Analog Devices Inc./Maxim Integrated MAX77874BEWM+T
- Part No.:
- MAX77874BEWM+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 48-WFBGA, WLBGA
- Datasheet:
-
MAX77874BEWM+T.pdf
- Description:
- IC REG BUCK PROG 16A 48WLP
- Quantity:
- Payment:

- Shipping:

Inventory:3,203
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX77874BEWM+T from Analog Devices is a quad-phase, 16A synchronous buck regulator designed for core power delivery to multicore CPU/GPU processors in mobile and embedded systems. It delivers I²C-programmable output voltage (0.25V–1.30V in 5mV steps), achieves ≤25mV load-transient droop in FPWM/Turbo-Skip modes, and operates from 2.7V–4.8V input across –40°C to +85°C.
For engineers reviewing the MAX77874BEWM+T datasheet, MAX77874BEWM+T pinout, MAX77874BEWM+T application, or MAX77874BEWM+T equivalent, key selection criteria include phase-interleaved transient response, programmable DVS ramp rates (up to 44 mV/μs), rotational phase spreading for light-load efficiency, and integrated thermal monitoring with 120°C/140°C alarms and 165°C shutdown.
Technical Context
The MAX77874BEWM+T implements a proprietary quad-phase PWM architecture with rotational phase spreading to minimize input/output ripple and improve light-load efficiency. Its Turbo Skip mode merges forced-PWM transient performance with skip-mode quiescent current (275–550 μA typical).
Control is fully I²C-based (Standard/Fast/HS-mode up to 3.4 MHz) with dedicated logic inputs for EN, DVS, and IRQ. Internal compensation, active discharge (100–140 Ω per phase), and zero-crossing current sensing (50–170 mA threshold) enable robust dynamic voltage scaling and seamless mode transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 16A total (4 × 4A phases); enables single-chip core rail for high-performance SoCs |
| Output Voltage Range | 0.25V–1.30V in 5mV steps; supports modern low-voltage CPU/GPU VDD rails |
| Input Voltage Range | 2.7V–4.8V; compatible with single-cell Li-ion/Li-poly battery systems |
| Transient Droop | ≤25mV (FPWM/Turbo-Skip), ≤40mV (Skip); ensures stable operation during CPU burst loads |
| VOUT Accuracy | ±2.5mV initial (0.9V), ±1.75% over line/temp; meets tight core voltage tolerance requirements |
| Switching Frequency | 1.9–2.1MHz (FPWM, no load); allows compact 0.22–0.47μF ceramic output capacitors |
| Thermal Protection | 120°C alarm, 140°C critical alarm, 165°C shutdown with 15°C hysteresis; prevents thermal runaway |
Pinout & Package
The MAX77874BEWM+T is housed in a 48-bump, 0.35mm pitch Wafer-Level Package (WLP), outline W482B2+1, optimized for ultra-compact PCB footprints in space-constrained mobile designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN, LX_A–LX_D | Main power input and phase switch nodes | Supports 4.3A RMS per LX; requires low-ESR input caps and proper thermal pad layout |
| SNS+, SNS− | Differential output voltage feedback | High-impedance (75–160kΩ) inputs enable remote sensing and noise rejection |
| VIO, SDA, SCL, IRQ, EN, DVS | I²C interface and control logic | VIO powers digital I/O (1.65–4.8V); IRQ signals faults; DVS triggers dynamic voltage scaling |
| PG_, AGND_, VDD_ANA, VDD_DIG | Power grounds and analog/digital supplies | Separate analog/digital supplies reduce noise coupling; PG_ is power ground reference |
| VCC, VPP | Main bias and high-side gate drive supplies | VCC (2.7–4.8V) powers control circuitry; VPP (up to 8V) drives high-side MOSFET gates |
Key Features
| Feature | Design Value |
|---|---|
| Turbo Skip Mode | Combines <25mV transient droop of FPWM with 275–550μA light-load IQ - eliminates efficiency/transient trade-off |
| Rotational Phase Spreading | Reduces input ripple by >50% vs. fixed-phase alignment; lowers required input capacitance |
| I²C Programmable Ramp Rates | Soft-start and DVS ramps configurable from 1.125 to 44 mV/μs - matches processor AVS timing requirements |
