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Analog Devices Inc./Maxim Integrated MAX77801HEWP+T
- Part No.:
- MAX77801HEWP+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 20-WFBGA, WLBGA
- Datasheet:
-
MAX77801HEWP+T.pdf
- Description:
- IC REG BUCK BOOST PROG 2A 20WLP
- Quantity:
- Payment:
- Shipping:
Inventory:3,538
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Product details
Overview
MAX77801HEWP+T from Analog Devices is a synchronous buck-boost DC-DC converter optimized for single-cell Li-ion battery systems. It delivers regulated output from 2.6V to 4.18V across 2.3V–5.5V input, supports 2A in boost and 3A in buck mode, features I²C-programmable voltage scaling, and operates in a 20-bump 2.13mm × 1.83mm WLP package for space-constrained handheld scanners and AR/VR headsets.
For engineers reviewing the MAX77801HEWP+T datasheet, MAX77801HEWP+T pinout, MAX77801HEWP+T application, or MAX77801HEWP+T equivalent, this page provides verified electrical parameters, validated soft-start behavior (ramp VREF + reduce ILIM_LX), thermal shutdown at +165°C, 2.5MHz switching, and confirmed WLP package mechanical data - all specific to the HEWP+T variant.
Technical Context
The MAX77801HEWP+T implements a fixed-frequency 2.5MHz current-mode PWM control scheme with H-bridge topology using a single inductor. It transitions seamlessly between buck and boost modes by dynamically selecting among three switching phases (Φ1–Φ3) based on VIN–VOUT differential.
This variant uses dual-stage soft-start: internal reference voltage (VREF) ramps over 300µs while peak inductor current limit (ILIM_LX) is reduced for 120µs - a behavior explicitly documented for MAX77801HEWP+T and distinct from EWP/ETP variants. It supports high-speed I²C up to 3.4MHz with 7-bit slave address 0x18.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.3V to 5.5V - supports full Li-ion battery discharge curve without dropout. |
| VOUT Range | 2.60V to 4.1875V in 12.5mV steps - enables precise DVS for SoC core voltage tuning. |
| Max Output Current | 2A (boost mode, VIN=3.0V/VOUT=3.4V); 3A (buck mode) - sustains burst loads in mobile payment terminals. |
| Switching Frequency | 2.25–2.75MHz (typ 2.5MHz) - allows use of compact 1µH inductors and reduces EMI filtering burden. |
| Quiescent Current | 55µA (typ) in SKIP mode - extends battery runtime in always-on security camera standby. |
| Thermal Shutdown | +165°C with 20°C hysteresis - protects die during sustained 3A operation in sealed AR headset enclosures. |
| I²C Interface | Up to 3.4MHz Fast Mode Plus - enables real-time voltage adjustment without interrupting system clock domains. |
Pinout & Package
MAX77801HEWP+T is packaged in a 20-bump wafer-level package (WLP), measuring 2.13mm × 1.83mm with 0.4mm pitch. The bump layout follows a 5×4 grid (A1–E5), with duplicated power and ground terminals for low-impedance routing in HDI PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 (VSYS) | System (battery) voltage input | Bypassed to AGND with 1µF capacitor; supplies internal LDOs and monitors UVLO (2.375–2.625V rising threshold). |
| A2 (DVS) | Dynamic voltage scaling logic input | Latches VOUT_DVS_L or VOUT_DVS_H register value post-soft-start; tied to AGND if unused. |
| A4 (SDA), A5 (SCL) | I²C serial interface lines | High-impedance open-drain; require 1.5kΩ–2.2kΩ pullups to VIO; support 3.4MHz timing with 100pF bus capacitance. |
| B2 (POK) | Open-drain power-ok output | Asserts high-Z when VOUT ≥ 80% target; pulls low at ≤75% target or during disable - used for system power sequencing. |
| B4 (EN) | Active-high enable input | Internal 800kΩ pulldown ensures safe default-off state; requires >1.2V to enable; resets registers when driven low. |
| C1/C2 (OUT) | Main regulated output | Dual-bump connection to 47µF ceramic capacitor; delivers up to 3A with <50mV load transient deviation. |
| C2/C3 (LX2), C4/D4 (LX1) | Switching nodes | Connect to opposite ends of 1µH inductor; handle 3.3A RMS current; require tight loop area to minimize EMI. |
