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Analog Devices Inc./Maxim Integrated MAX77812CEWB+T
- Part No.:
- MAX77812CEWB+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 64-WFBGA, WLBGA
- Datasheet:
-
MAX77812CEWB+T.pdf
- Description:
- IC REG BUCK ADJ 20A QUAD 64WLP
- Quantity:
- Payment:
- Shipping:
Inventory:1,523
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Product details
Overview
MAX77812CEWB+T from Analog Devices is a quad-phase, user-configurable buck converter delivering up to 20A total output current (5A per phase) with programmable phase configurations (1Φ–4Φ), 0.25V–1.525V output voltage range in 5mV steps, and ±0.5% initial accuracy via differential sensing-designed for powering high-performance processors in space-constrained Li-ion battery systems.
For engineers reviewing the MAX77812CEWB+T datasheet, MAX77812CEWB+T pinout, MAX77812CEWB+T application, or MAX77812CEWB+T equivalent, key selection considerations include adaptive on-time PWM control, 3.4MHz I²C/30MHz SPI configurability, enhanced transient response (ETR), programmable soft-start/stop slew rates, and thermal/short-circuit protection in a 3.408mm × 3.368mm WLP package.
Technical Context
The MAX77812CEWB+T implements an adaptive on-time PWM architecture with SKIP and low-power SKIP modes to maximize light-load efficiency. Its four independent buck power stages support dynamic reconfiguration across five phase combinations (e.g., 4Φ, 3Φ+1Φ, 2Φ+2Φ) under firmware control via I²C/SPI, enabling optimal trade-offs between output ripple, transient response, and thermal distribution.
Differential remote sensing ensures tight DC regulation, while Enhanced Transient Response (ETR) actively adjusts duty cycle during load steps to minimize droop. Programmable current limits (PMOS peak: 4.8A–7.2A; NMOS valley: 3.2A–5.8A) and ramp-up/down slew rates (1.25–60 mV/µs) allow precise inrush and stability tuning for CPU/GPU core rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.5V to 5.5V - supports single-cell Li-ion (3.0V–4.4V) with headroom for voltage sag and charging transients. |
| VOUT Range | 0.250V to 1.525V in 5mV steps - enables precise core voltage setting for modern SoCs and FPGAs. |
| Max Output Current | 20A total (5A per phase) - scalable via phase configuration to match processor DVFS requirements. |
| Peak Efficiency | 91% at VIN=3.8V, VOUT=1.1V - reduces thermal load in compact portable enclosures. |
| Control Interface | 3.4MHz I²C or 30MHz SPI - enables real-time dynamic voltage scaling and fault reporting in system management firmware. |
| Package | 64-bump WLP, 3.408mm × 3.368mm, 0.4mm pitch - ultra-compact footprint for high-density mobile PCB layouts. |
| Thermal Protection | 165°C shutdown with 15°C hysteresis - prevents permanent damage during sustained overload or poor heatsinking. |
Pinout & Package
MAX77812CEWB+T uses a 3.408mm × 3.368mm, 64-bump wafer-level package (WLP) with 0.4mm pitch. Pin assignments are validated per Analog Devices' MAX77812 datasheet Rev 12 (October 2022).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN12 / IN34 | Input voltage supply (Phase pairs) | Two independent input rails: IN12 powers phases 1 & 2; IN34 powers phases 3 & 4 - enables dual-input source separation or redundancy. |
| LX1–LX4 | Switch node outputs | Four high-frequency switching nodes driving external inductors - each supports up to 5A RMS continuous current. |
| PGND1–PGND4 | Power ground returns | Dedicated phase-specific power grounds minimize ground bounce and improve EMI performance. |
| SNS1P–SNS4P / SNS1N–SNS4N | Differential output voltage sense inputs | Remote sensing per phase enables ±0.5% accuracy despite PCB IR drop - critical for sub-1V core rails. |
| PH_CFG0–PH_CFG2 / I2C_SPI_SEL | Hardware configuration pins | Set initial phase configuration and interface mode at power-on - allows boot-time hardware-defined behavior without firmware dependency. |
| VSYS / VIO / SYS / AGND / DGND | Supply and reference domains | VSYS (2.5–5.5V) powers power stages; VIO (1.65–1.8V) powers digital logic; AGND/DGND separation maintains analog integrity. |
