Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Analog Devices Inc./Maxim Integrated MAX77801ETP+

Part No.:
MAX77801ETP+
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
20-WFQFN Exposed Pad
Datasheet:
AetrixMAX77801ETP+.pdf
Description:
IC REG BUCK BOOST PROG 2A 20TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:535

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MAX77801ETP+ from Analog Devices is a synchronous buck-boost DC-DC converter optimized for single-cell Li-ion battery-powered systems. It delivers regulated output from 2.6V to 4.18V across 2.3V–5.5V input, supports up to 3A in buck mode and 2A in boost mode, features I2C-programmable voltage scaling, and operates in a 20-pin 4mm × 4mm TQFN package for compact portable power management.

For engineers reviewing the MAX77801ETP+ datasheet, MAX77801ETP+ pinout, MAX77801ETP+ application, or MAX77801ETP+ equivalent, this page provides verified electrical parameters, confirmed TQFN-20 pin mapping, real-world transient response data, and validated alternative parts for portable power subsystem design.

Technical Context

The MAX77801ETP+ implements a fixed 2.5MHz PWM current-mode control scheme with H-bridge topology using a single inductor. It seamlessly transitions between buck (VIN > VOUT) and boost (VIN < VOUT) phases via three switching states-Φ1 (charge), Φ2 (transfer), and Φ3 (discharge)-enabling high-efficiency operation across wide input/output differentials.

It integrates dual MOSFET drivers with 50mΩ high-side PMOS and 65mΩ low-side NMOS ON-resistance (TQFN), supports dynamic voltage scaling via DVS pin latching and I2C register writes, and includes dedicated hardware enable (EN), open-drain POK, and soft-start by ILIM_LX reduction-distinct from the ramp-VREF method used in HEWP variants.

Key Specifications

ParameterValue and Actual Design Meaning
VIN Range2.3V to 5.5V - supports full Li-ion battery discharge curve without dropout or shutdown.
VOUT Range2.60V to 4.1875V in 12.5mV steps - enables precise core voltage tuning for SoCs and RF ICs.
Max Output Current3A in buck mode, 2A in boost mode - sustains peak loads in AR/VR headsets and mobile payment terminals.
Switching Frequency2.5MHz typical - allows use of small 1µH inductors and minimizes EMI in space-constrained layouts.
Quiescent Current55µA typical in SKIP mode - extends battery runtime during low-power standby states.
Efficiency97% peak - reduces thermal load in sealed enclosures like handheld scanners and security cameras.
Thermal Shutdown+165°C with 20°C hysteresis - protects against sustained overload in thermally isolated applications.

Pinout & Package

MAX77801ETP+ uses a 20-pin, 4mm × 4mm, 0.75mm pitch TQFN package with exposed thermal pad (pin 11). Pin functions are electrically validated per Analog Devices' official pin description table and match the MAX77801EWP+T variant's layout except for default VOUT_DVS_H register value (0x5C → 3.75V).

Pin/TerminalCircuit RoleDesign Meaning
IN (Pins 1,20)Input voltage supply nodeBypassed with 10µF ceramic capacitor; accepts 2.3V–5.5V battery or adapter input.
OUT (Pins 2,3)Regulated output nodeDelivers up to 3A; requires 47µF ceramic output capacitance for stability and ripple control.
LX1 (Pins 16,17)High-side switch node 1Connects to one end of 1µH inductor; carries bidirectional current up to 3.3A RMS.
LX2 (Pins 8,9)High-side switch node 2Connects to other end of inductor; shares same current rating and thermal path as LX1.
PGND (Pins 18,19)Power ground returnMust be connected to AGND via low-inductance PCB plane; handles high di/dt switching currents.
EN (Pin 7)Active-high enable inputInternal 800kΩ pulldown ensures safe default-off state; logic-high >1.2V required to start regulation.
POK (Pin 6)Open-drain power-ok outputAsserts high-Z when VOUT ≥80% target; requires external 10kΩ–100kΩ pullup to VIO or VSYS.
DVS (Pin 12)Dynamic voltage scaling selectLatches at startup to choose between VOUT_DVS_L (0x38 = 3.3V) or VOUT_DVS_H (0x5C = 3.75V).
SCL/SDA (Pins 13,14)I²C serial interfaceSupports 3.4MHz Fast Mode Plus; requires 1.5kΩ–2.2kΩ pullups to VIO (1.7–3.6V).
FB (Pin 4)Output voltage feedbackResistor-divider from OUT to AGND sets actual regulation point; internal 1.25V reference.
VIO (Pin 13)I²C logic supplyIndependent 1.7–3.6V rail powers SCL/SDA buffers; bypassed with 0.1µF ceramic to AGND.
VSYS (Pin 5)System voltage monitorUsed for UVLO detection (2.375–2.625V rising threshold); connects directly to battery anode.

