Analog Devices Inc./Maxim Integrated MAX6476TA30BD3
- Part No.:
- MAX6476TA30BD3
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
MAX6476TA30BD3.pdf
- Description:
- IC REG LINEAR LDO 300MA
- Quantity:
- Payment:

- Shipping:

Inventory:1,737
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX6476TA30BD3 from Maxim Integrated is a 3.0V fixed-output, 300mA low-dropout linear regulator with integrated microprocessor reset circuit, active-low push-pull RESET output, 12.5% reset threshold accuracy, and 150ms minimum reset timeout. It features 82µA quiescent current, 114mV dropout at 300mA load, and shutdown capability reducing supply current to 0.1µA. Designed for battery-powered portable electronics requiring reliable power sequencing and brownout protection.
For engineers reviewing the MAX6476TA30BD3 datasheet, MAX6476TA30BD3 pinout, MAX6476TA30BD3 application, or MAX6476TA30BD3 equivalent, key selection considerations include its 3.0V fixed output, TDFN-8 package with exposed pad, remote feedback (FB) pin enabling external NPN transistor boost, and compatibility with microprocessor supply tolerance monitoring under -12.5% VOUT deviation.
Technical Context
The MAX6476TA30BD3 integrates a precision LDO regulator core with a dedicated reset supervisor sharing the same reference voltage. Its FB pin connects directly to the external load (e.g., processor VCC), enabling true remote sensing to compensate for PCB trace IR drop - a critical feature for high-current or long-trace applications.
Reset assertion occurs when FB falls below 87.5% of nominal VOUT (i.e., 2.625V for 3.0V output), with guaranteed 150ms minimum timeout after recovery. The device uses an active-low SHDN input for ultra-low-power shutdown (0.1µA typ), and includes thermal shutdown at +180°C with 20°C hysteresis, plus reverse current protection limiting OUT-to-IN leakage to 0.01µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.0V ±2.7% over -40°C to +85°C - ensures stable core logic supply for 3.0V microcontrollers and peripherals. |
| Max Output Current | 300mA guaranteed - sufficient to power mid-complexity SoCs or multiple digital ICs without external pass devices. |
| Dropout Voltage | 114mV at 300mA - enables operation from 3.114V input, supporting single-cell Li-ion or triple-alkaline battery systems down to end-of-life. |
| Quiescent Current | 82µA typical - extends battery life in always-on or low-duty-cycle portable instruments. |
| Reset Threshold | -12.5% VOUT (87.5% of 3.0V = 2.625V) - meets standard microprocessor supply tolerance requirements for clean boot and brownout recovery. |
| Reset Timeout | 150ms minimum - provides adequate time for clock stabilization and memory initialization before processor release. |
| Shutdown Current | 0.1µA typical - enables deep-sleep modes in handheld devices with zero-load standby power budgets. |
Pinout & Package
MAX6476TA30BD3 is housed in an 8-pin TDFN-EP (3mm × 3mm) package with exposed thermal pad (EP), optimized for compact, thermally demanding portable designs. The EP must be soldered to a PCB ground plane for effective heat dissipation and electrical grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 IN | Regulator Input | Accepts 2.5V–5.5V input; requires 0.1µF bypass capacitor to GND for stability and noise suppression. |
| 2 GND | Ground / Thermal Pad Anchor | Primary return path and thermal conduction interface; must connect to large copper area for junction temperature control. |
| 3 SHDN | Active-Low Shutdown Control | Pulling low disables regulator and reduces total supply current to ≤0.1µA; connect to VIN for normal operation. |
| 4 RESET | Active-Low Push-Pull Reset Output | Drives µP reset pin directly; asserts low during power-up, brownout, or shutdown; no external pullup required. |
| 5 FB | Remote Feedback Sense | Connects to load VCC point to compensate for PCB trace voltage drop; enables accurate regulation at point-of-load. |
| 6 OUT | Regulator Output | Delivers regulated 3.0V; requires ≥3.3µF low-ESR ceramic capacitor to GND for transient response and stability. |
| EP | Exposed Thermal Pad | Internally connected to GND; must be soldered to PCB ground plane to achieve specified thermal resistance (θJA = 41°C/W). |
Key Features
| Feature | Design Value |
|---|---|
| Remote Feedback (FB) Pin | Enables direct connection to processor VCC rail, eliminating regulation error from PCB trace resistance - essential for >100mA loads on non-ideal layouts. |
