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Analog Devices Inc./Maxim Integrated MAX77711CEWB+T
- Part No.:
- MAX77711CEWB+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Special Purpose Regulators
- Package:
- 64-WFBGA, WLBGA
- Datasheet:
-
MAX77711CEWB+T.pdf
- Description:
- 4-PHASE-CONFIGURABLE BUCK REGULA
- Quantity:
- Payment:
- Shipping:
Inventory:4,647
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Product details
Overview
The MAX77711CEWB+T from Analog Devices is a quad-phase, 3A/phase configurable buck regulator with integrated 300mA pMOS LDO, designed for 2-cell Li+/Li-ion battery-powered systems (2.3V–10V input). It supports programmable output voltages from 0.25V to 5.2V via I²C, offers phase configurations up to 4Φ (12A total), and delivers up to 94% peak efficiency at 3.3VOUT/7.4VIN. It is used in high-performance portable imaging and embedded computing platforms requiring multi-rail, dynamically scalable power.
For engineers reviewing the MAX77711CEWB+T datasheet, MAX77711CEWB+T pinout, MAX77711CEWB+T application, or MAX77711CEWB+T equivalent, key selection considerations include its 64-bump WLP package, I²C-programmable phase grouping (e.g., 2Φ+2Φ or 3Φ+1Φ), soft-start/stop and DVS slew control, pseudo-random spread-spectrum EMI suppression, and dedicated GPIO-based buck/LDO enable and Power-OK monitoring.
Technical Context
The MAX77711CEWB+T implements adaptive off-time control per buck phase and supports flexible power sequencing via hardware (GPIO) or software (I²C) triggers. Its four independent switching phases can be grouped into five distinct output configurations - including (1+1+1+1)Φ, (2+1+1)Φ, and 4Φ - each with independent feedback assignment and voltage programming.
It integrates a dedicated 300mA pMOS LDO (VLDO output: 0.4V–1.975V) with hardware/software enable and flexible sequencing, alongside six multi-function GPIOs supporting buck enable, DVS, FPWM, and Power-OK assertion. Protection includes hard/soft short-circuit detection, thermal shutdown, and UVLO on SYS input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.3V to 10V - supports direct connection to 2-cell Li+/Li-ion batteries (up to ~8.4V fully charged) and extended-input industrial rails. |
| Output Voltage Range | 0.25V–5.2V - low-range (0.25V–1.3V @ 5mV steps) enables precise core voltage scaling for FPGAs/ASICs; high-range (1V–5.2V @ 20mV steps) suits I/O and peripheral rails. |
| Max Output Current | 12A (4Φ) - achieved by combining all four 3A phases into a single output; other groupings yield 9A (3Φ+1Φ), 6A (2Φ+2Φ), or 3A per independent output. |
| Switching Frequency | 1MHz nominal per phase - enables compact 2520 inductor use and balances efficiency vs. EMI; pseudo-random spread-spectrum modulation reduces peak EMI by >10dB. |
| LDO Output | 300mA pMOS LDO (VLDO) - provides low-noise auxiliary rail (0.4V–1.975V); only present in MAX77711 variant (not MAX77511). |
| Control Interface | I²C serial interface (7-bit address options) - enables full configuration of output voltages, phase grouping, soft-start/stop times, DVS slew rates, and protection thresholds. |
| Package | 64-bump wafer-level package (WLP), 3.54mm × 3.54mm - ultra-compact footprint optimized for space-constrained portable designs like DSLR cameras and robotics modules. |
Pinout & Package
The MAX77711CEWB+T is housed in a 64-bump, 0.4mm-pitch wafer-level package (WLP) with outline code W643D3+1, measuring 3.54mm × 3.54mm. Bump pitch is 0.4mm; bump diameter is 0.20mm nominal. Thermal resistance θJA is 38.2°C/W on a four-layer board.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LX1–LX4 | Phase switch node outputs | Drive external inductors; each supports 3A continuous current; internal high-side MOSFET + synchronous rectifier per phase. |
| IN1/IN2, IN3/IN4 | Input power rails | Dual-input structure allows independent or shared sourcing for phase groups; supports up to 3.2A RMS per input pair. |
| SNS1+ / SNS1− … SNS4+ / SNS4− | Current-sense differential inputs | Enable per-phase output current monitoring and short-circuit protection; require Kelvin-connected sense resistors. |
| VOUT1–VOUT4 | Regulated output voltage nodes | Each corresponds to a configurable buck output; voltage set via I²C register; feedback resistors optional (internal DAC-based regulation). |
| PHCFG0 / PHCFG1 | Hardware phase configuration pins | Set initial phase grouping at power-up (e.g., 4Φ, 2Φ+2Φ); overridden by I²C after boot if needed. |
| GPIO1–GPIO6 | Multi-function general-purpose I/O | Configurable as buck enable, DVS control, FPWM mode select, or Power-OK output; default factory settings defined in OTP. |
