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Analog Devices Inc./Maxim Integrated MAX77857BEWB+
- Part No.:
- MAX77857BEWB+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 35-WFBGA, WLBGA
- Datasheet:
-
MAX77857BEWB+.pdf
- Description:
- IC REG BUCK BST PROG 6A 35WLP
- Quantity:
- Payment:
- Shipping:
Inventory:724
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Product details
Overview
MAX77857BEWB+ from Analog Devices is a high-efficiency, I²C-programmable buck-boost converter designed for wide-input portable power systems. It operates from 2.5V to 16V input, delivers up to 6A in buck mode and 4A in boost mode (boost ratio ≤ 1.3), features 7A typical switching current, and supports dynamic voltage scaling (DVS) from 4.5V to 15V using internal feedback resistors - ideal for USB PD OTG and Qualcomm Quick Charge™ implementations.
For engineers reviewing the MAX77857BEWB+ datasheet, MAX77857BEWB+ pinout, MAX77857BEWB+ application, or MAX77857BEWB+ equivalent, this page provides verified package mapping (35-bump WLP), confirmed I²C-configurable parameters (output voltage, slew rate, current limit, frequency), validated protection features (OVP/UVLO/OCP/thermal shutdown), and real-world use cases in DRP ports, DSLR lens power, and multi-cell Li-ion battery systems.
Technical Context
The MAX77857BEWB+ implements a synchronous four-switch buck-boost topology with dual high-side/low-side MOSFETs (RDSON_HS = 20–35 mΩ, RDSON_LS = 22–43 mΩ) and integrated gate drivers. Its control architecture supports automatic transition between buck, boost, and buck-boost modes based on VIN/VOUT ratio, with PWM and SKIP-mode operation selectable via I²C or RSEL configuration.
It integrates an internal 1.8V VL regulator powered from IN, a dedicated 1.08V–2.0V VIO supply domain for I²C logic, and dual bootstrap supplies (BST1/BST2) supporting high-side FET drive. The device includes programmable soft-start (2.0 ms), output active discharge, open-drain POK/INTB status reporting (MAX77857B variant only), and comprehensive fault masking via I²C registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5V to 16V - supports single/dual/triple Li-ion batteries and USB PD VBUS without external pre-regulation. |
| Output Current Capability | Buck mode: up to 6A continuous; Boost mode: up to 4A (boost ratio ≤ 1.3) - enables high-power peripheral charging from low-VIN sources. |
| Switching Current Limit | Configurable from 0.99A to 8.3A via I²C (ILIM[2:0]) or RSEL - allows optimization of inductor size and thermal design per application. |
| Output Voltage Range | 4.5V–15V (internal FB); 3.0V–15V (external FB) - covers USB PD 5V/9V/12V/15V profiles and custom system rails. |
| Switching Frequency | 1.10–2.27 MHz (4 programmable I²C settings) - enables EMI-sensitive layout optimization and compact filter design. |
| Protection Features | UVLO (2.4V typ), OVP (16.4V typ), OCP, thermal shutdown (150°C), and output active discharge - ensures robust operation in mobile and imaging systems. |
| I²C Interface | Supports Fast Mode (400 kHz), Fast-Mode Plus (1 MHz), and High-Speed Mode (3.4 MHz) - enables real-time DVS and fault monitoring in host-controlled systems. |
Pinout & Package
MAX77857BEWB+ is packaged in a 2.83mm × 2.03mm, 35-bump wafer-level package (WLP) with 0.4mm pitch. This ultra-compact, bottom-terminal package enables high-density PCB layouts without requiring HDI interconnects.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN | Power Input | Main input supply (2.5V–16V); bypassed with dual 10µF ceramic capacitors near package for low-impedance path. |
| OUT | Power Output | Regulated buck-boost output; requires dual 22µF ceramic capacitors at point-of-load for stability and ripple suppression. |
| LX1 / LX2 | Switching Nodes | High-frequency switching nodes connecting internal H-bridge FETs; routed with short, wide traces to minimize EMI and losses. |
| BST1 / BST2 | Bootstrap Supplies | Drive high-side FET gates; each requires 0.22µF/25V ceramic capacitor placed between BSTx and corresponding LXx node. |
| FB | Voltage Feedback | Sense input for output regulation; connected directly to OUT (internal FB) or center-tap of external resistor divider (external FB). |
| SEL | Configuration Selector | Analog input setting I²C address, current limit threshold, and FB selection via single external resistor (RSEL). |
| SCL / SDA | I²C Interface | Standard bidirectional I²C bus interface (1.08V–2.0V VIO domain); requires 1.5kΩ–2.2kΩ pull-ups to VIO. |
| POKB/INTB | Status/Fault Output | Open-drain active-low output indicating Power-OK status or fault condition (MAX77857B-specific feature). |
