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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Voltage Regulators - DC DC Switching Regulators

Analog Devices Inc./Maxim Integrated MAX77541AAWV+

Name: MAX77541AAWV+
Brand: Analog Devices Inc./Maxim Integrated
SKU: MAX77541AAWV+
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MAX77541AAWV+

Manufacturer:: Analog Devices Inc./Maxim Integrated

Category:: Voltage Regulators - DC DC Switching Regulators

Package:: 30-WFBGA, WLBGA

Datasheet:: MAX77541AAWV+.pdf

Description:: IC REG BUCK ADJ 3A/3A DL 30WLP

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Product details

Overview

MAX77541AAWV+ from Analog Devices is a dual-phase, phase-configurable buck converter IC for single-cell Li+ and 5VDC systems. It delivers up to 6A total output (2×3A in 1Φ mode or 1×6A in 2Φ mode), supports 0.3V–5.2V programmable output voltage via I²C or resistor presets, and achieves 91% peak efficiency at 3.8V_IN/1.1V_OUT. It serves as the primary power delivery IC for FPGA and microprocessor core rails in space-constrained portable electronics.

For engineers reviewing the MAX77541AAWV+ datasheet, MAX77541AAWV+ pinout, MAX77541AAWV+ application, or MAX77541AAWV+ equivalent, key selection criteria include its adaptive COT current-mode control, ±0.5% V_OUT accuracy at 25°C, 0.5/1.0/1.6MHz selectable switching frequency, spread-spectrum EMI reduction, and dual independent enable/POK/FPWM pins per buck phase.

Technical Context

The MAX77541AAWV+ implements an adaptive constant-on-time (COT) current-mode control architecture with independent phase management, enabling seamless transition between 1Φ+1Φ (dual 3A outputs) and 2Φ (single 6A output) configurations. Its internal high-side and low-side MOSFETs feature R_DS(on) of 16–32mΩ and 10–20mΩ respectively, supporting dropout operation up to 98% duty cycle.

Built-in ADC monitors SYS voltage, output voltages, and junction temperature; all protections-including UVLO (2.2V rising), thermal shutdown (+165°C), short-circuit, and overcurrent-trigger automatic fault response. I²C interface (1.8V logic compatible) enables full configuration of soft-start/stop slew rates, inductor peak current limits (1.6–5.2A), and dynamic voltage scaling.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.2V to 5.5V - Supports direct connection to single-cell Li+ batteries (2.7–4.4V) and 5V DC rails without pre-regulation.
Output Configuration	Configurable 1Φ+1Φ (2×3A) or 2Φ (1×6A) - Enables flexible rail partitioning or high-current consolidation per system demand.
V_OUT Accuracy	±0.5% at 25°C (default V_OUT) - Ensures tight regulation for sensitive processor cores and memory interfaces.
Peak Efficiency	91% at 3.8V_IN/1.1V_OUT/1.6MHz - Minimizes thermal load and extends battery runtime in portable devices.
Switching Frequency	0.5 / 1.0 / 1.6 MHz - Selectable nominal frequency balances EMI, inductor size, and light-load efficiency.
Package	30-bump WLP (2.51mm × 2.31mm × 0.7mm) - Ultra-compact footprint ideal for VR headsets and gaming handhelds.
Protection Features	UVLO, thermal shutdown (+165°C), short-circuit, and overcurrent - Autonomous fault handling eliminates need for external supervision circuitry.

Pinout & Package

MAX77541AAWV+ is packaged in a 30-bump Wafer-Level Package (WLP), outline number 21-100479, with 0.4mm pitch and bottom-side solder bumps. The package measures 2.51mm × 2.31mm × 0.7mm and features exposed thermal pad on underside for enhanced heat dissipation.

