset pin directly; asserts low during power-up, brownout, or SHDN activation; holds low ≥150ms after recovery. |
| 5 (FB) | Remote feedback sense input | Connects to load VCC point to compensate for PCB trace resistance; enables precise 3.0V regulation at point-of-load. |
| 6 (OUT) | Regulated output | Delivers up to 300mA; requires ≥3.3µF low-ESR ceramic capacitor to GND for stability. |
| 7,8 (NC) | No-connect terminals | Not bonded; left unconnected per datasheet - no routing or termination required. |
| EP | Exposed thermal pad | Internally connected to GND; must be soldered to PCB ground plane to maintain junction temperature <150°C. |
Key Features
| Feature | Design Value |
|---|---|
| Remote feedback (FB) pin | Enables point-of-load regulation by sensing voltage directly at the microprocessor VCC pin, eliminating errors from PCB trace resistance. |
| 150ms reset timeout (D3) | Guarantees sufficient delay for oscillator startup and memory initialization before releasing processor reset. |
| 0.1µA shutdown current | Permits ultra-low-power system sleep states without compromising fast wake-up response via SHDN control. |
| Integrated reverse current protection | Blocks >99.99% of OUT-to-IN leakage (<0.01µA typ), preventing battery backfeed when external sources are disconnected. |
| Thermal shutdown with 20°C hysteresis | Protects against sustained overload by cycling output on/off until junction cools, avoiding permanent damage. |
Applications
| Handheld Medical Instruments | USB-C Power Delivery Accessories |
|---|---|
Use Scenario: Portable blood glucose meters and pulse oximeters powered by single-cell lithium batteries with tight space constraints. IC Role / Device Role / Timing Role: Provides stable 3.0V supply to ADC, display driver, and BLE radio while asserting RESET until battery voltage stabilizes post-insertion. Use Value: FB sensing maintains 3.0V ±2% at the MCU VCC pin despite 150mΩ PCB trace resistance, ensuring accurate analog measurements. |
Use Scenario: Compact USB-C PD adapters that negotiate variable input voltage and require local 3.0V rail for PD controller and status LEDs. IC Role / Device Role / Timing Role: Regulates auxiliary 3.0V rail from buck converter output; RESET ensures PD controller initializes only after stable 3.0V is confirmed. Use Value: 114mV dropout allows operation down to 3.114V input - compatible with 3.3V buck output under load, minimizing conversion losses. |
| Industrial Wireless Sensor Nodes | Low-Power IoT Gateways |
Use Scenario: Battery-operated LoRaWAN sensor nodes deployed in remote locations with 10-year target lifetime. IC Role / Device Role / Timing Role: Powers ARM Cortex-M0+ MCU and SX1276 transceiver; SHDN enables deep-sleep mode with 0.1µA system quiescent current. Use Value: Shutdown current of 0.1µA (typ) reduces annual battery drain to <0.9mAh - enabling coin-cell or primary lithium operation. |
Use Scenario: Edge gateways aggregating Zigbee/Thread data, requiring reliable 3.0V for SoC I/O and secure element ICs. IC Role / Device Role / Timing Role: Supplies 3.0V to security co-processor and Ethernet PHY; RESET prevents firmware corruption during brownout events. Use Value: -7.5% reset threshold (2.775V) aligns with JEDEC JESD8-12A requirements for 3.3V-tolerant 3.0V I/O domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO-with-reset applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS7A0530PDBVR | 300mA LDO with 25µA IQ and no integrated reset; requires external supervisor (e.g., TPS3808G01) for reset functionality. | Lacks FB pin and reset circuit - adds BOM cost and board area; suitable only if reset timing is managed externally. | Select when lowest quiescent current is critical and reset logic is already implemented elsewhere in design. |
| MAX1725EZK30+T | 300mA LDO with 1.5% accuracy and 120ms reset timeout (D2 suffix); uses SET pin instead of FB; no remote sensing capability. | Fixed 3.0V output but lacks FB - cannot compensate for trace IR drop; limited to local regulation near IC. | Choose for simpler designs where load is adjacent to regulator and trace resistance is negligible (<20mΩ). |
Compared with TPS7A0530PDBVR and MAX1725EZK30+T, MAX6476TA30BD3+ uniquely combines FB-based remote sensing, integrated -7.5% reset with 150ms timeout, and 0.1µA shutdown in a single 3mm × 3mm package - reducing component count and improving point-of-load regulation fidelity in space-constrained portable systems.
