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Analog Devices Inc./Maxim Integrated MAX77812BEWB+T
- Part No.:
- MAX77812BEWB+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 64-WFBGA, WLBGA
- Datasheet:
-
MAX77812BEWB+T.pdf
- Description:
- IC REG BUCK ADJ 20A QUAD 64WLP
- Quantity:
- Payment:
- Shipping:
Inventory:1,957
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Product details
Overview
MAX77812BEWB+T from Analog Devices is a quad-phase, user-configurable buck converter delivering up to 20A total output current (5A per phase) with programmable phase configurations (1Φ–4Φ), 0.25V–1.525V output voltage range in 5mV steps, and ±0.5% initial accuracy via differential sensing-designed for powering high-performance processors in space-constrained Li-ion battery systems.
For engineers reviewing the MAX77812BEWB+T datasheet, MAX77812BEWB+T pinout, MAX77812BEWB+T application, or MAX77812BEWB+T equivalent, this device supports adaptive on-time PWM control, 3.4MHz I²C/30MHz SPI configuration, enhanced transient response (ETR), programmable soft-start/stop slew rates, and thermal/short-circuit protection-critical for CPU/GPU power delivery in AR/VR headsets and portable electronics.
Technical Context
The MAX77812BEWB+T implements an adaptive on-time PWM controller with SKIP and forced-PWM modes, enabling >90% peak efficiency at 3.8VIN/1.1VOUT. Its four independent synchronous buck stages support dynamic phase reconfiguration (e.g., 4Φ→2Φ+2Φ→1Φ+1Φ+1Φ+1Φ) via PH_CFG[2:0] pins and I²C/SPI registers, optimizing efficiency across load ranges from 1mA to 20A.
Differential remote sensing on all four outputs ensures ±0.5% DC accuracy; enhanced transient response (ETR) reduces load-step droop to ≤45mV (0.1A→4A, 100A/µs); programmable ramp-up/down slew rates (1.25–60mV/µs) and startup/shutdown sequencing enable precise inrush control during power-state transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.5V to 5.5V - supports single-cell Li-ion (3.0V–4.35V) with 200mV headroom for dropout and ripple. |
| Max Output Current | 20A total (5A per phase) - enables high-current core rail delivery without external parallel controllers. |
| VOUT Range & Resolution | 0.250V to 1.525V in 5mV steps - matches modern SoC core voltage requirements with fine-grained margining. |
| Output Accuracy | ±0.5% initial accuracy with differential sensing - eliminates board-level resistive divider errors for stable core regulation. |
| Control Interface | 3.4MHz I²C or 30MHz SPI - allows real-time dynamic voltage scaling (DVS) and telemetry readback in high-speed systems. |
| Thermal Protection | 165°C shutdown with 15°C hysteresis - prevents permanent damage during sustained overload or poor PCB thermal design. |
| Package | 3.408mm × 3.368mm, 64-bump WLP (0.4mm pitch) - ultra-compact footprint for mobile and wearable form factors. |
Pinout & Package
MAX77812BEWB+T uses a 3.408mm × 3.368mm, 64-bump wafer-level package (WLP) with 0.4mm pitch. Pin functions are validated per Analog Devices MAX77812 datasheet Rev 12 (2022).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN12, IN34 | Input Power Supply Inputs | Split VIN rails reduce high-current path inductance; each pair powers two phases (IN12→LX1/LX2, IN34→LX3/LX4). |
| LX1–LX4 | Switch Node Outputs | Four independent high-frequency switching nodes driving external inductors; support active discharge via internal 100–200Ω pull-down. |
| PGND1–PGND4 | Phase-Specific Power Grounds | Separate ground returns per phase minimize ground bounce and improve EMI performance in multi-phase operation. |
| SNS1P–SNS4P / SNS1N–SNS4N | Differential Output Voltage Sense Inputs | Enables remote sensing at load point; rejects PCB IR drop to maintain ±0.5% regulation accuracy under dynamic load. |
| PH_CFG0–PH_CFG2 | Hardware Phase Configuration Inputs | Three-pin binary encoding selects one of five phase configurations (e.g., 110 = 2Φ+2Φ) at power-on before I²C/SPI initialization. |
| I2C_SPI_SEL, SCL, SDA/MOSI, MISO, SCS | Digital Interface Control | Selects I²C vs. SPI mode; supports standard/fast/fast-plus/high-speed I²C (up to 3.4MHz) and 30MHz SPI for fast register access. |
| EN, CE | Enable & Chip Enable | Asynchronous EN starts soft-start sequence; CE provides hardware global shutdown with 2µA quiescent current. |