| nIRQ | Open-drain interrupt output | Asserts on fault conditions (thermal, short, UVLO); active-low; requires external pull-up; supports I²C polling alternative. |
| SDA / SCL | I²C bidirectional data/clock | Standard 7-bit addressing (configurable via ADR pin); supports 400kHz fast-mode; enables full runtime reconfiguration. |
| VLDO | LDO regulated output | 300mA pMOS LDO output (0.4V–1.975V); only available on MAX77711; enabled via GPIO or I²C; includes soft-start and overcurrent protection. |
| INLDO | LDO input supply | Accepts 1.25V–5.5V input; decoupled separately from main buck inputs to minimize noise coupling to sensitive analog rails. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable quad-phase architecture | Enables dynamic allocation of 3A phases across 1–4 outputs (e.g., 4Φ for CPU core, 2Φ+1Φ+1Φ for SoC + memory + I/O), reducing component count vs. discrete regulators. |
| Pseudo-random spread-spectrum modulation | Reduces EMI peak energy by spreading switching frequency ±12.5% around 1MHz center, easing compliance with CISPR-22 Class B radiated emissions limits. |
| Flexible power sequencer (FPS) | Hardware- and software-controlled startup/shutdown timing with programmable slot delays (0.625–5ms), enabling safe ramp-up of multiple voltage rails in FPGA or ASIC systems. |
| Integrated 300mA pMOS LDO | Provides low-noise, fast-transient auxiliary rail (e.g., for sensor bias or reference voltage) without requiring external LDO IC; supports independent enable and sequencing. |
| Per-phase current monitoring | Four differential sense inputs allow real-time current readback and adaptive load balancing; enables firmware-based thermal derating and fault localization. |
Applications
| DSLR & Mirrorless Cameras | Embedded Microprocessors & FPGAs |
|---|---|
Use Scenario: High-resolution image capture with rapid autofocus, burst shooting, and 4K video encoding. IC Role / Device Role / Timing Role: Primary power management IC delivering dynamically scaled core (VDD), memory (VDDQ), and I/O (VCCIO) rails under real-time processor load changes. Use Value: Phase grouping (e.g., 3Φ+1Φ) enables 9A core rail for image signal processor bursts while maintaining independent 3A memory rail, minimizing voltage droop during frame capture. | Use Scenario: Powering heterogeneous SoCs with multiple voltage domains (CPU, GPU, DDR, PCIe). IC Role / Device Role / Timing Role: Configurable multi-output buck supplying tightly regulated, sequenced rails with sub-10mV ripple and <10μs transient response. Use Value: I²C-programmable soft-start/stop and DVS slew rates ensure glitch-free domain power-up and coordinated voltage scaling during DVFS transitions. |
| Notebook Computers & Robots | 2-Cell Li+/Li-ion Portable Equipment |
Use Scenario: Compact, fanless notebooks and mobile robots requiring high-efficiency, thermally robust power delivery. IC Role / Device Role / Timing Role: Central PMIC managing battery-to-load conversion across CPU, display, storage, and motor driver subsystems. Use Value: 94% peak efficiency at 3.3VOUT/7.4VIN and 85% at 1.1VOUT/7.4VIN extends runtime; thermal protection and short-circuit recovery prevent field failures. | Use Scenario: Action cameras, handheld medical devices, and portable test equipment powered by 2-cell Li-ion packs. IC Role / Device Role / Timing Role: Single-chip solution replacing multiple discrete DC-DC converters and LDOs in space- and weight-constrained designs. Use Value: 3.54mm × 3.54mm WLP package reduces PCB area by >40% vs. QFN alternatives; integrated LDO eliminates need for separate auxiliary regulator. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-phase buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX77511CEWB+T | Lacks integrated 300mA LDO; otherwise identical buck architecture, pinout, and I²C register map. | Used where auxiliary LDO rail is provided externally or not required; lower cost and slightly lower quiescent current in standby. | Select MAX77511CEWB+T when system already includes a dedicated LDO or operates without low-noise analog rails. |
| TPS65988DHAR | USB-C PD controller with integrated 3A dual-phase buck (not quad-phase); no LDO; different I²C register structure and GPIO mapping. | Targeted at USB-C host/port power delivery with Type-C interface logic; lacks flexible phase grouping and FPS sequencer. | Choose TPS65988DHAR only for USB-C PD applications requiring native port controller functionality - not as a drop-in replacement. |
Compared with MAX77511CEWB+T and TPS65988DHAR, the MAX77711CEWB+T uniquely combines quad-phase configurability, integrated LDO, and hardware/software-flexible sequencing - making it optimal for non-USB-C, battery-powered systems demanding multi-rail scalability and low-noise auxiliary power.