Pin/Terminal	Circuit Role	Design Meaning
IN1 / IN2	Input power supply for Buck 1 / Buck 2	Dual independent input pins allow separate sourcing (e.g., battery + USB) or shared input with local decoupling.
LX1 / LX2	Power switch node for Buck 1 / Buck 2	Connects to external inductor; requires low-inductance layout to minimize switching noise and losses.
SNS1 / SNS2	Output voltage feedback sense for Buck 1 / Buck 2	High-impedance inputs for precision resistive divider setting; supports remote sensing for improved load regulation.
EN1 / EN2	Hardware enable for Buck 1 / Buck 2	Asynchronous active-high control; allows independent power sequencing without I²C interaction.
POK1 / POK2	Power-good status output for Buck 1 / Buck 2	Open-drain signal confirms regulated output within ±5% tolerance; used for system power sequencing validation.
FPWM1 / FPWM2	Forced PWM mode control for Buck 1 / Buck 2	Disables SKIP/LP-SKIP modes to enforce fixed-frequency operation-critical for noise-sensitive analog subsystems.
SCL / SDA	I²C serial interface clock/data	1.8V-tolerant, 400kHz standard-mode interface for full register-level configuration and telemetry readback.
IRQB	Interrupt request output (active-low)	Combines thermal warning, fault, and ADC conversion completion into single prioritized interrupt line.
SEL1 / SEL2	Default V_OUT selection straps	Resistor-programmed pins set initial output voltages before I²C initialization; eliminate boot-time configuration dependency.
RSEL1 / RSEL2	Phase configuration straps	Determine startup mode: 1Φ+1Φ (dual output) or 2Φ (single high-current output) without firmware involvement.

Key Features

Feature	Design Value
Adaptive COT current-mode control	Delivers fast transient response (<10µs recovery) and stable operation across wide VIN/VOUT/load ranges without external compensation.
Spread-spectrum modulation	Reduces peak EMI by >10dB across 100kHz–1GHz band-enables compliance with CISPR-22 Class B without added shielding or filtering.
Programmable inductor peak current limit	Four settings (1.6–5.2A) allow optimization of inductor size vs. ripple current trade-off for minimal solution area (<55mm² with 2520 inductors).
Prebiased startup & active output discharge	Enables safe hot-insertion into precharged rails and rapid power-down sequencing-prevents backfeed and ensures deterministic state transitions.
Dedicated thermal monitoring ADC	On-die junction temperature measurement (±3°C accuracy) feeds real-time thermal warnings (120°C/140°C) and automatic shutdown at 165°C.

Applications

Gaming Console Core Rail	VR/AR Headset SoC Power
Use Scenario: Powers application processor and GPU cores in handheld gaming consoles requiring dynamic voltage scaling during gameplay. IC Role / Device Role / Timing Role: Primary multi-phase buck regulator delivering tightly regulated 0.8V–1.2V core voltage with <10µs transient response to load steps. Use Value: Adaptive COT control and 91% peak efficiency extend battery life while maintaining thermal envelope under sustained 4A+ loads.	Use Scenario: Supplies SoC and display interface in compact VR/AR headsets where board area and thermal density are critical constraints. IC Role / Device Role / Timing Role: Dual 3A buck converter providing independent 0.9V CPU and 1.1V GPU rails with hardware-enforced sequencing via EN1/EN2. Use Value: 30-bump WLP package (2.51mm × 2.31mm) and <55mm² total solution size meet aggressive form factor requirements.
FPGA Core Voltage Regulation	Network Switch ASIC Supply
Use Scenario: Generates configurable core voltage for mid-range FPGAs in portable test equipment and edge AI accelerators. IC Role / Device Role / Timing Role: I²C-programmable buck converter enabling dynamic voltage/frequency scaling (DVFS) based on real-time workload. Use Value: ±0.5% V_OUT accuracy and programmable soft-start slew rate ensure reliable FPGA configuration and avoid inrush-induced brownouts.	Use Scenario: Powers packet processing ASICs in fanless enterprise network switches operating in ambient temperatures up to 70°C. IC Role / Device Role / Timing Role: High-efficiency 6A single-phase buck delivering 1.0V core rail with thermal shutdown and continuous junction temperature monitoring. Use Value: Integrated thermal protection and 36.64°C/W θ_JA (FC2QFN) enable robust operation without forced airflow or heatsinks.

