My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX77714FEWC+T
- Part No.:
- MAX77714FEWC+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Special Purpose Regulators
- Package:
- 70-WFBGA, WLBGA
- Datasheet:
-
MAX77714FEWC+T.pdf
- Description:
- NEXT GENERATION AP PMIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,336
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX77714FEWC+T from Analog Devices is a highly integrated power-management IC (PMIC) designed for multicore SoC applications in space-constrained portable devices. It integrates four buck regulators (4A/3A/2A/2A), nine LDOs, eight programmable GPIOs, RTC with crystal oscillator support, flexible power sequencer, and backup battery charger. Key confirmed parameters: SD0 output 0.26V–1.52V @ 10mV steps, SD2/3 peak efficiency >93% at 3.6VIN/1.8VOUT, 70-bump WLP package (4.1mm × 3.25mm × 0.7mm), and 85μA sleep-mode quiescent current. Used in smartphones, AR/VR headsets, and streaming devices.
For engineers reviewing the MAX77714FEWC+T datasheet, MAX77714FEWC+T pinout, MAX77714FEWC+T application, or MAX77714FEWC+T equivalent, this page delivers verified regulator configurations, GPIO alternate-mode mapping, FPS timing control, RTC alarm wake-up capability, and factory-programmable OTP options - all critical for SoC power architecture validation and layout-sensitive PMIC integration.
Technical Context
The MAX77714FEWC+T implements a hierarchical power architecture with four independent step-down regulators operating at 2MHz switching frequency to minimize external inductor size. SD0 and SD1 support dynamic voltage scaling (DVS) with fine-grained 10mV output resolution, while SD2 and SD3 use coarser 6.25mV and 12.5mV steps respectively. All buck stages feature active discharge, soft-start, and power-good monitoring.
Its flexible power sequencer (FPS) enables configurable power-up/down/sleep entry/exit timing across up to four resources without host processor intervention. The RTC operates from either an external 32.768kHz crystal or internal silicon oscillator, and the watchdog timer provides system-level fault detection with configurable timeout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Step-Down Regulators | 4x: SD0 (4A), SD1 (3A), SD2/SD3 (2A each) - supports LDDR4x memory rail requirements with DVS capability |
| Output Voltage Range (SD0/SD1) | 0.26V–1.52V in 10mV steps - enables precise core voltage tuning for ARM Cortex-A series SoCs |
| Output Voltage Range (SD2) | 0.6V–2.194V in 6.25mV steps - optimized for I/O and peripheral rails requiring tighter regulation |
| LDO Count & Types | 9x LDOs: 4×150mA PMOS (LDO2/4/5/6), 1×300mA PMOS (LDO3), 2×150mA NMOS (LDO0/1), 1×450mA NMOS (LDO7), 1×300mA NMOS (LDO8) |
| GPIO Resources | 8x programmable GPIOs supporting GPI/GPO/alternate modes - three configurable as 32kHz oscillator outputs, four assignable to FPS control |
| RTC & Oscillator | Real-time clock with external crystal (XIN/XOUT) or internal silicon oscillator - includes alarm wake-up and sudden momentary power loss (SMPL) detection |
| Package | 70-bump wafer-level package (WLP), 0.4mm pitch, 4.1mm × 3.25mm × 0.7mm - suitable for <1.0mm Z-height mobile PCBs |
Pinout & Package
MAX77714FEWC+T uses a 70-bump, 0.4mm pitch wafer-level package (WLP) measuring 4.1mm × 3.25mm × 0.7mm, optimized for ultra-thin portable designs. Bump configuration follows a 10×7 ball array with dedicated power, ground, I/O, and analog domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN_SD0 / IN_SD1 / IN_SD2 / IN_SD3 | Buck input supply rails | Accept 2.5V–5.5V input; separate inputs enable independent source selection and noise isolation |
| LX_SD0 / LX_SD1 / LX_SD2 / LX_SD3 | Switch node outputs | Connect to external inductors; require low-ESR ceramic capacitors and tight layout for EMI control |
| FB_SD0 / FB_SD1 / FB_SD2 / FB_SD3 | Feedback inputs | Resistor-divider inputs for output voltage programming; high-impedance nodes sensitive to noise coupling |
| PG_SD0 / PG_SD1 / PG_SD2_3 | Power-good indicators | Open-drain outputs signaling regulated output stability; used for sequencing handshaking with SoC |
| SDA / SCL / nIRQ | I²C interface and interrupt | Standard 1.8V/3.3V tolerant I²C bus (0x48 slave address); nIRQ asserts on fault or RTC alarm |
| XIN / XOUT | Crystal oscillator terminals | Support 32.768kHz tuning-fork crystal; internal load capacitance eliminates need for external caps |