| C3/D3 (PGND), A3/B3 (AGND) | Power and analog ground | Must be connected to common PCB ground plane with low-inductance vias; separation prevents noise coupling into FB path. |
Key Features
| Feature | Design Value |
|---|---|
| H-bridge buck-boost topology | Single-inductor architecture eliminates need for separate buck/boost converters - reduces BOM count and board area by ~40% vs dual-converter solutions. |
| Dual-stage soft-start (MAX77801HEWP+T only) | 300µs VREF ramp + 120µs ILIM_LX reduction prevents inrush current spikes and upstream supply droop in battery-powered AR/VR systems. |
| Programmable slew-rate control | Ramp-up: 12.5 or 25mV/µs; ramp-down: 3.125 or 6.25mV/µs - avoids voltage undershoot/overshoot during dynamic SoC frequency scaling. |
| Burst mode transient response | Temporarily raises ILIM_LX to 5.5A for ≤800µs during heavy load steps - maintains regulation during 1.5A→10mA transients in handheld scanners. |
| Integrated protection suite | Includes OVP (configurable 100–120% VOUT), thermal shutdown (+165°C), soft-start current limiting, and overcurrent detection - eliminates need for external fault management ICs. |
Applications
| Handheld Scanners | Mobile Payment Terminals |
|---|---|
Use Scenario: Continuous barcode scanning under variable lighting, requiring stable 3.3V rail for image sensor and MCU despite Li-ion voltage sag from 4.2V to 2.8V. IC Role / Device Role / Timing Role: Primary system power regulator maintaining VOUT = 3.3V ±1% across full input range with seamless buck-boost transition. Use Value: Eliminates brownouts during rapid scan bursts; 97% peak efficiency extends battery life beyond 8 hours per charge. |
Use Scenario: EMV contactless transaction processing where NFC controller demands clean 2.8V at 1.5A peak, synchronized with secure element wake-up. IC Role / Device Role / Timing Role: High-current buck-boost supplying NFC subsystem with programmable DVS to match RF field strength requirements. Use Value: I²C-controlled VOUT scaling reduces NFC power consumption by 22% during low-field operation without firmware changes. |
| Security Cameras | AR/VR Headsets |
Use Scenario: Always-on indoor surveillance camera powered by 3.7V Li-ion, operating 24/7 with motion-triggered IR LED illumination drawing 2A pulses. IC Role / Device Role / Timing Role: Main power stage delivering 3.3V to image processor and 2.8V to IR driver via DVS pin selection. Use Value: Burst mode handles 2A LED pulses without output collapse; 55µA SKIP-mode IQ enables >6-month standby on 2000mAh battery. |
Use Scenario: Compact wearable AR display requiring tightly regulated 3.4V for micro-OLED panel and 1.8V for companion SoC, within strict thermal envelope. IC Role / Device Role / Timing Role: Dual-rail generator (via external LDO fed from MAX77801HEWP+T VOUT) with thermal-aware enable sequencing. Use Value: 2.13mm × 1.83mm WLP fits beneath display module; +125°C junction rating supports operation inside thermally isolated headset housing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX77801EWP+T | Uses ILIM_LX reduction-only soft-start (120µs); no VREF ramp; default VOUT = 3.3V. | Suitable for cost-sensitive designs where fast startup (<200µs) is prioritized over inrush control. | Select EWP+T when board space allows larger input caps to absorb startup surge; avoid in battery-limited wearables. |
| TPS63802DLAR | Fixed 3.3V output (non-I²C); 2.5A max; 2.4MHz switching; QFN-16 package (3mm × 2mm). | Lacks DVS, POK, and programmable slew rate - limited to static rail applications like basic IoT sensors. | Choose TPS63802DLAR for simple, low-cost replacements where voltage flexibility and fault reporting are unnecessary. |
Compared with MAX77801EWP+T and TPS63802DLAR, the MAX77801HEWP+T uniquely combines dual-stage soft-start, full I²C configurability, and WLP packaging - making it the only option for thermally constrained, dynamically scaled power rails in next-gen portable electronics.