| CE / EN / LPM / IRQB | Enable, control, and status signals | CE enables global operation; EN controls individual regulator startup; LPM selects low-power mode; IRQB flags faults (thermal, overcurrent, UVLO). |
Key Features
| Feature | Design Value |
|---|---|
| 5 User-selectable phase configurations | Enables runtime optimization: 4Φ for 20A high-current loads, 2Φ+2Φ for balanced thermal distribution, or 1Φ×4 for independent rail control. |
| Enhanced Transient Response (ETR) | Reduces load-step voltage droop to ≤45mV (0.1A→4A, 100A/µs) - maintains core stability during CPU burst activity without oversized bulk capacitance. |
| Programmable soft-start/stop slew rates | Configurable from 1.25 to 60 mV/µs - prevents inrush current damage to input capacitors and avoids brownout on shared power rails. |
| Differential remote sensing per phase | Delivers ±0.5% output accuracy at point-of-load - eliminates voltage error caused by PCB trace resistance in high-current paths. |
| 3.4MHz I²C + 30MHz SPI interfaces | Supports fast register access and real-time telemetry (voltage, current, temperature) - essential for closed-loop system power management. |
| UVLO, short-circuit, and thermal protections | Automatically disables affected phase(s) during fault events - preserves system uptime and prevents cascading failures in multi-rail designs. |
Applications
| Application 1 | Application 2 |
|---|---|
|
Use Scenario: Powering ARM-based application processors (e.g., Qualcomm Snapdragon, MediaTek Dimensity) in premium smartphones and tablets. IC Role / Device Role: Primary core voltage regulator supplying CPU/GPU clusters with dynamic voltage/frequency scaling (DVFS). Use Value: 20A capacity and 5mV output resolution enable precise compliance with SoC VID tables; ETR minimizes voltage droop during AI acceleration bursts. |
Use Scenario: Supplying configurable logic and memory rails in Xilinx/Zynq UltraScale+ FPGAs used in AR/VR headsets. IC Role / Device Role: Multi-rail buck controller delivering independent, sequenced voltages to PL, PS, and transceiver banks. Use Value: Programmable startup/shutdown sequence ensures correct power-up order; 3.408mm × 3.368mm WLP fits within tight optical module PCB area budgets. |
| Application 3 | Application 4 |
|
Use Scenario: Core power delivery for NVIDIA Jetson Orin modules in edge AI robotics and autonomous drones. IC Role / Device Role: High-efficiency, thermally robust step-down converter handling peak 18A loads during neural network inference. Use Value: 91% peak efficiency reduces heat generation in sealed enclosures; thermal interrupt at 120°C enables graceful throttling before shutdown. |
Use Scenario: Main system rail in portable medical imaging devices requiring stable, low-noise power for ADCs and RF front-ends. IC Role / Device Role: Low-ripple, tightly regulated supply for sensitive analog signal chains adjacent to digital processing units. Use Value: Forced PWM mode achieves ≤5mVP-P output ripple; differential sensing rejects noise coupling from high-speed digital sections. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-phase buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP2174GQ-Z | 4-phase, 16A max, 2.7–16V input, no differential sensing, only I²C (1MHz), larger QFN-24 package (4mm × 4mm) | Lacks ETR, phase reconfiguration, and sub-1V accuracy - suitable for less demanding industrial MCU rails but not SoC core supplies. | Select when cost sensitivity outweighs precision and transient performance; verify layout compatibility with larger footprint. |
| TPS65988DHAR | Integrated USB-C PD controller + dual 12A buck (24A total), 3–24V input, proprietary interface, BGA-113 package | Combines PD negotiation and power delivery - ideal for USB-C powered devices but inflexible for standalone processor core rails. | Choose only if USB-C power delivery and protocol handling are required; not a drop-in replacement for discrete core rail use cases. |
Compared with MP2174GQ-Z and TPS65988DHAR, the MAX77812CEWB+T uniquely delivers 20A with ±0.5% accuracy, ETR, and hardware-programmable phase topology in a 3.4mm × 3.4mm WLP - making it the only option meeting stringent mobile SoC power integrity requirements.
