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Analog Devices Inc./Maxim Integrated MAX77711EEWB+

Part No.:
MAX77711EEWB+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
64-WFBGA, WLBGA
Datasheet:
AetrixMAX77711EEWB+.pdf
Description:
IC REG BUCK PROG QUAD 64WLP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,772

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Product details

Overview

The MAX77711EEWB+ from Analog Devices is a quad-phase, 3A/phase configurable buck regulator with integrated 300mA pMOS LDO, designed for 2-cell Li+/Li-ion battery-powered systems (2.3V–10V input). It supports programmable I²C output voltages from 0.25V to 5.2V across up to four independent outputs and delivers peak efficiency of 94% at 3.3VOUT/7.4VIN, enabling compact power delivery in DSLR cameras and embedded microprocessor applications.

For engineers reviewing the MAX77711EEWB+ datasheet, MAX77711EEWB+ pinout, MAX77711EEWB+ application, or MAX77711EEWB+ equivalent, key selection considerations include its phase-configurable topology (4Φ/(3+1)Φ/(2+2)Φ/(2+1+1)Φ/(1+1+1+1)Φ), pseudo-random spread-spectrum EMI suppression, flexible sequencing with soft-start/stop, six multi-function GPIOs, and integrated LDO - all in a 64-bump, 3.54mm × 3.54mm wafer-level package.

Technical Context

The MAX77711EEWB+ implements adaptive off-time control per buck phase and supports hardware- or software-driven phase configuration via PHCFG pins or I²C registers. Its flexible power sequencer (FPS) enables precise timing control across up to four output slots with programmable slot pitch (0.625–5ms) and dedicated enable modes (always-on/on-demand).

Each buck channel features current-mode control with active discharge, hard/soft short-circuit protection, thermal shutdown, and UVLO. The integrated 300mA pMOS LDO (exclusive to MAX77711) operates from 1.25V–5.5V input and delivers 0.4V–1.975V output with factory-programmable defaults and GPIO/LDO sequencing support.

Key Specifications

ParameterValue and Actual Design Meaning
Input voltage range2.3V to 10V - supports 2-cell Li+/Li-ion battery operation with built-in UVLO (2.1V rising, 1.9V falling)
Output voltage range0.25V–5.2V (5mV steps below 1.3V; 20mV steps above 1V) - enables precise core voltage scaling for FPGAs and ASICs
Per-phase current rating3A continuous - scalable to 6A, 9A, or 12A via phase combination (4Φ/(3+1)Φ/(2+2)Φ/(2+1+1)Φ/(1+1+1+1)Φ)
Switching frequency1MHz nominal per phase - fixed-frequency operation with optional pseudo-random or triangular spread-spectrum modulation
LDO output300mA pMOS LDO (MAX77711 only), 0.4V–1.975V - provides low-noise auxiliary rail for I/O or bias supplies
Package64-bump WLP, 3.54mm × 3.54mm, 0.4mm pitch - ultra-compact footprint for space-constrained portable designs
GPIO countSix multi-function GPIOs - configurable for enable, DVS, FPWM, POK, or general-purpose I/O with factory-programmable defaults

Pinout & Package

The MAX77711EEWB+ is housed in a 64-bump wafer-level package (WLP) with 0.4mm pitch, outline number 21-100211, package code W643D3+1. Bump layout follows JEDEC-standard WLP conventions with defined A1 corner indicator and no depopulated bumps.

