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Analog Devices Inc./Maxim Integrated MAX6686AU75L+

Part No.:
MAX6686AU75L+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Thermostats - Solid State
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixMAX6686AU75L+.pdf
Description:
THERMOSTAT ACT LOW OPEN DR 8UMAX
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,917

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Product details

Overview

MAX6686AU75L+ from Maxim Integrated is a dual-output remote-junction temperature switch using an external diode-connected transistor for sensing. It features factory-programmed +120°C upper trip threshold, pin-selectable lower threshold range of +75°C to +115°C (5°C increments), 1.5°C accuracy, open-drain active-low THIGH and TLOW outputs, and operates from 3.0V to 5.5V with 200µA typical supply current. It is used in CPU thermal shutdown and FPGA overtemperature protection.

For engineers reviewing the MAX6686AU75L+ datasheet, MAX6686AU75L+ pinout, MAX6686AU75L+ application, or MAX6686AU75L+ equivalent, key selection criteria include verified remote-sensing diode interface compatibility, dual independent trip thresholds with hysteresis, open-drain output drive capability, µMAX package footprint constraints, and supply voltage tolerance across industrial temperature range.

Technical Context

The MAX6686AU75L+ integrates a precision remote-junction sensor with two comparators and oversampling-based noise rejection. Its THIGH output asserts low at +120°C with 5°C hysteresis; TLOW asserts low when remote junction temperature exceeds the S1/S2-selected lower threshold within +75°C to +115°C range.

It sources 8–12µA for external diode biasing, uses DXP/DXN differential sensing with mandatory 2200pF filtering capacitor, and requires S1/S2 configuration prior to VDD power-up to lock the lower trip point. Power-on reset triggers at 1.0–2.0V with 50mV hysteresis.

Key Specifications

ParameterValue and Actual Design Meaning
Upper Trip Threshold+120°C factory preset - triggers THIGH logic-low for thermal shutdown at fixed high-temperature limit
Lower Trip Range+75°C to +115°C in 5°C steps - selected via S1/S2 pins for configurable warning or throttling activation
Accuracy±1.5°C - ensures reliable trip point repeatability across -40°C to +125°C ambient
Supply Current200µA typical - enables low-power thermal monitoring in always-on system states
Output TypeOpen-drain, active-low THIGH and TLOW - supports wired-OR logic, level translation up to 5.5V, and pull-up flexibility
Hysteresis5°C typical - prevents output oscillation near trip points during slow thermal transients
Supply Range3.0V to 5.5V - compatible with 3.3V and 5V system rails without regulation

Pinout & Package

MAX6686AU75L+ is housed in an 8-pin µMAX package (3.05mm × 3.05mm × 0.8mm), pin-compatible with industry-standard uSOP-8 footprints and suitable for high-density PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
VDDPower supply input3.0V–5.5V main supply; requires 0.1µF bypass capacitor to GND for stability
GNDGround referenceCommon return path for all internal circuits and external diode bias current
DXPRemote diode anode connectionSources 8–12µA bias current into external PNP base-emitter or NPN collector-base junction
DXNRemote diode cathode connectionSinks matching bias current; must be shorted directly to GND pin to minimize noise coupling
THIGHUpper-threshold alarm outputOpen-drain, active-low - pulls down when remote temperature > +120°C; requires external pull-up
TLOWLower-threshold alarm outputOpen-drain, active-low - pulls down when remote temperature exceeds S1/S2-selected threshold (e.g., +75°C)
S1, S2Lower threshold select inputsDigital inputs (VIL ≤ 0.4V, VIH ≥ 1.8V); set lower trip point before VDD power-up; floating allowed per Table 1

Key Features

FeatureDesign Value
Dual independent trip outputsEnables hierarchical thermal response: early warning (TLOW) and critical shutdown (THIGH) from single sensor interface
Pin-programmable lower thresholdEliminates need for external DAC or microcontroller GPIO to configure trip point - reduces BOM and firmware overhead
Remote diode sensing architectureDirectly monitors die temperature of CPUs, FPGAs, and ASICs with on-chip PNP sensing junctions, not ambient PCB temperature
Integrated noise rejectionOversampling and differential DXP/DXN input reject EMI from switching regulators and high-speed digital traces
Low quiescent current200µA operation allows continuous monitoring in battery-backed or energy-constrained systems without significant power penalty

Applications

CPU Thermal ProtectionFPGA Overtemperature Monitoring

Use Scenario: Real-time monitoring of processor die temperature during high-load compute cycles to prevent thermal throttling or permanent damage.

IC Role / Device Role / Timing Role: Remote-junction temperature switch providing two logic-level alarms - TLOW initiates clock throttling, THIGH forces system reset.

Use Value: Enables deterministic, hardware-based thermal management without software polling or interrupt latency, improving system reliability under transient thermal stress.

Use Scenario: Detecting abnormal junction heating in reconfigurable logic devices during configuration or high-speed I/O operation.

IC Role / Device Role / Timing Role: Dual-threshold comparator interfacing with FPGA's on-die PNP diode to assert dedicated THERMAL_ALERT# and HARD_RESET# signals.

Use Value: Prevents configuration corruption and timing violations by triggering hardware-level mitigation before silicon exceeds safe operating limits.

Multichip Module (MCM) Thermal ControlIndustrial Motor Drive Inverter Protection

Use Scenario: Coordinating thermal safety across stacked ICs (e.g., processor + memory + PMIC) sharing a common thermal mass.

IC Role / Device Role / Timing Role: Centralized remote-sensing switch generating shared TLOW (warning) and THIGH (shutdown) signals routed to multiple subsystem controllers.