| GPI0, GPI1 | General-Purpose Inputs | Configurable as status inputs or additional phase-control signals; internally pulled down (400–1600kΩ) for robust noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| 5 User-selectable phase configurations | Supports 1Φ, 2Φ, 3Φ, 4Φ, and asymmetric splits (e.g., 2Φ+1Φ+1Φ) - adapts regulator topology to real-time SoC power states. |
| Enhanced Transient Response (ETR) | Reduces load-step voltage droop to ≤45mV (0.1A→4A, 100A/µs) - maintains core voltage stability during sudden CPU frequency boosts. |
| Programmable soft-start/stop slew rates | Adjustable from 1.25mV/µs to 60mV/µs via B_SS_SR/B_SD_SR registers - prevents inrush current damage to input capacitors and PMICs. |
| Auto (SKIP/PWM) and forced PWM modes | SKIP mode achieves 120µA no-load supply current in 4Φ config; forced PWM ensures fixed-frequency operation for predictable EMI filtering. |
| Differential remote sensing per phase | Compensates for PCB trace resistance up to 20mΩ - delivers ±0.5% output accuracy at the SoC VDD pin, not just at IC pins. |
| Integrated protections | Includes UVLO (2.375V–2.625V), short-circuit detection, and thermal shutdown (165°C) with interrupt reporting via IRQB pin. |
Applications
| Application 1 | Application 2 |
|---|---|
|
Use Scenario: Powering ARM-based application processors (e.g., Qualcomm Snapdragon, MediaTek Dimensity) in premium smartphones. IC Role / Device Role / Timing Role: Primary core voltage regulator supplying CPU/GPU clusters with dynamic voltage scaling (DVS) via I²C. Use Value: 20A capability and 4-phase interleaving reduce output ripple and inductor size; ETR ensures stable voltage during burst-mode AI inference workloads. |
Use Scenario: VR headset SoC power delivery where thermal density and board area are severely constrained. IC Role / Device Role / Timing Role: Single-chip quad-phase buck supplying multiple voltage domains (core, GPU, memory I/O) from a 3.8V Li-ion cell. Use Value: 3.408mm × 3.368mm WLP package fits beneath display flex; differential sensing maintains accuracy despite long, narrow PCB traces to SoC. |
| Application 3 | Application 4 |
|
Use Scenario: Portable gaming console main SoC rail (e.g., NVIDIA Tegra, AMD Zen-based APU). IC Role / Device Role / Timing Role: High-efficiency, dynamically reconfigurable buck converter managing load transients during graphics-intensive gameplay. Use Value: Programmable phase shedding (e.g., 4Φ→1Φ at idle) cuts light-load current to 120µA; 91% peak efficiency extends battery runtime. |
Use Scenario: Industrial edge AI camera module requiring reliable 0.85V core rail from 3.6V nominal battery. IC Role / Device Role / Timing Role: Robust power stage with thermal/short-circuit protection and ±0.5% accuracy for vision processor uptime. Use Value: 165°C thermal shutdown and 15°C hysteresis prevent field failures; UVLO lockout avoids brownout-induced firmware corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad-phase buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ8633BGLE-Z (Monolithic Power Systems) | 4-phase, 20A, 2.7V–16V input, 0.5V–5.5V output; uses analog current-mode control instead of adaptive on-time; no differential sensing. | Targets higher-input industrial systems (12V bus); lacks ETR and programmable phase splitting - less suited for mobile DVS. | Choose MPQ8633BGLE-Z when input voltage exceeds 5.5V or when analog control loop tuning is preferred over digital configurability. |
| TPS65988DHFR (Texas Instruments) | USB-C PD controller + dual 10A buck (20A combined); integrates USB PD protocol stack; 2.7V–24V input; no WLP package (40-pin QFN). | Designed for USB-C powered devices with Type-C port management; not a standalone quad-phase buck - requires companion PD policy engine. | Choose TPS65988DHFR only when USB-C power delivery negotiation and dual-rail generation are required alongside high-current buck conversion. |
Compared with MPQ8633BGLE-Z and TPS65988DHFR, the MAX77812BEWB+T uniquely combines ultra-compact WLP packaging, differential remote sensing per phase, and hardware-programmable phase topology - making it optimal for battery-powered mobile SoCs where board area, accuracy, and dynamic load response are critical.