| 12.5% Reset Threshold Accuracy | Guarantees reset assertion before VOUT drops below 2.625V (for 3.0V output), satisfying strict microprocessor supply tolerance specs without external supervision. |
| 150ms Minimum Reset Timeout | Ensures system clocks and memory controllers stabilize before CPU release - prevents boot failures in timing-critical embedded firmware. |
| 0.1µA Shutdown Current | Supports multi-week shelf life in battery-backed devices and enables true zero-power sleep states in IoT edge nodes. |
| Reverse OUT-to-IN Leakage Protection | Limits backfeed current to 0.01µA when external voltage appears at OUT - prevents battery drain or damage during hot-swap or backup power scenarios. |
Applications
| Handheld Medical Instruments | USB-Powered Industrial Sensors |
|---|---|
Use Scenario: Portable blood glucose meters and pulse oximeters powered by single AAA/AA cells with tight battery-life targets. IC Role / Device Role / Timing Role: Primary 3.0V power source and system supervisor - regulates sensor/ADC/microcontroller rails while asserting RESET until stable 3.0V is confirmed. Use Value: 82µA quiescent current extends battery life beyond 12 months; remote FB pin maintains 3.0V accuracy at MCU VCC despite 150mΩ PCB trace resistance. |
Use Scenario: Field-deployable vibration or temperature sensors drawing burst current via USB 2.0 ports. IC Role / Device Role / Timing Role: Local LDO and power-good monitor - converts noisy 5V USB to clean 3.0V and blocks MCU startup until voltage settles within ±2.7%. Use Value: 114mV dropout allows full 300mA delivery even as USB input sags to 3.114V; 150ms RESET timeout accommodates USB enumeration delays before firmware execution. |
| Bluetooth Audio Accessories | Low-Power Digital Cameras |
Use Scenario: Wireless earbuds and headset modules using Li-ion batteries with aggressive discharge curves. IC Role / Device Role / Timing Role: System power manager - supplies 3.0V to Bluetooth SoC and audio codec while providing brownout detection and controlled shutdown. Use Value: SHDN input enables firmware-controlled sleep mode with 0.1µA leakage; thermal shutdown at +180°C protects against enclosure overheating during extended playback. |
Use Scenario: Compact digital cameras with CMOS image sensors and flash LEDs requiring precise 3.0V logic supply. IC Role / Device Role / Timing Role: Main logic rail regulator and boot sequencer - powers image processor, memory, and display controller with synchronized RESET release. Use Value: Push-pull RESET eliminates need for external pullup resistor; 12.5% threshold ensures reliable boot across battery voltage range (4.2V → 3.0V). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO-with-reset applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS79930DRVR | 3.0V fixed LDO only (no integrated reset); 170mV dropout at 200mA; 25µA IQ; SOT-23-5 package. | Requires external reset IC (e.g., TPS3808G18) for supervisor functionality - increases BOM count and layout area. | Select when board space permits discrete supervision and lower quiescent current is prioritized over integration. |
| ADM6315-30ARTZ-RL | Dedicated 3.0V reset supervisor only (no regulation); 1.6V–5.5V supply range; 200ms timeout; SOT-23-3 package. | Cannot replace MAX6476TA30BD3 alone - must pair with separate LDO (e.g., ADM7172ACPZ-3.0-R7) to replicate full functionality. | Select when existing LDO design needs retrofit with robust reset monitoring and minimal footprint addition is required. |
Compared with TPS79930DRVR and ADM6315-30ARTZ-RL, the MAX6476TA30BD3 uniquely combines 3.0V regulation, remote sensing, and -12.5% reset supervision in one 3×3mm TDFN package - reducing component count, PCB area, and power-path complexity in space-constrained portable systems.
Availability
MAX6476TA30BD3 is available at Aetrix Electronics and suitable for handheld medical instruments, USB-powered industrial sensors, Bluetooth audio accessories, and low-power digital cameras requiring stable component supply and long-term production continuity.
Supply support for MAX6476TA30BD3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, automotive, and consumer applications.
The MAX6469–MAX6484 product line was designed specifically for battery-powered portable equipment needing integrated power regulation and microprocessor supervision in minimal footprint - targeting PDA, cellular, and wireless module markets.