Use Value: Reduces component count versus discrete sensors per die and ensures synchronized response across heterogeneous dies in tight thermal coupling.

Use Scenario: Monitoring IGBT or SiC MOSFET junction temperature in motor control inverters where heatsink temperature lags actual die temperature.

IC Role / Device Role / Timing Role: Direct attachment to power device's integrated sensing diode to trigger gate driver disable (TLOW) and system isolation relay (THIGH).

Use Value: Provides faster, more accurate overtemperature response than thermistor-based heatsink monitoring, preventing catastrophic failure during short-circuit events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output remote-junction temperature switch applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX6685AU75L+CMOS push-pull, active-high TLOW output vs. MAX6686AU75L+'s open-drain active-low TLOWRequires different pull-up/pull-down logic design; incompatible with wired-OR alarm bus architecturesSelect MAX6686AU75L+ when TLOW must share a common open-drain bus with other system alarms
LM95235CIMM/NOPBSerial SMBus/I²C output with 11-bit temperature readback vs. MAX6686AU75L+'s dual comparator outputsProvides programmable thresholds and real-time temperature data but adds MCU dependency and communication overheadSelect MAX6686AU75L+ when deterministic, zero-latency hardware alarms are required without host processor involvement

Compared with MAX6685AU75L+, the MAX6686AU75L+ offers consistent open-drain polarity for both outputs-simplifying alarm bus design-while LM95235CIMM/NOPB trades immediate hardware response for configurability and telemetry, making it unsuitable for fail-safe shutdown paths.

Availability

MAX6686AU75L+ is available at Aetrix Electronics and suitable for CPU thermal protection, FPGA overtemperature monitoring, and multichip module thermal control requiring stable component supply across extended product lifecycles.

Supply support for MAX6686AU75L+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog and mixed-signal ICs for industrial, computing, and communications applications, with emphasis on power management, sensing, and interface solutions.

The MAX6686AU75L+ belongs to the MAX6685/MAX6686 family of remote-junction temperature switches engineered for hardware-based thermal safety in high-performance digital systems where software-independent, deterministic trip response is critical.

FAQ

What is the exact upper temperature trip threshold for MAX6686AU75L+?

The MAX6686AU75L+ has a factory-programmed upper trip threshold of +120°C. This value is fixed and non-adjustable. THIGH asserts active-low when the remote junction temperature exceeds this point, with 5°C hysteresis ensuring stable deassertion below +115°C. The +125°C variant is designated MAX6686AU75H+, not MAX6686AU75L+.

How do I configure the lower trip threshold for MAX6686AU75L+?

To configure the lower trip threshold for MAX6686AU75L+, set the logic states of S1 and S2 pins before applying VDD power. For the +75°C to +115°C range, valid combinations include S1=GND/S2=GND (+75°C), S1=GND/S2=FLOAT (+80°C), up to S1=VDD/S2=VDD (+115°C), as defined in Table 1 of the datasheet. Configuration after power-up is ignored.

Can MAX6686AU75L+ interface directly with a CPU's on-die thermal diode?

Yes, MAX6686AU75L+ is specifically designed to interface with CPU on-die thermal diodes. It supports PNP substrate diodes (base-to-GND, emitter-to-DXP, collector-to-DXN) and requires no external components beyond the 2200pF capacitor across DXP/DXN. Compatibility is confirmed for Intel and AMD processors with standard remote diode interfaces.

What is the recommended decoupling for MAX6686AU75L+ VDD pin?

The MAX6686AU75L+ requires a 0.1µF ceramic capacitor placed as close as possible between VDD and GND pins. This capacitor stabilizes the internal reference and comparator circuitry. Additional bulk capacitance may be added upstream, but the 0.1µF local bypass is mandatory for specified accuracy and noise immunity per Maxim's layout guidelines.

Does MAX6686AU75L+ support remote diode sensing with discrete transistors?

Yes, MAX6686AU75L+ supports discrete diode-connected transistors such as 2N3904, CMPT3904, or SST3904, provided the base is shorted to collector to form a two-terminal diode. These must be mounted thermally adjacent to the target IC. Diodes without matched P-N junction characteristics (e.g., standard 1N4148) are not supported and will cause significant measurement error.

MAX6686AU75L+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tube
Product Status:
Active
Trip Temperature Threshold:
Hot
Switching Temperature:
75°C ~ 115°C, 120°C
Accuracy:
±1.5°C
Current - Output (Max):
20mA
Output Type:
Open Drain
Output:
Active Low
Output Function:
OverTemp, /OverTemp
Selectable Hysteresis:
No
Features:
Selectable Trip Point
Voltage - Supply:
3 V ~ 5.5 V
Current - Supply:
200µA
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
8-uMAX/uSOP

MAX6686AU75L+ FAQ

1.How can I place an order for MAX6686AU75L+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX6686AU75L+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX6686AU75L+ reliable?

The price and inventory of MAX6686AU75L+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX6686AU75L+ is usually 5 days.

3.What payment methods are accepted for MAX6686AU75L+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX6686AU75L+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX6686AU75L+?

MAX6686AU75L+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX6686AU75L+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX6686AU75L+?

For technical support, including MAX6686AU75L+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX6686AU75L+ requirements.

6.How does Aetrix verify that MAX6686AU75L+ is sourced from the original manufacturer or authorized distributors?

All MAX6686AU75L+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX6686AU75L+ meets industry standards.

7.What is the process for return or replacement of MAX6686AU75L+?

All MAX6686AU75L+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX6686AU75L+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX6686AU75L+ part is unused and in its original packaging.

Return procedure for MAX6686AU75L+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MAX6686AU75L+ Tags

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