My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX77857CEWB+T
- Part No.:
- MAX77857CEWB+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 35-WFBGA, WLBGA
- Datasheet:
-
MAX77857CEWB+T.pdf
- Description:
- IC REG BUCK BST PROG/3V 6A 35WLP
- Quantity:
- Payment:
- Shipping:
Inventory:1,818
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX77857CEWB+T from Analog Devices is a high-efficiency, I²C-programmable buck-boost converter designed for USB PD OTG, Quick Charge, and dual-role power (DRP) ports. It operates across 2.5V–16V input, delivers up to 6A in buck mode and 4A in boost mode (boost ratio ≤1.3), features 7A switching current capability, and supports dynamic voltage scaling (DVS) from 4.5V to 15V using internal feedback or 3V–15V with external resistors.
For engineers reviewing the MAX77857CEWB+T datasheet, MAX77857CEWB+T pinout, MAX77857CEWB+T application, or MAX77857CEWB+T equivalent, this device is critical for compact, thermally constrained systems requiring wide-input, programmable output voltage, fast transient response, and integrated protection - especially in notebook, tablet, and DSLR lens power architectures.
Technical Context
The MAX77857CEWB+T implements a synchronous 4-switch buck-boost topology with dual high-side/low-side MOSFETs (RDSON_HS = 20–35 mΩ, RDSON_LS = 22–43 mΩ) and supports automatic transition between buck, boost, and buck-boost modes based on VIN/VOUT ratio. Its control loop uses an error amplifier with internal compensation and supports both SKIP mode for light-load efficiency and forced-PWM (FPWM) mode for low-noise operation.
It integrates a 1.8V VL regulator powered from IN, a dedicated 1.08V–2.0V VIO supply domain for I²C logic, and configurable fault handling including overvoltage (VOVP = 15.85–16.95V), overcurrent (ILIM = 0.99–8.3A via I²C or RSEL), thermal shutdown (TSHDN_R = 150°C), and undervoltage lockout (VUVLO_R = 2.3–2.5V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5V to 16V - supports single-cell Li-ion up to 3-cell battery stacks and USB PD input rails without pre-regulation. |
| Output Current (Buck) | Up to 6A continuous - enables high-power USB VBUS delivery (e.g., 5V/3A or 9V/2A) with minimal thermal derating at TJ ≤ 105°C. |
| Output Current (Boost) | Up to 4A at boost ratio ≤1.3 - sustains stable 5V/3A output from 3.3V input (e.g., USB-C DRP sourcing from low-VIN sources). |
| Switching Current | 7A typical - defines peak inductor current capability and enables use of smaller magnetics in high-power density designs. |
| I²C Programmability | Full DVS, slew rate, ILIM, fSW (1.1–2.27 MHz), FPWM, and POK mask - allows real-time system-level power policy adaptation without hardware change. |
| Protection Features | UVLO, OCP (valley & peak), OVP (15.85–16.95V), thermal shutdown (150°C), and active output discharge - eliminates need for external supervision circuitry. |
| Package | 2.83mm × 2.03mm, 35-bump WLP - ultra-compact footprint optimized for HDI PCBs in space-constrained mobile applications. |
Pinout & Package
MAX77857CEWB+T is packaged in a 2.83mm × 2.03mm, 0.4mm pitch, 35-bump wafer-level package (WLP) with bottom-side bumps. This ultra-small form factor targets high-density portable electronics where board area is at a premium.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN | Power Input | Main input supply (2.5V–16V); requires dual 10μF ceramic bypass capacitors close to pins A13/B13. |
| OUT | Power Output | Regulated buck-boost output; connects to two 22μF ceramic capacitors for low-ESR filtering and transient response. |
| LX1 / LX2 | Switching Nodes | High-frequency switching nodes driving internal HS/LS FETs; require tight layout to PGND and BST capacitor placement. |
| BST1 / BST2 | Bootstrap Supplies | Drive high-side gate drivers; each requires 0.22μF/25V ceramic capacitor tied directly to respective LX pin. |
| FB | Voltage Feedback | Sense point for output regulation; connects to output (internal FB) or center-tap of external resistor divider (external FB). |
| SEL | Configuration Input | Analog pin setting I²C address, current limit threshold, and FB selection via single external resistor (e.g., 536Ω). |
| SCL / SDA | I²C Interface | Standard open-drain I²C bus (Fast/Plus/High-Speed modes); require 1.5kΩ–2.2kΩ pull-ups to VIO. |
| VIO | I/O Supply | 1.08V–2.0V digital core supply; registers held in reset if voltage invalid; bypassed with 0.47μF ceramic capacitor. |
| VL | Internal LDO Output | 1.65–1.89V regulated supply for analog blocks; bypassed with 2.2μF/10V ceramic capacitor to AGND. |
| PGND / AGND | Ground Returns | Separate power and analog grounds; must be connected on PCB with low-inductance path per layout guidelines. |
| EN | Enable Control | Active-high enable referenced to VIO; internally pulldown (0.1μA); supports VIN-sourced startup sequencing. |
| POKB/INTB | Status/Interrupt | Open-drain output indicating POK status or fault condition; requires 15kΩ pull-up to VIO. |
Key Features
| Feature | Design Value |
|---|---|
| Wide Input Range (2.5V–16V) | Enables direct integration with diverse sources - single-cell Li-ion (2.7–4.2V), USB-C PD (5–20V), and industrial 12V rails - eliminating intermediate converters. |
| Dual-Mode Buck-Boost Topology | Seamlessly transitions between buck, boost, and buck-boost without output disruption, maintaining regulation during VIN crossing VOUT. |
| I²C-Controlled Dynamic Voltage Scaling | Adjusts output voltage in 73.5mV steps (4.5V–15V) post-startup to match processor DVFS states or peripheral requirements in real time. |
| Configurable Switching Current Limit (0.99A–8.3A) | Four RSEL-selectable or eight I²C-programmable thresholds allow optimization of inductor size, thermal margin, and surge tolerance per application. |
| Integrated Power-OK and Fault Interrupt | POKB/INTB pin provides system-level monitoring of output validity and faults (OVP/OCP/thermal), enabling rapid host-controller response without polling. |
| Active Output Discharge | Discharges VOUT through internal 5mA sink when EN is deasserted or VIN drops below UVLO, preventing floating outputs and ensuring safe power-down sequencing. |
Applications
| USB Power Delivery (USB-PD) OTG | Qualcomm® Quick Charge™ |
|---|---|
Use Scenario: Portable power bank delivering 5V/3A, 9V/2A, or 12V/1.5A to smartphones via USB-C cable. IC Role / Device Role / Timing Role: Primary buck-boost regulator managing bidirectional power flow, voltage negotiation, and dynamic load step response. Use Value: Supports full USB PD 3.0 specification with programmable VOUT and fast DVS ramping (configurable slew rate), reducing adapter dependency and enabling compact all-in-one designs. |
Use Scenario: Smartphone fast-charging subsystem adapting input from wall adapter (5–12V) to optimal battery charge voltage (4–4.4V). IC Role / Device Role / Timing Role: System power rail generator providing dynamically scaled output to charging IC or PMIC, synchronized with QC protocol handshaking. Use Value: Delivers up to 6A at 5V or 4A at 9V with <1.5% load regulation, minimizing conversion loss and thermal stress during high-current charging bursts. |
| USB Dual-Role Power (DRP) Port | DSLR Lens Power Management |
Use Scenario: Laptop or tablet USB-C port acting as both power source (DFP) and sink (UFP) depending on cable attachment. IC Role / Device Role / Timing Role: Bidirectional buck-boost controller enabling seamless role swap while maintaining stable 5V VBUS under varying load and input conditions. Use Value: Eliminates need for separate buck and boost ICs; supports <100μs mode transition and maintains POK assertion during reconfiguration. |
Use Scenario: Compact lens module requiring precise 3.3V, 5V, or 7.4V rails from camera body battery (7.2–8.4V nominal). IC Role / Device Role / Timing Role: High-density power solution delivering multiple regulated outputs with minimal footprint and low EMI. Use Value: 2.83mm × 2.03mm WLP package fits within lens barrel constraints; 48.3°C/W θJA enables passive cooling; supports soft-start and active discharge for lens motor safety. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MP2965GQ-Z (Monolithic Power) | 4-switch buck-boost, 3.3V–36V input, 5A max output, no integrated I²C interface; uses external resistor programming only. | Lacks dynamic voltage scaling and real-time current limit adjustment; suited for fixed-output, cost-sensitive industrial applications. | Select when I²C control is unnecessary and higher input voltage range (up to 36V) is required. |
| TPS63900RSVR (Texas Instruments) | Ultra-low IQ (75nA) buck-boost, 1.8V–5.5V input, 2A max output, I²C programmable but limited to 1.8V–5.5V VOUT range. | Optimized for always-on, battery-backed systems; insufficient for USB PD or Quick Charge due to narrow input/output range and lower current capability. | Select for energy-harvesting or coin-cell-powered devices where quiescent current dominates design priority. |
Compared with MP2965GQ-Z and TPS63900RSVR, the MAX77857CEWB+T uniquely combines wide 2.5V–16V input, 6A buck / 4A boost capability, full I²C configurability, and ultra-compact WLP packaging - making it the only option qualified for space-constrained, high-performance USB PD and Quick Charge implementations requiring dynamic power policy control.
Availability
MAX77857CEWB+T is available at Aetrix Electronics and suitable for USB PD OTG power banks, Qualcomm Quick Charge smartphone subsystems, and DSLR lens modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant wafer-level packaging.
Supply support for MAX77857CEWB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, communications, and power management markets.
The MAX77857 belongs to Analog Devices' high-efficiency, programmable power management IC portfolio, engineered specifically for mobile and portable systems demanding compact size, wide-input flexibility, and real-time adaptive power control.
FAQ
What is the default output voltage of the MAX77857CEWB+T when using internal feedback resistors?
The MAX77857CEWB+T defaults to 5V output voltage when configured with internal feedback resistors. This setting satisfies standard USB VBUS requirements out-of-the-box and can be modified dynamically via I²C to any value between 4.5V and 15V in 73.5mV steps. The internal reference voltage (VREF) is factory-trimmed to 0.333V at default code 0x44, ensuring ±2.0% accuracy in FPWM mode.
Does the MAX77857CEWB+T support both buck and boost operation simultaneously?
No - the MAX77857CEWB+T does not operate in true simultaneous buck-and-boost mode. Instead, it automatically selects the optimal topology (buck, boost, or buck-boost) based on instantaneous VIN and VOUT relationship, transitioning seamlessly between modes without output disruption. In buck mode, it delivers up to 6A; in boost mode (with boost ratio ≤1.3), up to 4A - all managed by a single control loop and shared power stage.
What package type is used for the MAX77857CEWB+T, and how many bumps does it have?
The MAX77857CEWB+T uses a 2.83mm × 2.03mm wafer-level package (WLP) with 35 solder bumps arranged in a grid pattern. This package variant corresponds to outline number 21-100367 and land pattern referenced in Application Note 1891. It is distinct from the 31-bump WLP and 16-pin FC2QFN variants, and the "CEWB" suffix explicitly denotes the 35-bump WLP configuration.
Can the MAX77857CEWB+T be used without connecting the I²C interface?
Yes - the MAX77857CEWB+T supports standalone operation without I²C. The SEL pin configures key parameters (slave address, current limit, FB selection) using a single external resistor. Default settings - including 5V output, 7A switching current limit, and 1.8MHz switching frequency - are active upon power-up. I²C remains optional and inactive unless SCL/SDA are pulled up and addressed, giving designers flexibility for simple or advanced configurations.
What protection features are integrated into the MAX77857CEWB+T?
The MAX77857CEWB+T integrates undervoltage lockout (UVLO), overcurrent protection (OCP) with valley and peak detection, overvoltage protection (OVP) with 15.85–16.95V trip threshold, thermal shutdown (150°C with 20°C hysteresis), and output active discharge. These functions operate autonomously without host intervention, and fault conditions can be monitored via the open-drain POKB/INTB pin, which asserts low on POK failure or OVP/OCP/thermal events.
MAX77857CEWB+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 35-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Programmable (Fixed)
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.5V
- Voltage - Input (Max):
- 16V
- Voltage - Output (Min/Fixed):
- 3V (5V)
- Voltage - Output (Max):
- 15V
- Current - Output:
- 6A
- Frequency - Switching:
- 1.2MHz, 1.5MHz, 1.8MHz, 2.1MHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 35-WLP (2.83x2.03)
MAX77857CEWB+T FAQ
1.How can I place an order for MAX77857CEWB+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77857CEWB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77857CEWB+T reliable?
The price and inventory of MAX77857CEWB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77857CEWB+T is usually 5 days.
3.What payment methods are accepted for MAX77857CEWB+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77857CEWB+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77857CEWB+T?
MAX77857CEWB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77857CEWB+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77857CEWB+T?
For technical support, including MAX77857CEWB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77857CEWB+T requirements.
6.How does Aetrix verify that MAX77857CEWB+T is sourced from the original manufacturer or authorized distributors?
All MAX77857CEWB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77857CEWB+T meets industry standards.
7.What is the process for return or replacement of MAX77857CEWB+T?
All MAX77857CEWB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77857CEWB+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77857CEWB+T part is unused and in its original packaging.
Return procedure for MAX77857CEWB+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX77857CEWB+T Tags
-
TPS562201DDCR
Texas Instruments
-
MC34063ABD-TR
STMicroelectronics
-
TPS561201DDCR
Texas Instruments
-
MC33063ADR
Texas Instruments
-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments
-
AP3012KTR-G1
Diodes Incorporated
-
TLV61048DBVR
Texas Instruments
-
AZ34063UMTR-G1
Diodes Incorporated
-
TPS562200DDCR
Texas Instruments
-
AP62300TWU-7
Diodes Incorporated
-
MC34063EBD-TR
STMicroelectronics
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