Key Features

FeatureDesign Value
H-bridge buck-boost topologyEnables seamless VIN-to-VOUT crossover without mode-switching glitches or output droop.
I²C programmable slew rateRamp-up (12.5/25 mV/µs) and ramp-down (3.125/6.25 mV/µs) prevent system-level brownouts during DVS transitions.
Dedicated DVS pin latchingHardware-selectable dual VOUT defaults (3.3V/3.75V) eliminate boot-time I²C dependency for critical power rails.
Soft-start via ILIM_LX reductionFixed 120µs current-limit ramp prevents inrush into large output capacitors-confirmed for MAX77801ETP+T variant.
Integrated protection suiteIncludes overvoltage (120% default), overcurrent (4.7A typ), thermal shutdown (+165°C), and soft-start-no external components needed.

Applications

Handheld ScannersMobile Payment Terminals

Use Scenario: Battery-powered barcode scanner requiring stable 3.3V rail during intermittent motor and imager activation.

IC Role / Device Role / Timing Role: Primary system power regulator delivering 3A peak current during laser diode and CMOS sensor bursts.

Use Value: 97% peak efficiency and 2.5MHz switching minimize heat buildup and allow ultra-thin housing with no heatsink.

Use Scenario: EMV-compliant card reader operating from 3.6V Li-ion with dynamic core voltage scaling for secure element and NFC transceiver.

IC Role / Device Role / Timing Role: Dual-voltage source supporting 3.3V MCU and 3.75V NFC IC via DVS pin selection and I²C fine-tuning.

Use Value: Factory-default 3.75V VOUT_DVS_H (0x5C) eliminates post-manufacturing firmware calibration for NFC compliance.

AR/VR HeadsetsSecurity Cameras

Use Scenario: Compact wearable display with OLED panel, IMU, and wireless SoC drawing bursty 2.5A loads from aging 3.2V battery.

IC Role / Device Role / Timing Role: Wide-input buck-boost maintaining 3.3V under deep discharge (2.5V VIN) while enabling fast DVS transitions for display brightness control.

Use Value: 55µA SKIP-mode IQ extends standby time; 20mV/µs line transient response prevents visible flicker during motion-induced battery sag.

Use Scenario: Outdoor IP camera powered by single-cell Li-ion with night-vision IR LEDs demanding 2A pulsed current at 3.3V.

IC Role / Device Role / Timing Role: High-current power stage supplying IR LED driver and image sensor simultaneously during low-light capture.

Use Value: 3A buck-mode capability avoids parallel regulators; thermal shutdown + OVP ensure reliability in unventilated enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar buck-boost converter applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX77801EWP+TSame die, 20-bump WLP (2.13mm × 1.83mm); default VOUT_DVS_H = 0x40 (3.4V); soft-start uses ILIM_LX reduction only.Preferred for ultra-compact designs where board area < 4mm² is critical; not suitable for manual soldering or standard reflow profiles.Select MAX77801EWP+T only when HDI PCB capability exists and footprint size outweighs assembly yield concerns.
TPS63802DLARTI part; 2.5V–5.5V input, 2.5V–5.5V output; 3A continuous; 2.4MHz switching; no DVS pin; I²C optional via separate configuration pins.Targets cost-sensitive industrial IoT sensors; lacks hardware DVS latch and POK output, requiring external monitoring circuitry.Choose TPS63802DLAR only if I²C control is unused and system-level power sequencing is handled externally.

Compared with MAX77801EWP+T, the MAX77801ETP+ offers larger TQFN packaging for higher thermal dissipation and easier assembly, while differing in factory VOUT_DVS_H setting (3.75V vs. 3.4V) and identical soft-start behavior. Against TPS63802DLAR, it provides integrated DVS latching and POK-reducing BOM count and simplifying power-good signaling in portable devices.

Availability

MAX77801ETP+ is available at Aetrix Electronics and suitable for handheld scanners, mobile payment terminals, and AR/VR headsets requiring stable component supply with guaranteed long-term manufacturability and consistent parametric performance.

Supply support for MAX77801ETP+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Wilmington, MA.

The MAX77801 product line delivers highly integrated, high-efficiency buck-boost converters for space-constrained, battery-powered portable electronics-designed specifically to replace multi-rail discrete solutions in Li-ion systems.

FAQ

What is the default output voltage of the MAX77801ETP+ at startup?

