My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX77812AEWB+T
- Part No.:
- MAX77812AEWB+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 64-WFBGA, WLBGA
- Datasheet:
-
MAX77812AEWB+T.pdf
- Description:
- IC REG BUCK ADJ 20A QUAD 64WLP
- Quantity:
- Payment:
- Shipping:
Inventory:1,935
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
The MAX77812AEWB+T from Analog Devices is a quad-phase, user-configurable buck converter delivering up to 20A total output current (5A per phase) with programmable phase configurations (1Φ–4Φ), 0.25V–1.525V output voltage range in 5mV steps, and ±0.5% initial accuracy via differential sensing-designed for powering high-performance processors in space-constrained Li-ion battery systems.
For engineers reviewing the MAX77812AEWB+T datasheet, MAX77812AEWB+T pinout, MAX77812AEWB+T application, or MAX77812AEWB+T equivalent, this device supports I²C (3.4MHz) and SPI (30MHz) configuration, offers enhanced transient response (ETR), programmable soft-start/stop slew rates, and thermal/short-circuit protection-critical for CPU/GPU power delivery in AR/VR headsets and portable electronics.
Technical Context
The MAX77812AEWB+T employs adaptive on-time PWM control with SKIP and forced-PWM modes to optimize light-load and heavy-load efficiency across its 2.5V–5.5V input range. Its four independent synchronous buck stages support dynamic phase shedding and reconfiguration via PH_CFG[2:0] pins and register settings.
Differential remote sensing at each output ensures tight DC regulation, while enhanced transient response (ETR) enables sub-50mV droop during 100A/µs load steps. Programmable current limits (3.0A–7.2A PMOS peak, 2.0A–5.8A NMOS valley) allow inductor optimization without sacrificing safety margins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.5V to 5.5V - supports single-cell Li-ion (2.7V–4.2V) with margin for voltage sag and boost-bypass scenarios. |
| VOUT Range | 0.250V to 1.525V in 5mV steps - covers core voltages for modern CPUs, GPUs, and FPGAs with fine-grained digital control. |
| Max Output Current | 20A total (5A per phase) - scalable via 5 user-selectable phase configurations (1Φ–4Φ) to match processor DVFS requirements. |
| Output Accuracy | ±0.5% initial accuracy with differential sensing - eliminates board-level resistive divider errors and improves system-level voltage margining. |
| Efficiency | 91% peak (VIN=3.8V, VOUT=1.1V) - achieved via low RDS(ON) (32mΩ PMOS / 15mΩ NMOS) and adaptive on-time control. |
| Interface | 3.4MHz I²C or 30MHz SPI - enables real-time dynamic voltage scaling (DVS) and fault reporting without MCU polling overhead. |
| Package | 3.408mm × 3.368mm, 64-bump WLP (0.4mm pitch) - ultra-compact footprint for high-density mobile PCB layouts. |
Pinout & Package
Package: 3.408mm × 3.368mm wafer-level package (WLP) with 64 bumps, 0.4mm pitch, bottom-side solder balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN12, IN34 | Input power supply inputs | Split VIN rails reduce high-current trace length and improve thermal distribution across package corners. |
| LX1–LX4 | Power switch node outputs | Four independent switching nodes enable flexible multi-phase or isolated single-output configurations. |
| PGND1–PGND4 | Phase-specific power ground returns | Separate PGND paths minimize ground bounce and improve EMI performance in high-dI/dt operation. |
| SNS1P–SNS4P / SNS1N–SNS4N | Differential output voltage sense inputs | Enables Kelvin sensing for ±0.5% accuracy regardless of PCB copper resistance or layout asymmetry. |
| PH_CFG0–PH_CFG2 | Hardware phase configuration select | Three-pin binary encoding sets startup phase count (1Φ–4Φ); overrides register setting at power-on reset. |
| I2C_SPI_SEL, SCL, SDA/MOSI, MISO, SCS | Dual-mode serial interface control | Hardware-selectable I²C/SPI avoids protocol conflicts; dedicated logic allows boot-time configuration before firmware initialization. |
| EN, CE | Enable and chip-enable controls | Asynchronous EN enables fast sequencing; CE provides hardware-level shutdown with 2µA standby current. |
| IRQB | Open-drain interrupt output | Active-low signal flags overtemperature, overcurrent, UVLO, or POK faults-enables system-level fault handling without polling. |
Key Features
| Feature | Design Value |
|---|---|