| Integrated Thermal Monitoring | Two independent thermal alarms (120°C/140°C) plus shutdown at 165°C - enables predictive thermal throttling |
| Active Discharge | 100–140Ω per-phase discharge path from LX to PG_ - ensures safe, rapid output discharge on disable |
Applications
| Smartphones & Tablets | Gaming & VR Headsets |
|---|---|
Use Scenario: Powering application processors (e.g., Snapdragon, Exynos) during camera capture, AI inference, or gaming bursts. IC Role / Device Role / Timing Role: Quad-phase core buck regulator delivering dynamically scaled VDD_CPU/VDD_GPU rails with sub-100ns fault response. Use Value: Enables 16A peak current within 0.5mm² WLP footprint while maintaining ≤25mV droop - critical for sustained multi-thread performance. |
Use Scenario: Supplying GPU and AI accelerator cores in standalone VR headsets requiring low-latency voltage scaling. IC Role / Device Role / Timing Role: High-bandwidth DVS controller with 1.5μs DVS-to-LX delay and programmable ramp rates up to 44 mV/μs. Use Value: Matches GPU DVFS timing windows without external DACs or sequencers - reduces BOM count and layout area. |
| AI Edge Cameras | Ultrabooks & Thin Clients |
Use Scenario: Powering vision SoCs (e.g., NVIDIA Jetson, Qualcomm QCS) during real-time machine vision processing. IC Role / Device Role / Timing Role: Core power IC with thermal alarm outputs feeding host MCU for adaptive frequency scaling. Use Value: 120°C/140°C thermal alarms allow firmware-controlled throttling before shutdown - preserves system responsiveness. |
Use Scenario: Delivering core voltage to Intel Core i-series or AMD Ryzen U-series CPUs in fanless ultrabooks. IC Role / Device Role / Timing Role: High-efficiency quad-phase regulator operating in Turbo Skip mode at light loads (<1A) and FPWM under load. Use Value: Achieves >90% efficiency at 1A and >85% at 10A (3.7VIN→0.9VOUT) - extends battery life without compromising burst performance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad-phase buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RTQ2134B-QA | 3.3V–5.5V input; 12A max; I²C + PMBus; no Turbo Skip mode; 30mV droop in forced-PWM | Targeted at automotive infotainment; AEC-Q100 qualified; higher VIN range but lower current capability | Choose for automotive-grade reliability where 12A suffices and PMBus is preferred over pure I²C. |
| ISL91302BIRZ-T | 2.5V–5.5V input; dual-output (2×6A); I²C; 20mV droop; no rotational phase spreading | Optimized for dual-rail SoCs (CPU + GPU); smaller 3.2mm × 3.2mm QFN; lacks thermal alarm granularity | Choose when dual independent outputs are needed and board space permits larger QFN vs. WLP. |
Compared with RTQ2134B-QA and ISL91302BIRZ-T, the MAX77874BEWM+T uniquely combines 16A capacity, Turbo Skip mode, rotational phase spreading, and fine-grained thermal alarms in a 2.1mm × 2.1mm WLP - making it optimal for space-constrained, high-transient mobile SoC applications.
Availability
MAX77874BEWM+T is available at Aetrix Electronics and suitable for smartphones, AI edge cameras, and ultrabooks requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for MAX77874BEWM+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Wilmington, MA.
The MAX77874BEWM+T belongs to Analog Devices' MAX® Power Management family, engineered specifically for high-current, low-voltage core power delivery in mobile and embedded multicore processors.
FAQ
What is the maximum output current capability of the MAX77874BEWM+T?
The MAX77874BEWM+T delivers up to 16A total output current across its four interleaved phases, with each phase rated for 4A RMS. This is achieved using integrated high-side (65mΩ) and low-side (16mΩ) MOSFET drivers, enabling direct connection to external power stages without external drivers. The device maintains this rating across the full –40°C to +85°C operating temperature range.
How does the Turbo Skip mode in the MAX77874BEWM+T improve efficiency without sacrificing transient response?