FAQ
What output voltage does the MAX6476TA30BD3 deliver, and how is it set?
The MAX6476TA30BD3 delivers a fixed 3.0V output. This value is factory-programmed and cannot be adjusted externally. Unlike adjustable variants in the MAX6469–MAX6484 family, the MAX6476TA30BD3 uses internal feedback resistors - the "30" in the part number explicitly denotes the 3.0V output. No external components are needed to set the voltage; connecting SET (pin 5) to GND is not required or supported for this variant.
How does the FB pin function in the MAX6476TA30BD3, and why is it different from the SET pin?
The FB (Feedback) pin in the MAX6476TA30BD3 connects directly to the external load's VCC node - such as a microcontroller's power rail - enabling true remote voltage sensing. This compensates for IR drop across PCB traces between the regulator output and the load. Unlike the SET pin used in adjustable-output variants, FB is not for configuring output voltage; it is solely for closed-loop regulation at the point-of-load, ensuring the actual load voltage remains at 3.0V ±2.7% regardless of trace resistance.
What is the purpose of the SHDN pin on the MAX6476TA30BD3, and what happens when it is asserted?
The SHDN (Shutdown) pin on the MAX6476TA30BD3 is an active-low control that disables the regulator core when pulled low. When asserted, the pass transistor, reference, and control circuitry power down, reducing total supply current to 0.1µA (typ). The RESET output goes high (deasserted) only after VOUT stabilizes post-shutdown recovery. For normal operation, SHDN must be tied to IN (or a logic-high voltage ≥0.7×VIN); leaving it floating may cause erratic behavior due to noise susceptibility.
Does the MAX6476TA30BD3 provide reverse current protection, and how does it behave if the output voltage exceeds the input?
Yes, the MAX6476TA30BD3 includes reverse current protection. When VOUT exceeds VIN (e.g., during battery swap or supercapacitor hold-up), the internal pass transistor and parasitic diode turn off, limiting OUT-to-IN leakage to 0.01µA (typ). During this condition, RESET remains asserted until VIN exceeds VOUT and VOUT rises above 2.625V (87.5% of 3.0V). This prevents battery back-feeding and supports seamless power-source transitions in backup-power architectures.
What are the thermal limitations and PCB layout requirements for reliable operation of the MAX6476TA30BD3?
The MAX6476TA30BD3 has a thermal shutdown threshold of +180°C with 20°C hysteresis. To maintain safe operation, its exposed pad (EP) must be soldered to a solid PCB ground plane - the datasheet specifies θJA = 41°C/W for the TDFN-8 package only when EP is properly connected. Avoid routing signal traces under the EP area; use ≥4 thermal vias (0.3mm diameter) connecting EP to inner ground layers. For continuous 300mA operation at +85°C ambient, ensure ≥200mm² of 1oz copper connected to EP.
MAX6476TA30BD3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Adjustable (Fixed)
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V (3V)
- Voltage - Output (Max):
- 5.5V
- Voltage Dropout (Max):
- 0.19V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 136 µA
- Current - Supply (Max):
- 96 µA
- PSRR:
- -
- Control Features:
- Reset, Shutdown
- Protection Features:
- Over Current, Over Temperature, Reverse Polarity, Short Circuit
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TDFN (3x3)
MAX6476TA30BD3 FAQ
1.How can I place an order for MAX6476TA30BD3 through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX6476TA30BD3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX6476TA30BD3 reliable?
The price and inventory of MAX6476TA30BD3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX6476TA30BD3 is usually 5 days.
3.What payment methods are accepted for MAX6476TA30BD3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX6476TA30BD3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX6476TA30BD3?
MAX6476TA30BD3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX6476TA30BD3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX6476TA30BD3?
For technical support, including MAX6476TA30BD3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX6476TA30BD3 requirements.
6.How does Aetrix verify that MAX6476TA30BD3 is sourced from the original manufacturer or authorized distributors?
All MAX6476TA30BD3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX6476TA30BD3 meets industry standards.
7.What is the process for return or replacement of MAX6476TA30BD3?
All MAX6476TA30BD3 units undergo pre-shipment inspection (PSI). If there is an issue with MAX6476TA30BD3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX6476TA30BD3 part is unused and in its original packaging.
Return procedure for MAX6476TA30BD3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX6476TA30BD3 Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