| Programmable ramp-up/down slew rates | Configurable soft-start/stop from 1.25mV/µs to 60mV/µs - prevents inrush current damage and meets processor AVS timing windows. |
| Enhanced transient response (ETR) | Reduces load-step droop to ≤45mV (0.1A→4A, 100A/µs) - maintains SoC stability during burst-mode execution without oversized bulk capacitance. |
| 5 user-selectable phase configurations | Supports 1Φ (5A), 2Φ (10A), 3Φ (15A), 4Φ (20A), or asymmetric 2Φ+1Φ+1Φ - matches dynamic power demand while minimizing switching losses. |
| Auto (SKIP/PWM) and forced-PWM modes | SKIP mode reduces no-load current to 120µA (4Φ); forced-PWM ensures fixed frequency for EMI filtering predictability. |
| Integrated protections | UVLO (2.375V–2.625V), thermal shutdown (165°C), short-circuit detection, and NMOS negative current limiting (−2A) - eliminates need for external fault management circuitry. |
Applications
| Application 1 | Application 2 |
|---|---|
|
Use Scenario: Powering ARM-based application processors (e.g., Qualcomm Snapdragon, MediaTek Dimensity) in premium smartphones and tablets. IC Role / Device Role / Timing Role: Primary core voltage regulator delivering dynamically scaled VDD_CPU (0.6V–1.2V) with sub-100ns transient response. Use Value: Enables aggressive DVFS without voltage droop-induced crashes; 3.4mm² WLP saves >15mm² PCB area versus discrete multi-phase solutions. |
Use Scenario: Supplying FPGA fabric and I/O banks in compact edge AI accelerators (e.g., Xilinx Zynq UltraScale+). IC Role / Device Role / Timing Role: Configurable quad-phase buck providing separate 0.85V (core) and 1.1V (I/O) rails with independent sequencing. Use Value: Phase reconfiguration supports partial reconfiguration power profiles; differential sensing guarantees <±10mV rail tolerance at full load. |
| Application 3 | Application 4 |
|
Use Scenario: VR headset SoC power delivery where thermal density and EMI must be minimized in near-eye form factors. IC Role / Device Role / Timing Role: Single-chip 20A solution replacing dual 10A converters, with ETR and low-noise FPWM mode for display timing stability. Use Value: 91% peak efficiency reduces thermal load by >1.2W vs. legacy solutions; 30MHz SPI enables real-time eye-tracking voltage adjustments. |
Use Scenario: High-end gaming handhelds (e.g., Steam Deck successors) requiring rapid CPU/GPU voltage transitions during gameplay. IC Role / Device Role / Timing Role: Multi-phase buck with programmable DVS ramp rates (1.25–60mV/µs) synchronized to GPU clock domain. Use Value: Eliminates need for external DAC + LDO combo; 5mV output resolution supports precise binning-aware voltage tuning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-phase buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65988DHAR | Single-chip USB-C PD controller + dual 10A buck; lacks quad-phase flexibility and differential sensing. | Optimized for USB-C power delivery systems, not standalone processor core rails. | Choose when USB-C port power negotiation and policy engine integration are required alongside regulation. |
| ISL91222AIRZ-T | Quad-phase buck with 20A capability but only 2.7V–5.5V input, no SPI interface, and fixed 0.3V–1.5V VOUT range. | Targeted at industrial IoT gateways with less aggressive DVFS needs and lower EMI sensitivity. | Choose when I²C-only control suffices and board-level thermal constraints permit larger 4.0mm × 4.0mm QFN package. |
Compared with TPS65988DHAR and ISL91222AIRZ-T, the MAX77812AEWB+T uniquely combines quad-phase configurability, differential sensing accuracy, SPI+I²C dual-interface flexibility, and the smallest WLP footprint-making it optimal for next-gen mobile SoC power where size, precision, and dynamic control are co-prioritized.
Availability
MAX77812AEWB+T is available at Aetrix Electronics and suitable for CPU/GPU power delivery, AR/VR headset designs, and Li-ion battery-powered portable electronics requiring stable component supply and long-term production continuity.
Supply support for MAX77812AEWB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing technologies, serving industrial, automotive, communications, and consumer markets.
The MAX77812AEWB+T belongs to Analog Devices' MAX® power management portfolio, engineered specifically for high-current, space-constrained mobile and wearable applications demanding precision, efficiency, and configurability.
FAQ
What is the maximum continuous output current supported by the MAX77812AEWB+T?