Turbo Skip mode in the MAX77874BEWM+T dynamically engages forced-PWM behavior during load transients to maintain ≤25mV droop, while reverting to skip-mode switching during steady-state light loads to achieve 275–550μA quiescent current. This hybrid control eliminates the traditional trade-off between light-load efficiency and transient performance - a key differentiator versus conventional buck regulators.
What package type and dimensions does the MAX77874BEWM+T use, and what are its PCB layout implications?
The MAX77874BEWM+T uses a 48-bump, 0.35mm pitch Wafer-Level Package (WLP) with outline W482B2+1 and nominal dimensions of 2.1mm × 2.1mm. Its ultra-compact size demands strict adherence to land pattern AN1891, including thermal via placement under the central die pad and controlled impedance routing for SNS+/SNS− traces to preserve feedback accuracy.
Can the MAX77874BEWM+T support dynamic voltage scaling (DVS) with precise timing control?
Yes, the MAX77874BEWM+T supports hardware-triggered DVS via the dedicated DVS pin, with programmable ramp rates from 1.125 to 44 mV/μs (via I²C registers BUCK0RSR[1:0]). The DVS-to-first-LX delay is fixed at 1.5μs, enabling tight synchronization with processor AVS timing windows - critical for energy-efficient operation in ARM big.LITTLE and similar architectures.
What thermal protection features are integrated into the MAX77874BEWM+T?
The MAX77874BEWM+T integrates three-tier thermal protection: a 120°C thermal alarm (TJ120), a 140°C critical alarm (TJ140), and a 165°C thermal shutdown (TJSHDN), each with defined hysteresis (5°C or 15°C). These outputs are accessible via IRQ pin assertion and I²C status registers, allowing host firmware to implement predictive throttling before reaching shutdown thresholds.
MAX77874BEWM+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 48-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Programmable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.7V
- Voltage - Input (Max):
- 4.8V
- Voltage - Output (Min/Fixed):
- 0.25V
- Voltage - Output (Max):
- 1.3V
- Current - Output:
- 16A
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WLP (2.22x2.92)
MAX77874BEWM+T FAQ
1.How can I place an order for MAX77874BEWM+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77874BEWM+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77874BEWM+T reliable?
The price and inventory of MAX77874BEWM+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77874BEWM+T is usually 5 days.
3.What payment methods are accepted for MAX77874BEWM+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77874BEWM+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77874BEWM+T?
MAX77874BEWM+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77874BEWM+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77874BEWM+T?
For technical support, including MAX77874BEWM+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77874BEWM+T requirements.
6.How does Aetrix verify that MAX77874BEWM+T is sourced from the original manufacturer or authorized distributors?
All MAX77874BEWM+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77874BEWM+T meets industry standards.
7.What is the process for return or replacement of MAX77874BEWM+T?
All MAX77874BEWM+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77874BEWM+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77874BEWM+T part is unused and in its original packaging.
Return procedure for MAX77874BEWM+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX77874BEWM+T Tags

-
TPS562201DDCR
Texas Instruments

-
MC34063ABD-TR
STMicroelectronics

-
TPS561201DDCR
Texas Instruments

-
MC33063ADR
Texas Instruments

-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments

-
AP3012KTR-G1
Diodes Incorporated

-
TLV61048DBVR
Texas Instruments

-
AZ34063UMTR-G1
Diodes Incorporated

-
TPS562200DDCR
Texas Instruments

-
AP62300TWU-7
Diodes Incorporated

-
MC34063EBD-TR
STMicroelectronics
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