Availability
MAX77812CEWB+T is available at Aetrix Electronics and suitable for CPU/GPU power delivery, FPGA core rail design, and Li-ion battery-powered portable electronics requiring stable component supply and long-term production continuity.
Supply support for MAX77812CEWB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Wilmington, MA.
The MAX77812 belongs to Analog Devices' MAX® Power Management family, engineered specifically for high-current, space-constrained mobile and embedded processor applications demanding precision regulation, fast transient response, and flexible configuration.
FAQ
What is the maximum continuous output current supported by the MAX77812CEWB+T?
The MAX77812CEWB+T supports up to 20A total continuous output current, distributed across four phases (5A per phase). This rating assumes proper thermal management - junction temperature must be maintained ≤115°C for full 5A/phase operation. At higher temperatures, derating applies per the datasheet's thermal characteristics table.
Does the MAX77812CEWB+T support differential remote sensing, and why does it matter?
Yes, the MAX77812CEWB+T supports differential remote sensing on all four output phases (SNSxP/SNSxN pins). This feature measures voltage directly at the load, rejecting IR drop across PCB traces - enabling ±0.5% initial output accuracy even at 5A per phase, which is essential for sub-1V SoC core rails where 10mV error can cause functional failure.
How does the Enhanced Transient Response (ETR) function in the MAX77812CEWB+T improve system stability?
ETR in the MAX77812CEWB+T dynamically adjusts PWM duty cycle during rapid load steps (e.g., CPU burst from idle to full load), reducing output voltage droop to ≤45mV (0.1A→4A, 100A/µs). This eliminates need for excessive local bulk capacitance and maintains core voltage within specification during transient events - critical for reliable operation of high-performance processors.
Can the MAX77812CEWB+T be configured for different phase arrangements, and how is this done?
Yes, the MAX77812CEWB+T supports five user-selectable phase configurations (4Φ, 3Φ+1Φ, 2Φ+2Φ, 2Φ+1Φ+1Φ, 1Φ×4) via hardware pins (PH_CFG0–PH_CFG2) at power-on or through I²C/SPI registers during operation. This allows designers to optimize for current capacity, thermal spread, or independent rail control without changing hardware.
What protection features are integrated into the MAX77812CEWB+T?
The MAX77812CEWB+T integrates comprehensive protection: input undervoltage lockout (UVLO) with 2.375V–2.625V threshold, per-phase overcurrent detection (PMOS peak/NMOS valley limits), thermal shutdown at 165°C (15°C hysteresis), and thermal interrupts at 120°C and 140°C. Faults trigger IRQB assertion and optional automatic phase disable to preserve system integrity.
MAX77812CEWB+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 64-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 4
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.25V
- Voltage - Output (Max):
- 1.525V
- Current - Output:
- 20A
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-WLP (3.41x3.37)
MAX77812CEWB+T FAQ
1.How can I place an order for MAX77812CEWB+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77812CEWB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77812CEWB+T reliable?
The price and inventory of MAX77812CEWB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77812CEWB+T is usually 5 days.
3.What payment methods are accepted for MAX77812CEWB+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77812CEWB+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77812CEWB+T?
MAX77812CEWB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77812CEWB+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77812CEWB+T?
For technical support, including MAX77812CEWB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77812CEWB+T requirements.
6.How does Aetrix verify that MAX77812CEWB+T is sourced from the original manufacturer or authorized distributors?
All MAX77812CEWB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77812CEWB+T meets industry standards.
7.What is the process for return or replacement of MAX77812CEWB+T?
All MAX77812CEWB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77812CEWB+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77812CEWB+T part is unused and in its original packaging.
Return procedure for MAX77812CEWB+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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