Gaming Console Core Rail

VR/AR Headset SoC Power

Use Scenario: Powers application processor and GPU cores in handheld gaming consoles requiring dynamic voltage scaling during gameplay.

IC Role / Device Role / Timing Role: Primary multi-phase buck regulator delivering tightly regulated 0.8V–1.2V core voltage with <10µs transient response to load steps.

Use Value: Adaptive COT control and 91% peak efficiency extend battery life while maintaining thermal envelope under sustained 4A+ loads.

Use Scenario: Supplies SoC and display interface in compact VR/AR headsets where board area and thermal density are critical constraints.

IC Role / Device Role / Timing Role: Dual 3A buck converter providing independent 0.9V CPU and 1.1V GPU rails with hardware-enforced sequencing via EN1/EN2.

Use Value: 30-bump WLP package (2.51mm × 2.31mm) and <55mm² total solution size meet aggressive form factor requirements.

FPGA Core Voltage Regulation

Network Switch ASIC Supply

Use Scenario: Generates configurable core voltage for mid-range FPGAs in portable test equipment and edge AI accelerators.

IC Role / Device Role / Timing Role: I²C-programmable buck converter enabling dynamic voltage/frequency scaling (DVFS) based on real-time workload.

Use Value: ±0.5% V_OUT accuracy and programmable soft-start slew rate ensure reliable FPGA configuration and avoid inrush-induced brownouts.

Use Scenario: Powers packet processing ASICs in fanless enterprise network switches operating in ambient temperatures up to 70°C.

IC Role / Device Role / Timing Role: High-efficiency 6A single-phase buck delivering 1.0V core rail with thermal shutdown and continuous junction temperature monitoring.

Use Value: Integrated thermal protection and 36.64°C/W θ_JA (FC2QFN) enable robust operation without forced airflow or heatsinks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-phase buck converter applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TPS6521905RGER	Single 6A output only; no 1Φ+1Φ dual-rail mode; lower 87% peak efficiency at 1.1V_OUT; lacks spread-spectrum EMI reduction.	Best suited for fixed-output, high-current ASIC supplies-not ideal for systems needing independent rail control or stringent EMI limits.	Select when cost sensitivity outweighs flexibility and EMI performance; verify thermal margin due to higher quiescent current (450µA vs. 300µA LP-SKIP).
ISL9122AIRZ-T	Supports 1Φ+1Φ but limited to 2.5A per phase; no integrated ADC; only 0.8/1.2MHz frequency options; no active output discharge.	Appropriate for lower-power SoCs or legacy designs where telemetry and advanced sequencing are not required.	Choose for simpler designs lacking DVFS or thermal monitoring needs; confirm PCB layout supports larger 2.5A inductors and higher ripple.

Compared with TPS6521905RGER and ISL9122AIRZ-T, the MAX77541AAWV+ uniquely combines phase configurability, spread-spectrum EMI suppression, integrated thermal/ADC telemetry, and ultra-compact WLP packaging-making it optimal for next-generation portable computing platforms demanding both performance and miniaturization.

Availability

MAX77541AAWV+ is available at Aetrix Electronics and suitable for gaming consoles, VR/AR headsets, FPGA-based edge devices, and fanless network switches requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX77541AAWV+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and consumer markets.

The MAX77541AAWV+ belongs to Analog Devices' MAX® Power Management family, engineered specifically for high-efficiency, space-constrained portable electronics requiring multi-rail flexibility, low-noise operation, and intelligent thermal management.

FAQ

What is the maximum continuous output current supported by the MAX77541AAWV+ in dual-phase (2Φ) mode?

The MAX77541AAWV+ supports up to 6A continuous output current in dual-phase (2Φ) mode, with thermal derating applied above +105°C junction temperature. At ambient +70°C on a four-layer board, the 30 WLP package sustains 6A with proper layout and airflow; the 24 FC2QFN variant offers lower thermal resistance (36.64°C/W) for higher sustained loads in thermally constrained environments. Full 6A operation requires adherence to recommended copper pour and thermal vias per Application Note 1891.