Availability
MAX6476TA30BD3+ is available at Aetrix Electronics and suitable for handheld medical instruments, USB-C power delivery accessories, industrial wireless sensor nodes, and low-power IoT gateways requiring stable component supply with full lifecycle support.
Supply support for MAX6476TA30BD3+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, automotive, and communications applications.
MAX6476TA30BD3+ belongs to the MAX6469–MAX6484 family of LDOs with integrated microprocessor reset - engineered specifically for battery-powered portable equipment needing compact, low-quiescent-power, and fault-resilient power supervision.
FAQ
What is the exact reset threshold voltage for MAX6476TA30BD3+?
The MAX6476TA30BD3+ has a reset threshold of 92.5% of its nominal 3.0V output, equaling 2.775V. This corresponds to the "A" suffix in the ordering guide, indicating -7.5% tolerance. The device asserts RESET when the FB pin voltage falls below this level and holds it low for at least 150ms after recovery, as specified by the D3 timeout code.
Can MAX6476TA30BD3+ be used without connecting the FB pin?
No - the MAX6476TA30BD3+ requires the FB pin to be connected to the load's VCC node (e.g., microprocessor power rail) to function correctly. Unlike SET-based variants, it does not have internal feedback resistors; leaving FB floating or grounded will prevent proper regulation and may cause output instability or failure to start.
What is the maximum input voltage rating for MAX6476TA30BD3+?
The absolute maximum input voltage for MAX6476TA30BD3+ is +7V, as specified in the Absolute Maximum Ratings table. However, the recommended operating range is 2.5V to 5.5V. Exceeding 5.5V risks violating thermal limits and exceeding the 1951mW maximum power dissipation of the TDFN package, especially at high ambient temperatures.
Does MAX6476TA30BD3+ support external NPN transistor boosting?
Yes - the MAX6476TA30BD3+ is explicitly designed for external NPN transistor use via its FB pin. When paired with an NPN pass transistor, total output current scales as IOUT(TOTAL) = 300mA × (β + 1), where β is the transistor's DC current gain. The datasheet provides layout guidance and power dissipation calculations for safe implementation.
Is the exposed pad (EP) on MAX6476TA30BD3+ electrically connected?
Yes - the exposed pad (EP) on MAX6476TA30BD3+ is internally connected to GND and must be soldered to the PCB ground plane. It serves dual roles: providing a low-thermal-resistance path from die to board (critical for power dissipation) and completing the GND electrical connection. Leaving EP unconnected violates thermal specifications and risks junction overheating above +150°C.
MAX6476TA30BD3+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Adjustable (Fixed)
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V (3V)
- Voltage - Output (Max):
- 5.5V
- Voltage Dropout (Max):
- 0.19V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 136 µA
- Current - Supply (Max):
- 96 µA
- PSRR:
- -
- Control Features:
- Reset, Shutdown
- Protection Features:
- Over Current, Over Temperature, Reverse Polarity, Short Circuit
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TDFN (3x3)
MAX6476TA30BD3+ FAQ
1.How can I place an order for MAX6476TA30BD3+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX6476TA30BD3+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX6476TA30BD3+ reliable?
The price and inventory of MAX6476TA30BD3+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX6476TA30BD3+ is usually 5 days.
3.What payment methods are accepted for MAX6476TA30BD3+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX6476TA30BD3+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX6476TA30BD3+?
MAX6476TA30BD3+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX6476TA30BD3+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX6476TA30BD3+?
For technical support, including MAX6476TA30BD3+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX6476TA30BD3+ requirements.
6.How does Aetrix verify that MAX6476TA30BD3+ is sourced from the original manufacturer or authorized distributors?
All MAX6476TA30BD3+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX6476TA30BD3+ meets industry standards.
7.What is the process for return or replacement of MAX6476TA30BD3+?
All MAX6476TA30BD3+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX6476TA30BD3+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX6476TA30BD3+ part is unused and in its original packaging.
Return procedure for MAX6476TA30BD3+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX6476TA30BD3+ Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