The MAX77812AEWB+T delivers up to 20A total continuous output current, distributed across four phases (5A per phase). Per-phase RMS current is rated at 5A for VIN ≥ 3.2V and 4A for VIN < 3.2V, with junction temperature limited to +115°C for reliable long-term operation. The MAX77812AEWB+T achieves this using low RDS(ON) power stages (32mΩ PMOS / 15mΩ NMOS) and thermally optimized WLP packaging.
Does the MAX77812AEWB+T support both I²C and SPI interfaces simultaneously?
No-the MAX77812AEWB+T supports either I²C or SPI, selected at power-on via the I2C_SPI_SEL pin. When I2C_SPI_SEL is low, the device operates in I²C mode (up to 3.4MHz high-speed mode); when high, it uses SPI mode (up to 30MHz). Both interfaces share SCL/SDA and MOSI/MISO/SCS pins respectively, preventing concurrent use. The MAX77812AEWB+T includes dedicated logic inputs to enable hardware-based interface selection without firmware dependency.
How does the MAX77812AEWB+T achieve ±0.5% output voltage accuracy?
The MAX77812AEWB+T achieves ±0.5% initial output voltage accuracy through differential remote sensing (SNSxP/SNSxN pairs per phase), which measures voltage directly at the load point and rejects PCB trace IR drops. This accuracy holds under forced-PWM mode with VOUT ≥ 0.65V and 0mA load. For lower voltages (0.45V–0.6V), accuracy is specified as ±6mV. The MAX77812AEWB+T also includes line/load regulation specs (±0.005V/V and −0.001V/A) confirming stability across operating conditions.
Can the MAX77812AEWB+T be configured for asymmetric phase operation (e.g., 2Φ + 1Φ + 1Φ)?
Yes-the MAX77812AEWB+T supports five user-selectable phase configurations: 1Φ, 2Φ, 3Φ, 4Φ, and 2Φ+1Φ+1Φ (asymmetric). This is set via PH_CFG[2:0] pins at power-on reset and can be modified dynamically via I²C/SPI registers. Asymmetric mode allows optimized current sharing across heterogeneous loads (e.g., CPU core + GPU + memory rails) while maintaining independent voltage control per phase. The MAX77812AEWB+T's independent LX nodes and sensing paths make this topology fully supported in hardware and firmware.
What thermal protection features does the MAX77812AEWB+T include?
The MAX77812AEWB+T integrates three thermal protection layers: thermal shutdown at +165°C (with 15°C hysteresis), thermal interrupt alerts at +120°C and +140°C (configurable via register), and junction temperature monitoring accessible over I²C/SPI. All protections trigger automatic phase shedding or full shutdown depending on severity. The device's 33.2°C/W θJA (JEDEC 4-layer board) and WLP package ensure efficient heat transfer to the PCB. The MAX77812AEWB+T also reports die temperature digitally, enabling predictive thermal throttling in host firmware.
MAX77812AEWB+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 64-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 4
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.25V
- Voltage - Output (Max):
- 1.525V
- Current - Output:
- 20A
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-WLP (3.41x3.37)
MAX77812AEWB+T FAQ
1.How can I place an order for MAX77812AEWB+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77812AEWB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77812AEWB+T reliable?
The price and inventory of MAX77812AEWB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77812AEWB+T is usually 5 days.
3.What payment methods are accepted for MAX77812AEWB+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77812AEWB+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77812AEWB+T?
MAX77812AEWB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77812AEWB+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77812AEWB+T?
For technical support, including MAX77812AEWB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77812AEWB+T requirements.
6.How does Aetrix verify that MAX77812AEWB+T is sourced from the original manufacturer or authorized distributors?
All MAX77812AEWB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77812AEWB+T meets industry standards.
7.What is the process for return or replacement of MAX77812AEWB+T?
All MAX77812AEWB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77812AEWB+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77812AEWB+T part is unused and in its original packaging.
Return procedure for MAX77812AEWB+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX77812AEWB+T Tags
-
TPS562201DDCR
Texas Instruments
-
MC34063ABD-TR
STMicroelectronics
-
TPS561201DDCR
Texas Instruments
-
MC33063ADR
Texas Instruments
-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments
-
AP3012KTR-G1
Diodes Incorporated
-
TLV61048DBVR
Texas Instruments
-
AZ34063UMTR-G1
Diodes Incorporated
-
TPS562200DDCR
Texas Instruments
-
AP62300TWU-7
Diodes Incorporated
-
MC34063EBD-TR
STMicroelectronics
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