Availability
MAX77812BEWB+T is available at Aetrix Electronics and suitable for CPU/GPU power delivery, AR/VR headset designs, and Li-ion battery-powered portable electronics requiring stable component supply and full production traceability.
Supply support for MAX77812BEWB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, communications, and power management markets.
The MAX77812BEWB+T belongs to Analog Devices' MAX® power management portfolio, engineered specifically for high-current, low-voltage, space-constrained mobile and wearable applications demanding dynamic phase control and millivolt-level regulation accuracy.
FAQ
What is the maximum continuous output current supported by the MAX77812BEWB+T?
The MAX77812BEWB+T supports up to 20A total continuous output current, distributed across four phases (5A per phase). This rating assumes junction temperature remains ≤115°C under specified thermal conditions (θJA = 33.2°C/W on a 4-layer board); exceeding this limit reduces expected lifetime.
Does the MAX77812BEWB+T support differential voltage sensing, and why does it matter?
Yes, the MAX77812BEWB+T supports differential sensing on all four outputs (SNSxP/SNSxN pairs). This compensates for IR drop across PCB traces between the IC and load, ensuring ±0.5% output voltage accuracy at the SoC power pin-not just at the regulator's output terminals-critical for stable core voltage under dynamic loads.
How does the MAX77812BEWB+T achieve enhanced transient response (ETR)?
The MAX77812BEWB+T implements ETR through optimized control-loop bandwidth and fast-response error amplifiers. In testing, it limits voltage droop to ≤45mV during 0.1A→4A load steps at 100A/µs, enabling reliable operation during sudden CPU frequency scaling events without requiring oversized output capacitance.
Can the MAX77812BEWB+T be configured without I²C or SPI communication?
Yes-the MAX77812BEWB+T supports hardware-based phase configuration using PH_CFG0–PH_CFG2 pins at power-on, allowing selection of five predefined topologies (e.g., 4Φ, 2Φ+2Φ) without any digital interface. I²C/SPI is required only for dynamic reconfiguration, telemetry, or advanced features like ETR enablement.
What package type and dimensions does the MAX77812BEWB+T use?
The MAX77812BEWB+T uses a 3.408mm × 3.368mm, 64-bump wafer-level package (WLP) with 0.4mm pitch. This ultra-compact, near-chip-scale footprint minimizes PCB area and parasitic inductance-ideal for thin mobile and wearable devices where board space is at a premium.
MAX77812BEWB+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 64-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 4
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.25V
- Voltage - Output (Max):
- 1.525V
- Current - Output:
- 20A
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-WLP (3.41x3.37)
MAX77812BEWB+T FAQ
1.How can I place an order for MAX77812BEWB+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77812BEWB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77812BEWB+T reliable?
The price and inventory of MAX77812BEWB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77812BEWB+T is usually 5 days.
3.What payment methods are accepted for MAX77812BEWB+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77812BEWB+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77812BEWB+T?
MAX77812BEWB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77812BEWB+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77812BEWB+T?
For technical support, including MAX77812BEWB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77812BEWB+T requirements.
6.How does Aetrix verify that MAX77812BEWB+T is sourced from the original manufacturer or authorized distributors?
All MAX77812BEWB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77812BEWB+T meets industry standards.
7.What is the process for return or replacement of MAX77812BEWB+T?
All MAX77812BEWB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77812BEWB+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77812BEWB+T part is unused and in its original packaging.
Return procedure for MAX77812BEWB+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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