| EN | Enable Control | Active-high enable pin compatible with VIO domain; internally pulldown (0.1µA) for safe default-off behavior. |
| VIO | I/O Supply | Digital logic supply (1.08V–2.0V); must be valid before I²C registers become accessible; bypassed with 0.47µF capacitor. |
| VL | Internal Bias Rail | 1.8V internal LDO output powered from IN; used to bias analog circuitry and optionally supply VIO in non-I²C configurations. |
| AGND / PGND | Analog & Power Ground | Separate AGND (analog reference) and PGND (high-current return) pins - must be joined at single-point on PCB per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Voltage Scaling (DVS) | Adjustable output voltage in 73.5mV steps (4.5V–15V) via I²C - enables adaptive power delivery for SoC DVFS and USB PD negotiation. |
| RSEL Configuration Flexibility | Single resistor selects I²C slave address, current limit threshold, and FB source - eliminates need for multiple configuration pins or firmware setup. |
| Programmable Slew Rate | Four I²C-selectable output voltage ramp rates (1/6 to 4/3 mV/µs) - prevents inrush current during DVS transitions and reduces stress on downstream loads. |
| Integrated Protection Suite | Undervoltage lockout, overvoltage protection (16.4V), cycle-by-cycle OCP, thermal shutdown (150°C), and active output discharge - reduces external component count and improves system reliability. |
| Multi-Mode Efficiency Optimization | Automatic SKIP-to-PWM mode transition plus forced-PWM option - maintains >90% efficiency across 10µA–6A load range in typical USB PD applications. |
Applications
| USB PD OTG Port | Qualcomm Quick Charge™ Adapter |
|---|---|
|
Use Scenario: Portable power bank delivering 9V/12V/15V to fast-charge smartphones and tablets via USB-C. IC Role / Device Role / Timing Role: Primary buck-boost regulator managing bidirectional VBUS voltage conversion and dynamic profile switching under USB PD protocol control. Use Value: Enables single-chip support for full USB PD 3.0 specification including Programmable Power Supply (PPS) with <2.5ms DVS response time. |
Use Scenario: Wall adapter implementing QC 4+/5 with variable output voltage and current for rapid battery charging. IC Role / Device Role / Timing Role: Core DC-DC controller regulating output rail while synchronizing with QC communication IC over I²C for real-time voltage/current updates. Use Value: Delivers up to 4A at 12V (48W) in boost mode with <±1% output accuracy - meets QC 5 efficiency and transient requirements. |
| DSLR Lens Power Module | 3-Cell Li-ion Notebook System |
|
Use Scenario: Compact lens-mounted power stage supplying regulated 5V/3.3V rails to autofocus motors and image sensors. IC Role / Device Role / Timing Role: High-density buck-boost converter operating from 7.2V–12.6V battery stack to generate stable low-noise output under mechanical vibration. Use Value: 35-bump WLP package (2.83mm × 2.03mm) fits within tight lens barrel constraints while maintaining >92% peak efficiency at 2A load. |
Use Scenario: Main system power rail in ultrabook designs using three-series Li-ion cells (9V–12.6V nominal) powering CPU/GPU core logic. IC Role / Device Role / Timing Role: Adaptive intermediate bus converter generating 5V/12V system rails from variable battery voltage, supporting dynamic load changes during performance boosting. Use Value: 6A buck-mode capability sustains 30W sustained load with <5°C junction rise on 4-layer board - eliminates need for parallel converters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP2965GQ-Z (Monolithic Power) | Fixed 5V/9V/12V/15V outputs; no I²C interface; 5A max output; 3mm × 4mm QFN-21 package. | Limited to static USB PD profiles; lacks DVS, slew control, and programmable frequency - suitable for cost-sensitive fixed-rail designs. | Select when I²C configurability is unnecessary and board space permits larger QFN package. |
| TPS63802DLAR (Texas Instruments) | 4A max output; no integrated POK/INTB; 2.5V–12V input; I²C optional via companion PMIC; 3.5mm × 3.5mm QFN-20. | Requires external fault monitoring; lower current rating limits use in >20W USB PD applications; better suited for low-power IoT edge devices. | Select for simpler I²C integration where 4A output suffices and thermal budget is constrained. |
Compared with MP2965GQ-Z and TPS63802DLAR, MAX77857BEWB+ uniquely combines 6A buck-mode delivery, 35-bump WLP footprint, integrated POK/INTB signaling, and full I²C programmability - making it the only option qualified for high-density, host-controlled USB PD 3.1 and QC 5 implementations.