Pin/TerminalCircuit RoleDesign Meaning
IN1/IN2, IN3/IN4Buck input supply railsDual-input pairs support independent or shared 2s battery inputs; each pair rated for 3.2A RMS
LX1–LX4Phase switch node outputsFour high-side switch nodes driving external inductors; internally clamped to PGNDx and INx
SNS1+–SNS4+, SNS1−–SNS4−Current-sense feedback inputsDifferential sensing per buck channel for accurate output current monitoring and protection
VOUT1–VOUT4Regulated output terminalsFour independently configurable outputs (0.25V–5.2V); VOUT1 supports up to 6A in 2Φ config
PHCFG0, PHCFG1Hardware phase configurationTwo-pin binary encoding selects default phase topology at power-up (4Φ/(3+1)Φ/(2+2)Φ/(2+1+1)Φ/(1+1+1+1)Φ)
GPIO1–GPIO6Multi-function digital I/OConfigurable as enable, DVS, FPWM, POK, or general-purpose; factory-default settings stored in OTP
nIRQOpen-drain interrupt outputActive-low signal indicating fault conditions (thermal, short, UVLO, sequencing errors)
SDA, SCLI²C serial interfaceStandard 100kHz/400kHz I²C bus for dynamic voltage scaling, sequencing control, and register access

Key Features

FeatureDesign Value
Configurable quad-phase buck architectureEnables single-output 12A, dual-output 6A+6A, triple-output 6A+3A+3A, or quad-output 3A+3A+3A+3A topologies without redesign
Pseudo-random spread-spectrum modulationReduces peak EMI by >10dB across 100kHz–1GHz band, easing EMC compliance in camera and robotics systems
Flexible power sequencer (FPS)Programmable slot timing (0.625–5ms) and state actions enable deterministic power-up/down sequences for multi-rail SoCs
Integrated 300mA pMOS LDOProvides low-noise, fast-transient auxiliary supply (0.4V–1.975V) with independent enable and sequencing control
Comprehensive protection suiteIncludes hard/soft short-circuit detection, thermal shutdown (150°C junction), UVLO, and overtemperature lockout (OTLO)

Applications

DSLR & Mirrorless CamerasEmbedded Microprocessors

Use Scenario: Powering image sensor, ISP, and memory subsystems in compact interchangeable-lens cameras with strict thermal and EMI constraints.

IC Role / Device Role / Timing Role: Primary multi-rail power manager delivering dynamically scaled core, I/O, and analog voltages with synchronized sequencing.

Use Value: Enables 94% peak efficiency and spread-spectrum EMI reduction to meet CISPR-32 Class B emissions limits without shielding.

Use Scenario: Supplying configurable voltage rails to heterogeneous processing units (CPU, GPU, NPU) in edge AI modules.

IC Role / Device Role / Timing Role: Configurable buck regulator providing DVS-controlled core voltages and sequenced auxiliary rails during boot and mode transitions.

Use Value: Supports real-time voltage scaling via I²C with <200μs sequence start delay, reducing system wake-up latency.

Notebook Computers2-Cell Li-ion Robotics

Use Scenario: Delivering regulated power to CPU, memory, and display subsystems in thin-and-light notebooks with dual-cell battery input.

IC Role / Device Role / Timing Role: High-density power solution integrating four buck channels and LDO in sub-13mm² footprint to minimize PCB area.

Use Value: 3.54mm × 3.54mm WLP package reduces board space by >40% versus discrete solutions while maintaining 85% efficiency at 1.1VOUT.

Use Scenario: Powering motor drivers, MCU, and sensors in battery-operated collaborative robots requiring robust fault handling.

IC Role / Device Role / Timing Role: Fault-tolerant power controller with hard/soft short protection and thermal alarms to prevent damage during stall or overload events.

Use Value: Integrated protection eliminates need for external current-sense amplifiers and discrete thermal monitors, lowering BOM cost.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-phase buck regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX77511EEWB+No integrated LDO; identical buck architecture, pinout, and I²C register mapSuitable where auxiliary LDO rail is provided externally or not requiredSelect MAX77511EEWB+ when LDO functionality is unnecessary and cost optimization is prioritized
TPS65988DHFRUSB-C PD controller with integrated 3A buck; lacks quad-phase configurability and LDOTargeted at USB-C powered devices, not general-purpose multi-rail battery systemsChoose TPS65988DHFR only for USB-C source/sink applications requiring PD protocol compliance

Compared with MAX77511EEWB+, the MAX77711EEWB+ adds a 300mA pMOS LDO for auxiliary rail generation, while both share identical buck regulation, phase configuration, and sequencing capabilities. Against TPS65988DHFR, MAX77711EEWB+ offers broader input range (2.3V–10V vs. 4.5V–24V), true quad-phase flexibility, and battery-optimized protection - making it superior for 2s Li-ion embedded systems.