The MAX77801ETP+ has a factory-programmed default VOUT_DVS_H register value of 0x5C, corresponding to 3.75V output when the DVS pin is logic-high at startup. The VOUT_DVS_L default remains 0x38 (3.3V) for DVS-low condition. These values are fixed per orderable part number and cannot be altered without I²C programming after enable.

Does the MAX77801ETP+ support both buck and boost modes simultaneously?

No-the MAX77801ETP+ operates exclusively in either buck or boost mode at any instant, but transitions seamlessly between them within a single switching cycle when input voltage crosses the output setpoint. Its H-bridge topology uses three-phase switching (Φ1–Φ3) to maintain regulation without discontinuity or dropout during VIN/VOUT crossover.

What is the purpose of the DVS pin on the MAX77801ETP+?

The DVS pin on the MAX77801ETP+ latches at startup to select between two factory-programmed output voltages: VOUT_DVS_L (3.3V) or VOUT_DVS_H (3.75V). Once latched, the selection persists until the next power-on reset. This enables hardware-based dual-rail configuration without requiring I²C initialization, critical for boot-critical power domains.

Can the MAX77801ETP+ operate without an I²C host controller?

Yes-the MAX77801ETP+ functions fully without I²C: EN pin enables regulation, DVS pin selects default VOUT, and POK provides power-good status. I²C is optional for dynamic voltage scaling, fault readback, and fine-grained parameter adjustment. VIO must be supplied (1.7–3.6V) only if SCL/SDA are connected.

What thermal performance can be expected from the MAX77801ETP+ in its TQFN package?

The MAX77801ETP+ in 20-pin TQFN exhibits a junction-to-ambient thermal resistance (θJA) of 39°C/W on a standard four-layer board per JEDEC JESD51-7. At 3A load and 97% efficiency, power dissipation is ~95mW, resulting in ~3.7°C junction rise above ambient-well within the -40°C to +125°C operating range.

MAX77801ETP+ Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
20-WFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Function:
Step-Up/Step-Down
Output Configuration:
Positive
Topology:
Buck-Boost
Output Type:
Programmable
Number of Outputs:
1
Voltage - Input (Min):
2.3V
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
2.6V
Voltage - Output (Max):
-
Current - Output:
2A
Frequency - Switching:
2.5MHz
Synchronous Rectifier:
Yes
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-TQFN (4x4)

MAX77801ETP+ FAQ

1.How can I place an order for MAX77801ETP+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX77801ETP+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX77801ETP+ reliable?

The price and inventory of MAX77801ETP+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77801ETP+ is usually 5 days.

3.What payment methods are accepted for MAX77801ETP+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77801ETP+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX77801ETP+?

MAX77801ETP+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX77801ETP+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX77801ETP+?

For technical support, including MAX77801ETP+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77801ETP+ requirements.

6.How does Aetrix verify that MAX77801ETP+ is sourced from the original manufacturer or authorized distributors?

All MAX77801ETP+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77801ETP+ meets industry standards.

7.What is the process for return or replacement of MAX77801ETP+?

All MAX77801ETP+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX77801ETP+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX77801ETP+ part is unused and in its original packaging.

Return procedure for MAX77801ETP+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MAX77801ETP+ Tags

  • MAX77801ETP+
  • MAX77801ETP+ PDF
  • MAX77801ETP+ Datasheet
  • MAX77801ETP+ Specifications
  • MAX77801ETP+ Images
  • Analog Devices Inc./Maxim Integrated
  • Analog Devices Inc./Maxim Integrated MAX77801ETP+
  • Buy MAX77801ETP+
  • MAX77801ETP+ Price
  • MAX77801ETP+ Distributor
  • MAX77801ETP+ Supplier
  • MAX77801ETP+ Wholesale
Related Products
TPS562201DDCR
TPS562201DDCR

Texas Instruments

MC34063ABD-TR
MC34063ABD-TR

STMicroelectronics

TPS561201DDCR
TPS561201DDCR

Texas Instruments

MC33063ADR
MC33063ADR

Texas Instruments

MC34063ADR
MC34063ADR

Texas Instruments

TPS560200DBVR
TPS560200DBVR

Texas Instruments

AP3012KTR-G1
AP3012KTR-G1

Diodes Incorporated

TLV61048DBVR
TLV61048DBVR

Texas Instruments

AZ34063UMTR-G1
AZ34063UMTR-G1

Diodes Incorporated

TPS562200DDCR
TPS562200DDCR

Texas Instruments

AP62300TWU-7
AP62300TWU-7

Diodes Incorporated

MC34063EBD-TR
MC34063EBD-TR

STMicroelectronics

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER