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Analog Devices Inc./Maxim Integrated MAX77857BEWB+T
- Part No.:
- MAX77857BEWB+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 35-WFBGA, WLBGA
- Datasheet:
-
MAX77857BEWB+T.pdf
- Description:
- IC REG BUCK BST PROG/3V 6A 35WLP
- Quantity:
- Payment:
- Shipping:
Inventory:4,399
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Product details
Overview
MAX77857BEWB+T from Analog Devices is a high-efficiency, I²C-programmable buck-boost converter designed for USB PD OTG, Quick Charge, and dual-role power (DRP) ports. It operates across 2.5V–16V input, delivers up to 6A in buck mode and 4A in boost mode (boost ratio ≤1.3), features 7A switching current capability, and supports dynamic voltage scaling (DVS) from 4.5V to 15V using internal feedback resistors.
For engineers reviewing the MAX77857BEWB+T datasheet, MAX77857BEWB+T pinout, MAX77857BEWB+T application, or MAX77857BEWB+T equivalent, key selection criteria include its 35-bump WLP package (2.83mm × 2.03mm), RSEL-configurable slave address and current limit, integrated POK/INTB fault reporting, and support for FPWM/SKIP mode operation with programmable slew rate and switching frequency.
Technical Context
The MAX77857BEWB+T implements a synchronous four-switch buck-boost topology with dual LX nodes (LX1/LX2), integrated high-side and low-side MOSFETs (RDSON_HS = 20–35mΩ, RDSON_LS = 22–43mΩ), and adaptive control logic that automatically selects buck, boost, or buck-boost mode based on VIN/VOUT relationship. Its architecture supports seamless transitions between modes without output discontinuity.
It integrates an I²C interface (Fast Mode/Plus/High-Speed capable) with priority over RSEL configuration, enabling real-time DVS, current limit adjustment (8-step ILIM[2:0] coding), and FPWM activation. The device includes dedicated VL regulator (1.65–1.89V), VIO-supplied logic domain (1.08–2.0V), and open-drain POKB/INTB output for system-level power sequencing and fault monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5V to 16V - supports single-cell Li-ion to 3-cell battery stacks and wide-input industrial rails. |
| Output Current (Buck) | Up to 6A continuous - enables high-power USB VBUS delivery without external current sharing. |
| Output Current (Boost) | Up to 4A at boost ratio ≤1.3 - sustains regulated output during low-VIN conditions (e.g., battery sag). |
| Switching Current | 7A typical - defines peak inductor current handling and determines external component sizing. |
| I²C Programmability | Full DVS, slew rate, ILIM, fSW, FPWM - enables runtime optimization of efficiency, EMI, and transient response. |
| Package | 2.83mm × 2.03mm, 35-bump WLP - ultra-compact footprint for space-constrained mobile and portable designs. |
| Thermal Resistance (θJA) | 49°C/W (4-layer board) - informs thermal design margin for 6A continuous operation at TJ ≤105°C. |
Pinout & Package
MAX77857BEWB+T uses a 2.83mm × 2.03mm, 0.4mm pitch, 35-bump wafer-level package (WLP) with bump-side-down mounting. Thermal performance is optimized via PGND and IN bumps distributed across the die edge for low-inductance power loop routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN | Power Input | Main input supply node (2.5V–16V); requires dual 10μF ceramic bypassing close to package. |
| OUT | Power Output | Regulated buck-boost output; routed to point-of-load with dual 22μF ceramic capacitors. |
| LX1 / LX2 | Switching Nodes | Connect to external inductor; each drives one half of the 4-switch topology; require BST1/BST2 bootstrap caps. |
| BST1 / BST2 | Bootstrap Supplies | Drive high-side FET gates; each requires 0.22μF/25V ceramic cap tied to respective LX node. |
| FB | Voltage Feedback | Senses output either internally (5V default) or externally (3V–15V range); high-impedance analog input. |
| SEL | Configuration Selector | Analog input setting I²C address, current limit threshold, and FB resistor selection via single external resistor. |
| SCL / SDA | I²C Interface | Standard bidirectional I²C bus pins; operate in VIO domain (1.08–2.0V); require 1.5kΩ–2.2kΩ pullups to VIO. |
| POKB/INTB | Fault Monitor | Open-drain active-low output signaling Power-OK status or fault interrupt (OCP/OVP/THS); requires 15kΩ pullup to VIO. |
| VIO | Logic Supply | Digital core supply (1.08–2.0V); must be valid before I²C registers become accessible; resets IC if invalid. |
| VL | Internal Bias Rail | 1.65–1.89V regulated output powering internal analog circuitry; bypassed with 2.2μF capacitor to AGND. |
| EN | Enable Control | Active-high enable with internal 0.1μA pulldown; compatible with VIO logic levels; initiates startup sequence when asserted. |
| AGND / PGND | Ground Returns | Separate analog and power ground pins; must be connected on PCB with low-impedance copper pour per layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Wide Input Range Operation | 2.5V–16V input enables direct integration with multi-cell Li-ion, USB-C PD, and industrial 12V rails without pre-regulation. |
| Dynamic Voltage Scaling (DVS) | I²C-adjustable output from 4.5V–15V in 73.5mV steps allows precise load matching and adaptive power management. |
| RSEL Configuration Flexibility | Single resistor on SEL pin sets I²C address, current limit (4 options), and internal/external FB selection-reducing BOM count. |
| Integrated Fault Protection | UVLO, OCP, OVP, thermal shutdown, and output active discharge ensure robust operation under fault and transient conditions. |
| Multi-Mode Efficiency Optimization | Automatic SKIP-to-FPWM transition and programmable fSW (1.1–2.27MHz) maximize light-load and full-load efficiency simultaneously. |
| Compact Wafer-Level Packaging | 35-bump WLP (2.83mm × 2.03mm) achieves <5.8mm² solution area-ideal for slim smartphones, tablets, and DSLR lens modules. |
Applications
| USB Power Delivery (USB-PD) OTG | Qualcomm® Quick Charge™ |
|---|---|
Use Scenario: Portable power bank delivering 5V/3A or 9V/2A to USB-C devices using a single-cell or dual-cell Li-ion source. IC Role / Device Role / Timing Role: Primary buck-boost regulator managing VBUS voltage and current negotiation via I²C-controlled DVS and current limit. Use Value: Eliminates need for separate buck and boost converters, reduces solution size by >40%, and enables fast-charging compliance without firmware overhead. |
Use Scenario: Smartphone fast-charging subsystem adapting input from wall adapter (5–12V) to dynamically scaled battery charge voltage (e.g., 8.4V–12V). IC Role / Device Role / Timing Role: System-level power rail generator with real-time voltage ramping and current profiling synchronized to QC protocol handshake. Use Value: Achieves sub-100ms voltage transitions with controlled slew rate, minimizing inrush stress and meeting QC3.0/4.0 timing requirements. |
| USB Dual-Role Power (DRP) Port | DSLR Lens Power Management |
Use Scenario: Laptop or tablet USB-C port supporting simultaneous host/peripheral roles with automatic direction detection and VBUS sourcing/sinking. IC Role / Device Role / Timing Role: Bidirectional power path controller providing regulated VBUS during source mode and sink-mode current limiting. Use Value: Enables seamless role swap with no output glitch; POKB/INTB signals coordinate system-level power state transitions. |
Use Scenario: Compact lens module requiring stable 5V or 8V rail from variable camera body supply (3.0–16V) during autofocus and image stabilization. IC Role / Device Role / Timing Role: High-density local power regulator with soft-start, active discharge, and thermal-aware current limiting. Use Value: Maintains clean, low-noise output under mechanical vibration; 35-bump WLP fits within tight lens barrel height constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX77854AEWB+T | Same 35-bump WLP package and I²C interface, but fixed 5V output (no DVS), lower 4A max output current, and no POKB/INTB pin. | Targeted at cost-sensitive USB OTG designs where dynamic voltage control is unnecessary. | Select MAX77854AEWB+T only when DVS, higher current, or fault interrupt capability are not required. |
| TPS63802DLAR | 3.0mm × 3.0mm QFN-16, 2.5V–13V input, 5A max output, no I²C, no POK, no RSEL configuration. | Used in industrial and automotive applications where serial control and compact WLP are not critical. | Choose TPS63802DLAR for non-I²C systems needing simpler bring-up and higher temperature rating (–40°C to +125°C). |
Compared with MAX77857BEWB+T, the MAX77854AEWB+T sacrifices programmability and current capability for lower cost and smaller footprint, while the TPS63802DLAR trades I²C flexibility and fault visibility for ruggedized packaging and broader ambient temperature tolerance.
Availability
MAX77857BEWB+T is available at Aetrix Electronics and suitable for USB PD OTG power banks, Qualcomm Quick Charge smartphone subsystems, and DSLR lens modules requiring stable component supply, high-density integration, and production-ready I²C programmability.
Supply support for MAX77857BEWB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, communications, and power management markets.
The MAX77857BEWB+T belongs to Analog Devices' MAX77xxx family of highly integrated PMICs targeting mobile and portable electronics, specifically engineered for USB-C DRP, fast charging, and compact high-efficiency power conversion.
FAQ
What is the package type and dimensions of the MAX77857BEWB+T?
The MAX77857BEWB+T uses a 35-bump wafer-level package (WLP) measuring 2.83mm × 2.03mm with 0.4mm pitch. This ultra-compact footprint is optimized for space-constrained mobile applications such as smartphones, tablets, and DSLR lens assemblies. The part number suffix "BEWB+T" explicitly denotes this 35-bump WLP variant, distinguishing it from the 31-bump WLP and 16-pin FC2QFN versions.
Does the MAX77857BEWB+T support dynamic voltage scaling (DVS) and how is it implemented?
Yes, the MAX77857BEWB+T supports full dynamic voltage scaling via its I²C interface. Output voltage is adjusted by programming the internal reference voltage (VREF) register (0x3D–0xCC), enabling 73.5mV steps from 4.5V to 15V with internal feedback resistors. The MAX77857BEWB+T also supports programmable slew rate (four settings) to control ramp time and prevent inrush-related instability during transitions.
What protection features are integrated into the MAX77857BEWB+T?
The MAX77857BEWB+T integrates undervoltage lockout (UVLO), overcurrent protection (OCP), overvoltage protection (OVP), thermal shutdown (TSHDN), and output active discharge. It also provides open-drain POKB/INTB signaling for system-level fault reporting. These protections operate independently of I²C control and remain active in both SKIP and FPWM modes, ensuring robustness across all operating conditions.
Can the MAX77857BEWB+T operate without an I²C interface?
Yes, the MAX77857BEWB+T supports standalone operation using the SEL pin. A single external resistor configures the default output voltage (via internal/external feedback selection), I²C slave address, and switching current limit threshold. In this mode, the device starts with fixed parameters and operates in SKIP or FPWM mode based on load, eliminating dependency on host processor initialization.
What is the maximum continuous output current capability of the MAX77857BEWB+T in buck and boost modes?
In buck mode, the MAX77857BEWB+T delivers up to 6A continuous output current; in boost mode (with boost ratio ≤1.3), it delivers up to 4A. These ratings assume proper thermal management-junction temperature limited to +105°C-and use of recommended external components (e.g., 1.5μH inductor, dual 22μF output capacitors). The 7A switching current rating defines peak inductor current handling capability.
MAX77857BEWB+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 35-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Programmable (Fixed)
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 16V
- Voltage - Output (Min/Fixed):
- 3V (5V)
- Voltage - Output (Max):
- 15V
- Current - Output:
- 6A
- Frequency - Switching:
- 1.2MHz, 1.5MHz, 1.8MHz, 2.1MHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 35-WLP (2.83x2.03)
MAX77857BEWB+T FAQ
1.How can I place an order for MAX77857BEWB+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77857BEWB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77857BEWB+T reliable?
The price and inventory of MAX77857BEWB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77857BEWB+T is usually 5 days.
3.What payment methods are accepted for MAX77857BEWB+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77857BEWB+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77857BEWB+T?
MAX77857BEWB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77857BEWB+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77857BEWB+T?
For technical support, including MAX77857BEWB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77857BEWB+T requirements.
6.How does Aetrix verify that MAX77857BEWB+T is sourced from the original manufacturer or authorized distributors?
All MAX77857BEWB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77857BEWB+T meets industry standards.
7.What is the process for return or replacement of MAX77857BEWB+T?
All MAX77857BEWB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77857BEWB+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77857BEWB+T part is unused and in its original packaging.
Return procedure for MAX77857BEWB+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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