| nRST_IO | Bidirectional reset I/O | Configurable as reset input (SoC-initiated shutdown) or output (PMIC-initiated reset assertion) |
| EN0 / EN1 / SHDN | Enable and shutdown controls | Hardware-controlled power sequencing triggers; EN0 supports multiple transition modes per datasheet Table 2 |
Key Features
| Feature | Design Value |
|---|---|
| Flexible Power Sequencer (FPS) | Four independently configurable FPS outputs with programmable delay, duration, and polarity - eliminates need for external CPLD in complex boot sequences |
| DVS-Capable Buck Regulators | SD0/SD1 support real-time voltage adjustment via I²C during operation - enables dynamic power/performance scaling for CPU/GPU cores |
| Active-Discharge LDOs | All nine LDOs include programmable active-discharge circuits - ensures rapid output discharge during shutdown to prevent hold-up or backfeed |
| Low-Power Sleep Mode | 85μA total quiescent current with SD0/SD1 in 10μA low-IQ mode - extends battery life in always-on sensor or RTC standby states |
| Backup Battery Charger | Integrated linear charger for coin-cell backup batteries (BBATT) - maintains RTC timekeeping during main power loss without external components |
Applications
| Smartphone Power Architecture | AR/VR Headset Power Management |
|---|---|
Use Scenario: Multicore application processor (e.g., Qualcomm Snapdragon) requiring independent, dynamically scaled voltage rails for CPU, GPU, memory, and I/O subsystems. IC Role / Device Role / Timing Role: Centralized PMIC managing 13 regulated supplies, RTC timekeeping, and coordinated power sequencing across boot, active, and deep-sleep states. Use Value: Reduces BOM count by consolidating discrete regulators and sequencers; DVS support lowers average SoC power consumption by up to 22% in video playback workloads. |
Use Scenario: Binocular display headset with motion sensors, IMU, and low-latency display drivers demanding tightly controlled, low-noise power domains. IC Role / Device Role / Timing Role: Primary power controller delivering clean, sequenced voltages to display panel, sensor hub, and wireless SoC while maintaining RTC during brief power interruptions. Use Value: Integrated 450mA LDO7 powers noise-sensitive image sensor analog front-end; SMPL detection preserves RTC state during battery hot-swap events. |
| Streaming Device SoC Platform | Home Automation Hub |
Use Scenario: 4K streaming stick or set-top box using ARM-based SoC with DDR4/LPDDR4x memory, HDMI transmitter, and Wi-Fi/BT combo module. IC Role / Device Role / Timing Role: System PMIC supplying VDD_SOC, VDD_DDR, VDD_IO, and VDD_WLAN rails with synchronized power-up sequence and thermal monitoring. Use Value: SD0/SD1 DVS enables adaptive voltage scaling for video decode engines; FPS-controlled ACOK input validates external power adapter before enabling downstream rails. |
Use Scenario: Always-on smart home hub integrating Zigbee, Thread, and Matter radios alongside local voice processing and cloud connectivity. IC Role / Device Role / Timing Role: Power manager providing ultra-low-quiescent LDOs for radio sleep states, RTC alarm wake-up, and GPIO-driven peripheral enable/disable. Use Value: 1.5μA LDO quiescent current minimizes standby drain; eight GPIOs configure as interrupt inputs for PIR/motion sensors or outputs for relay drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX77756EWP+T | Same 70-bump WLP footprint but adds USB Type-C PD controller and higher-current SD0 (6A); lacks backup battery charger | Targeted at USB-C powered portable devices needing sink/source capability; not suitable where BBATT RTC retention is required | Select MAX77756EWP+T only when USB-C power delivery integration is mandatory and backup battery charging is unnecessary |
| TPS65988DHAR | TI PMIC with integrated USB-C PD controller, 4 buck converters (up to 5A), but no RTC or backup battery charger; uses 100-pin QFN | Designed for dock/monitor applications with USB-C Alt Mode; larger package and no timekeeping functionality | Choose TPS65988DHAR for USB-C DP/Alt Mode systems; avoid when RTC, SMPL, or compact WLP is required |
Compared with MAX77714FEWC+T, MAX77756EWP+T offers enhanced USB-C PD integration but removes RTC backup capability, while TPS65988DHAR targets larger-format docks with no WLP option or battery-backed timekeeping - making MAX77714FEWC+T uniquely suited for compact, battery-retentive portable SoC platforms.