Does the MAX77541AAWV+ support dynamic voltage scaling (DVS) via I²C interface?

Yes, the MAX77541AAWV+ supports dynamic voltage scaling through its high-speed I²C interface. Registers allow real-time adjustment of output voltage (0.3V–5.2V range), soft-start/stop slew rates, switching frequency, and phase configuration-all without interrupting power delivery. DVS is commonly used in FPGA and application processor systems to reduce power during low-activity states, and the MAX77541AAWV+ implements this with <50µs register update latency and monotonic voltage transitions to prevent glitches.

How does the MAX77541AAWV+ handle thermal protection, and what are the trip thresholds?

The MAX77541AAWV+ integrates three-tier thermal protection: Thermal Warning 1 triggers at +120°C (15°C hysteresis), Thermal Warning 2 at +140°C, and Thermal Shutdown (TSHDN) at +165°C (also with 15°C hysteresis). These thresholds are measured via on-die junction temperature sensor with ±3°C accuracy. When TSHDN activates, the device disables both buck phases and holds in shutdown until TJ falls below +150°C. The IRQB pin asserts low to signal thermal events, allowing host processors to log faults or throttle workloads preemptively.

Can the MAX77541AAWV+ operate with prebiased outputs during startup?

Yes, the MAX77541AAWV+ supports prebiased startup-meaning it can safely begin regulation even when the output capacitor is already charged to a nonzero voltage. This prevents reverse current flow and avoids damaging downstream components during hot-plug or multi-rail sequencing scenarios. Additionally, the device provides active output discharge via internal 200Ω pull-down transistors (configurable per rail), ensuring rapid, controlled discharge of V_OUT capacitors during shutdown-critical for meeting strict power-state timing requirements in portable systems.

What are the key differences between the 30 WLP and 24 FC2QFN packages for the MAX77541AAWV+?

The MAX77541AAWV+ is offered in two packages: 30-bump WLP (2.51mm × 2.31mm × 0.7mm) and 24-pin FC2QFN (3mm × 3mm × 0.75mm). The WLP provides superior board-area efficiency and lower profile-ideal for ultra-thin VR headsets-but has higher thermal resistance (49.38°C/W). The FC2QFN offers better thermal performance (36.64°C/W) and easier reworkability, making it preferred for higher-power or thermally demanding applications like network switches. Both packages share identical pin functions and electrical specifications.

MAX77541AAWV+ Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc./Maxim Integrated

Series:: -

Package/Case:: 30-WFBGA, WLBGA

Packaging:: Strip

Product Status:: Active

Function:: Step-Down

Output Configuration:: Positive

Topology:: Buck

Output Type:: Adjustable

Number of Outputs:: 2

Voltage - Input (Min):: 2.2V

Voltage - Input (Max):: 5.5V

Voltage - Output (Min/Fixed):: 0.3V

Voltage - Output (Max):: 5.2V

Current - Output:: 3A, 3A

Frequency - Switching:: 500kHz, 1MHz, 1.6MHz

Synchronous Rectifier:: No

Operating Temperature:: -40°C ~ 125°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 30-WLP (2.51x2.31)

MAX77541AAWV+ FAQ

1.How can I place an order for MAX77541AAWV+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX77541AAWV+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX77541AAWV+ reliable?

The price and inventory of MAX77541AAWV+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77541AAWV+ is usually 5 days.

3.What payment methods are accepted for MAX77541AAWV+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77541AAWV+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX77541AAWV+?

MAX77541AAWV+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX77541AAWV+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX77541AAWV+?

For technical support, including MAX77541AAWV+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77541AAWV+ requirements.

6.How does Aetrix verify that MAX77541AAWV+ is sourced from the original manufacturer or authorized distributors?

All MAX77541AAWV+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77541AAWV+ meets industry standards.

7.What is the process for return or replacement of MAX77541AAWV+?

All MAX77541AAWV+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX77541AAWV+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX77541AAWV+ part is unused and in its original packaging.

Return procedure for MAX77541AAWV+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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