Availability

The MAX77711EEWB+ is available at Aetrix Electronics and suitable for DSLR cameras, notebook computers, and embedded microprocessor systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX77711EEWB+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Wilmington, MA.

The MAX77711EEWB+ belongs to Analog Devices' MAX77xxx family of highly integrated power management ICs, engineered specifically for space- and efficiency-constrained portable electronics with multi-rail, battery-powered architectures.

FAQ

What is the maximum output current capability of the MAX77711EEWB+?

The MAX77711EEWB+ supports up to 12A total output current by combining all four 3A phases in 4Φ mode. Individual configurations include 6A in (2+2)Φ, 9A in (3+1)Φ, and 3A per output in (1+1+1+1)Φ. Current capability is limited by thermal design and external component selection - the IC itself sustains 3.2A RMS per LX pin under specified board conditions.

Does the MAX77711EEWB+ support dynamic voltage scaling (DVS)?

Yes, the MAX77711EEWB+ supports full DVS via its I²C interface. Output voltages can be adjusted in real time with programmable slew rates, enabling adaptive core voltage control for processors and FPGAs. DVS is implemented per buck channel and coordinated through the flexible power sequencer to maintain safe transition timing.

What package type and dimensions does the MAX77711EEWB+ use?

The MAX77711EEWB+ uses a 64-bump wafer-level package (WLP) with 3.54mm × 3.54mm body size and 0.4mm bump pitch. Its outline number is 21-100211, package code W643D3+1, and it features no depopulated bumps. Thermal resistance is θJA = 38.2°C/W on a four-layer board.

How does the MAX77711EEWB+ handle thermal protection?

The MAX77711EEWB+ integrates multiple thermal safeguards: junction temperature monitoring with shutdown at +150°C, overtemperature lockout (OTLO) with hysteresis, and thermal alarm reporting via nIRQ. These functions operate independently of software control and remain active even during I²C communication loss or sequencing faults.

Is the LDO in the MAX77711EEWB+ adjustable, and what is its input voltage range?

Yes, the integrated 300mA pMOS LDO in the MAX77711EEWB+ is adjustable from 0.4V to 1.975V in 25mV steps. Its input voltage range is 1.25V to 5.5V (INLDO), supporting direct connection to main buck outputs or separate battery taps. LDO enable and sequencing are fully controllable via I²C, GPIO, or the flexible power sequencer.

MAX77711EEWB+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
64-WFBGA, WLBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Function:
Step-Down
Output Configuration:
Positive
Topology:
Buck
Output Type:
Programmable
Number of Outputs:
4
Voltage - Input (Min):
2.3V
Voltage - Input (Max):
10V
Voltage - Output (Min/Fixed):
0.25V
Voltage - Output (Max):
5.2V
Current - Output:
3A, 3A, 3A, 3A
Frequency - Switching:
1MHz
Synchronous Rectifier:
No
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-WLP (3.54x3.54)

MAX77711EEWB+ FAQ

1.How can I place an order for MAX77711EEWB+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX77711EEWB+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX77711EEWB+ reliable?

The price and inventory of MAX77711EEWB+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77711EEWB+ is usually 5 days.

3.What payment methods are accepted for MAX77711EEWB+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77711EEWB+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX77711EEWB+?

MAX77711EEWB+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX77711EEWB+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX77711EEWB+?

For technical support, including MAX77711EEWB+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77711EEWB+ requirements.

6.How does Aetrix verify that MAX77711EEWB+ is sourced from the original manufacturer or authorized distributors?

All MAX77711EEWB+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77711EEWB+ meets industry standards.

7.What is the process for return or replacement of MAX77711EEWB+?

All MAX77711EEWB+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX77711EEWB+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX77711EEWB+ part is unused and in its original packaging.

Return procedure for MAX77711EEWB+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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