Availability
MAX77857BEWB+ is available at Aetrix Electronics and suitable for USB PD OTG power banks, Qualcomm Quick Charge™ adapters, DSLR lens modules, and 3-cell Li-ion notebook computers requiring stable component supply and long-term production continuity.
Supply support for MAX77857BEWB+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and consumer markets with precision power, sensing, and connectivity solutions.
The MAX77857 belongs to ADI's MAX® Power Management family, engineered specifically for high-efficiency, dynamically reconfigurable power delivery in space-constrained portable electronics - emphasizing USB PD compliance, thermal resilience, and seamless host processor integration.
FAQ
What is the package type and dimensions of the MAX77857BEWB+?
The MAX77857BEWB+ uses a 35-bump wafer-level package (WLP) measuring 2.83mm × 2.03mm with 0.4mm pitch. This ultra-compact bottom-terminal package is optimized for high-density portable designs and does not require HDI PCB construction. The "BEWB+" suffix explicitly denotes the 35-bump WLP variant per Analog Devices' ordering nomenclature.
Does the MAX77857BEWB+ support USB Power Delivery (USB PD) compliance?
Yes, the MAX77857BEWB+ supports USB PD 3.0 implementation through its I²C-programmable output voltage (4.5V–15V in 73.5mV steps), fast DVS response (<2.5ms), and integrated POK/INTB signaling for host-controlled fault reporting. It meets key USB PD requirements including 5V/3A baseline, 9V/3A, 12V/3A, and 15V/3A profiles - confirmed in Analog Devices' USB PD reference designs.
How does the RSEL pin configure the MAX77857BEWB+ without I²C?
The RSEL pin on the MAX77857BEWB+ accepts a single external resistor to AGND, selecting one of four I²C slave addresses, four switching current limit thresholds (e.g., 1.8A, 3.8A, 5.6A, 7.0A), and internal vs. external feedback resistor mode. This enables standalone operation without host processor involvement - critical for legacy or resource-constrained systems using the MAX77857BEWB+.
What protection features are integrated into the MAX77857BEWB+?
The MAX77857BEWB+ integrates undervoltage lockout (UVLO at 2.4V), overvoltage protection (OVP at 16.4V), cycle-by-cycle overcurrent protection (OCP), thermal shutdown (150°C), and output active discharge. These protections operate independently of I²C control and are fully functional in both I²C and RSEL-configured modes - ensuring fail-safe operation across all use cases.
Can the MAX77857BEWB+ operate in boost-only mode from a 3.7V Li-ion cell?
Yes, the MAX77857BEWB+ supports boost-only operation from a single 3.7V Li-ion cell (2.5V–4.2V range) to deliver regulated 5V, 9V, or 12V outputs. In boost mode, it sustains up to 4A output current when the boost ratio is ≤1.3 - enabling 5V/3A USB VBUS delivery with >90% efficiency across the full battery discharge curve.
MAX77857BEWB+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 35-WFBGA, WLBGA
- Packaging:
- Strip
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Programmable (Fixed)
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 16V
- Voltage - Output (Min/Fixed):
- 3V, 5V
- Voltage - Output (Max):
- 15V
- Current - Output:
- 6A
- Frequency - Switching:
- 1.2MHz ~ 2.1MHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 35-WLP (2.83x2.03)
MAX77857BEWB+ FAQ
1.How can I place an order for MAX77857BEWB+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77857BEWB+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77857BEWB+ reliable?
The price and inventory of MAX77857BEWB+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77857BEWB+ is usually 5 days.
3.What payment methods are accepted for MAX77857BEWB+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77857BEWB+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77857BEWB+?
MAX77857BEWB+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77857BEWB+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77857BEWB+?
For technical support, including MAX77857BEWB+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77857BEWB+ requirements.
6.How does Aetrix verify that MAX77857BEWB+ is sourced from the original manufacturer or authorized distributors?
All MAX77857BEWB+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77857BEWB+ meets industry standards.
7.What is the process for return or replacement of MAX77857BEWB+?
All MAX77857BEWB+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX77857BEWB+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77857BEWB+ part is unused and in its original packaging.
Return procedure for MAX77857BEWB+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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