Availability
The MAX77711CEWB+T is available at Aetrix Electronics and suitable for DSLR/mirrorless cameras, embedded microprocessor power systems, and 2-cell Li+/Li-ion portable equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MAX77711CEWB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and consumer markets.
The MAX77711CEWB+T belongs to Analog Devices' MAX77xxx family of highly integrated, configurable PMICs designed specifically for space-constrained, battery-powered imaging and embedded computing platforms requiring multi-rail, dynamically scalable power delivery.
FAQ
What is the maximum output current capability of the MAX77711CEWB+T?
The MAX77711CEWB+T supports up to 12A total output current by configuring all four 3A phases in parallel (4Φ mode). Other configurations include 9A (3Φ+1Φ), 6A (2Φ+2Φ), and 3A per independent output. Each phase is rated for 3.2A RMS continuous current, and thermal derating applies above +70°C ambient per the 2094mW power dissipation limit.
Does the MAX77711CEWB+T include an integrated LDO, and what are its specifications?
Yes, the MAX77711CEWB+T integrates a 300mA pMOS LDO (VLDO) not present in the MAX77511 variant. Its output voltage is programmable from 0.4V to 1.975V in 25mV steps. It features independent enable control (via GPIO or I²C), soft-start, and overcurrent protection. Input voltage range is 1.25V to 5.5V (INLDO pin), and it supports dedicated sequencing via the Flexible Power Sequencer.
How is phase configuration set on the MAX77711CEWB+T - via hardware or software?
Phase configuration on the MAX77711CEWB+T is set using both hardware and software methods. Two dedicated pins (PHCFG0 and PHCFG1) define the default grouping at power-up (e.g., 4Φ, 2Φ+2Φ). This setting can be overridden dynamically via I²C register writes after boot, enabling runtime reconfiguration for adaptive power management in systems like FPGAs or application processors.
What package type and dimensions does the MAX77711CEWB+T use?
The MAX77711CEWB+T uses a 64-bump wafer-level package (WLP) with outline code W643D3+1, measuring 3.54mm × 3.54mm with 0.4mm bump pitch. It has a thermal resistance θJA of 38.2°C/W on a four-layer board and is RoHS-compliant. The package is marked "CEWB" and features a front-side finish that may be black or clear.
Can the MAX77711CEWB+T support digital voltage scaling (DVS) for processor cores?
Yes, the MAX77711CEWB+T supports full DVS functionality via I²C-controlled output voltage slewing. DVS slew rate is programmable, and dedicated GPIOs (e.g., DVS1) can trigger voltage transitions synchronized with processor state changes. Combined with soft-start/stop control and phase reconfiguration, this enables precise, low-glitch voltage scaling for CPU/GPU cores during DVFS operation.
MAX77711CEWB+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 64-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, Battery Powered Devices
- Voltage - Input:
- 2.3V ~ 10V
- Number of Outputs:
- 4
- Voltage - Output:
- 0.25V ~ 5.2V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-WLP (3.54x3.54)
MAX77711CEWB+T FAQ
1.How can I place an order for MAX77711CEWB+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77711CEWB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77711CEWB+T reliable?
The price and inventory of MAX77711CEWB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77711CEWB+T is usually 5 days.
3.What payment methods are accepted for MAX77711CEWB+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77711CEWB+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77711CEWB+T?
MAX77711CEWB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77711CEWB+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77711CEWB+T?
For technical support, including MAX77711CEWB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77711CEWB+T requirements.
6.How does Aetrix verify that MAX77711CEWB+T is sourced from the original manufacturer or authorized distributors?
All MAX77711CEWB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77711CEWB+T meets industry standards.
7.What is the process for return or replacement of MAX77711CEWB+T?
All MAX77711CEWB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77711CEWB+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77711CEWB+T part is unused and in its original packaging.
Return procedure for MAX77711CEWB+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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