Availability
MAX77801HEWP+T is available at Aetrix Electronics and suitable for handheld scanners, mobile payment terminals, and AR/VR headsets requiring stable component supply with guaranteed long-term manufacturability and consistent WLP assembly yield.
Supply support for MAX77801HEWP+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Wilmington, MA, with design centers worldwide.
The MAX77801 product line targets ultra-compact, high-efficiency power management for battery-powered edge devices - specifically engineered to replace discrete buck + boost solutions in space- and thermal-constrained portable electronics.
FAQ
What is the soft-start behavior specific to MAX77801HEWP+T?
The MAX77801HEWP+T implements a dual-stage soft-start: internal reference voltage (VREF) ramps linearly over 300µs while peak inductor current limit (ILIM_LX) is reduced to 1.8A for 120µs. This behavior is explicitly defined for the HEWP+T variant in the datasheet's Table 2 and differs from EWP/ETP versions. It minimizes inrush current and prevents input droop in sensitive Li-ion systems.
Does MAX77801HEWP+T support I²C communication at 3.4MHz?
Yes, MAX77801HEWP+T supports I²C Fast Mode Plus up to 3.4MHz with CB = 100pF, as specified in the "I2C-COMPATIBLE INTERFACE TIMING (HIGH-SPEED MODE)" table. The device uses 7-bit slave address 0x18 and requires external 1.5kΩ–2.2kΩ pullups to VIO. Timing parameters including tSU_DAT (10ns) and tRCL (10–40ns) are fully characterized for this speed.
What is the maximum continuous output current for MAX77801HEWP+T in buck mode?
The MAX77801HEWP+T delivers up to 3A continuous output current in buck mode (VIN > VOUT), as confirmed in the "General Description" and "Buck-Boost Electrical Characteristics" sections. This rating holds for VIN ≥ 2.8V; below 2.8V, max current drops to 1A. Thermal performance is validated with θJA = 55.49°C/W for the 20-bump WLP package.
How does the Power-OK (POK) output function on MAX77801HEWP+T?
The POK pin on MAX77801HEWP+T is an open-drain output that goes high-impedance when VOUT reaches ≥80% of target, and pulls low when VOUT falls ≤75% or when EN is deasserted. It requires an external 10kΩ–100kΩ pullup resistor. Polarity is configurable via the POK_POL bit, defaulting to active-high - enabling reliable power sequencing in multi-rail systems.
What package type and dimensions does MAX77801HEWP+T use?
MAX77801HEWP+T uses a 20-bump wafer-level package (WLP) measuring 2.13mm × 1.83mm with 0.4mm bump pitch. This is explicitly stated in the "General Description", "Pin Configuration", and "Package Thermal Characteristics" sections. The WLP requires HDI PCB construction with microvias and is distinct from the 4mm × 4mm TQFN option offered for other MAX77801 variants.
MAX77801HEWP+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 20-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Programmable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.3V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.6V
- Voltage - Output (Max):
- 4.18V
- Current - Output:
- 2A
- Frequency - Switching:
- 2.5MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-WLP (1.83x2.13)
MAX77801HEWP+T FAQ
1.How can I place an order for MAX77801HEWP+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77801HEWP+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77801HEWP+T reliable?
The price and inventory of MAX77801HEWP+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77801HEWP+T is usually 5 days.
3.What payment methods are accepted for MAX77801HEWP+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77801HEWP+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77801HEWP+T?
MAX77801HEWP+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77801HEWP+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77801HEWP+T?
For technical support, including MAX77801HEWP+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77801HEWP+T requirements.
6.How does Aetrix verify that MAX77801HEWP+T is sourced from the original manufacturer or authorized distributors?
All MAX77801HEWP+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77801HEWP+T meets industry standards.
7.What is the process for return or replacement of MAX77801HEWP+T?
All MAX77801HEWP+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77801HEWP+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77801HEWP+T part is unused and in its original packaging.
Return procedure for MAX77801HEWP+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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