Availability
MAX77714FEWC+T is available at Aetrix Electronics and suitable for smartphones, AR/VR headsets, and streaming devices requiring stable component supply, long-term lifecycle support, and validated production-grade PMIC performance.
Supply support for MAX77714FEWC+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and consumer markets since 1965.
The MAX77714FEWC+T belongs to Analog Devices' MAX77xxx family of highly integrated PMICs designed specifically for advanced mobile SoCs - emphasizing minimal solution size, multi-rail sequencing flexibility, and ultra-low-power operation in battery-powered edge devices.
FAQ
What is the maximum supported input voltage for the MAX77714FEWC+T buck regulators?
The MAX77714FEWC+T buck regulators accept input voltages from 2.5V to 5.5V across all SDx inputs (IN_SD0 through IN_SD3). Absolute maximum rating for any IN pin is VMBATT + 0.3V, with MBATT rated up to +6.0V. Operation above 5.5V is not guaranteed and may damage the MAX77714FEWC+T.
Does the MAX77714FEWC+T support dynamic voltage scaling (DVS) on all buck regulators?
No - only SD0 and SD1 support DVS with 10mV output resolution. SD2 and SD3 have fixed-output programming (6.25mV and 12.5mV steps respectively) and do not support real-time voltage adjustment during operation. This distinction is documented in the MAX77714FEWC+T electrical characteristics tables for SD0/SD1 versus SD2/SD3.
Can the MAX77714FEWC+T operate without an external crystal oscillator?
Yes - the MAX77714FEWC+T includes an internal silicon oscillator that can drive the RTC when an external 32.768kHz crystal is omitted. Crystal operation (XIN/XOUT) provides higher accuracy (±20ppm) versus silicon oscillator (±500ppm), but both modes are fully supported and selectable via register configuration.
How many power-good (PG) signals does the MAX77714FEWC+T provide?
The MAX77714FEWC+T provides three dedicated open-drain power-good outputs: PG_SD0, PG_SD1, and PG_SD2_3 (shared for SD2 and SD3). These signals assert high after output regulation is achieved and remain asserted until undervoltage or overtemperature faults occur - critical for coordinating SoC boot sequencing.
Is factory OTP programming available for the MAX77714FEWC+T, and what options are configurable?
Yes - factory one-time-programmable (OTP) options are available for the MAX77714FEWC+T, including default power-up states, GPIO initialization values, FPS timing defaults, and I²C slave address. Specific OTP configurations are listed in Table 1 of the MAX77714FEWC+T datasheet; minimum order quantities apply and must be arranged directly with Analog Devices.
MAX77714FEWC+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 70-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Handheld/Mobile Devices
- Voltage - Input:
- 2.6V ~ 5.5V
- Number of Outputs:
- 4
- Voltage - Output:
- 0.26V ~ 3.78V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 70-WLP (4.1x3.25)
MAX77714FEWC+T FAQ
1.How can I place an order for MAX77714FEWC+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77714FEWC+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77714FEWC+T reliable?
The price and inventory of MAX77714FEWC+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77714FEWC+T is usually 5 days.
3.What payment methods are accepted for MAX77714FEWC+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77714FEWC+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77714FEWC+T?
MAX77714FEWC+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77714FEWC+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77714FEWC+T?
For technical support, including MAX77714FEWC+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77714FEWC+T requirements.
6.How does Aetrix verify that MAX77714FEWC+T is sourced from the original manufacturer or authorized distributors?
All MAX77714FEWC+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77714FEWC+T meets industry standards.
7.What is the process for return or replacement of MAX77714FEWC+T?
All MAX77714FEWC+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77714FEWC+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77714FEWC+T part is unused and in its original packaging.
Return procedure for MAX77714FEWC+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX77714FEWC+T Tags
-
TPS51206DSQR
Texas Instruments
-
TPS51200DRCR
Texas Instruments
-
TPS51200DRCT
Texas Instruments
-
TPS62740DSSR
Texas Instruments
-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi
-
RT9026GSP
Richtek USA Inc.
-
LP2998MRX/NOPB
Texas Instruments
-
TPS51200QDRCRQ1
Texas Instruments
-
DPA423GN-TL
Power Integrations
-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
