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Analog Devices Inc./Maxim Integrated MAX77874CEWM+T
- Part No.:
- MAX77874CEWM+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Special Purpose Regulators
- Package:
- 48-WFBGA, WLBGA
- Datasheet:
-
MAX77874CEWM+T.pdf
- Description:
- 12A COUPLED QUAD-PHASE CORE BUCK
- Quantity:
- Payment:
- Shipping:
Inventory:3,378
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Product details
Overview
MAX77874CEWM+T from Analog Devices is a quad-phase, 16A synchronous buck regulator optimized for multicore CPU/GPU power delivery in mobile and embedded processors. It delivers I²C-programmable output voltage (0.25V–1.30V in 5mV steps), achieves ≤25mV load-transient droop in FPWM/Turbo-Skip modes, and maintains 0.28% initial VOUT accuracy at 0.9V under full thermal range (–40°C to +85°C).
For engineers reviewing the MAX77874CEWM+T datasheet, MAX77874CEWM+T pinout, MAX77874CEWM+T application, or MAX77874CEWM+T equivalent, key selection criteria include its rotational phase spreading architecture, Turbo Skip mode efficiency trade-off, DVS ramp rate programmability, and WLP-48 package integration for high-density PCB layouts.
Technical Context
The MAX77874CEWM+T implements a proprietary 4-phase interleaved PWM control scheme with rotational phase spreading to minimize input/output ripple and improve light-load efficiency. Its Turbo Skip mode dynamically combines forced-PWM transient response with skip-mode quiescent current (475–900μA typical).
It integrates dual-domain biasing (VDD_ANA/VDD_DIG at 1.575V), I²C-compatible interface supporting Standard/Fast/HS-mode up to 3.4MHz, and comprehensive thermal monitoring with TJ120/TJ140 alarms and 165°C shutdown threshold.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 2.7V to 4.8V - supports single-cell Li-ion battery input with robust UVLO (2.6V typ rising, 2.6V typ falling) |
| VOUT Range & Resolution | 0.25V–1.30V in 5mV steps - enables precise core voltage scaling for dynamic DVFS in AI/ML processors |
| Max Output Current | 16A total (4 × 4A phases) - delivers high-current, low-impedance power to modern SoCs with multicore CPUs/GPUs |
| Transient Droop | ≤25mV (FPWM/Turbo-Skip), ≤40mV (Skip) - ensures stable operation during rapid 200mA→9.2A load steps at 3.7VIN/0.9VOUT |
| VOUT Accuracy | ±2.5mV initial (0.28% at 0.9V), ±1.75% over line/temp - meets tight voltage tolerance requirements for advanced process nodes |
| Switching Frequency | 1.9–2.1MHz (FPWM, no load) - enables use of small, low-profile inductors (e.g., TOKO DFE201210U-R24M) |
| Ripple | 3mVP-P typical across all loads - reduces need for excessive bulk capacitance in space-constrained designs |
Pinout & Package
The MAX77874CEWM+T is housed in a 48-bump, 0.35mm pitch Wafer-Level Package (WLP), outline W482B2+1, optimized for minimal PCB footprint and thermal performance (θJA = 57°C/W on 4-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IN, LX_A–LX_D | Main power input & phase switch nodes | Four independent high-side/low-side MOSFET drive outputs; each supports 4.3A RMS per phase |
| SNS+, SNS− | Output voltage feedback inputs | Differential sensing path with 75–160kΩ input impedance; enables remote sensing for improved load regulation |
| VIO, SCL, SDA, IRQ, EN, DVS | I²C interface & control logic | VIO powers digital I/O (1.65–4.8V); IRQ signals faults; DVS enables dynamic voltage scaling with programmable ramp rates (4.5–44 mV/μs) |
| VDD_ANA, VDD_DIG, PG_, AGND_ | Analog/digital bias & ground references | Dual 1.575V internal LDOs supply analog/digital circuitry; separate AGND_/PG_ minimizes noise coupling in sensitive feedback paths |
Key Features
| Feature | Design Value |
|---|---|
| Rotational Phase Spreading | Reduces input ripple by >50% vs. fixed-phase alignment and lowers EMI emissions without external synchronization |
| Turbo Skip Mode | Delivers 25mV transient droop (like FPWM) while achieving 475–900μA quiescent current (near Skip mode), eliminating efficiency compromise |
| I²C Programmable Ramp Rates | Soft-start and DVS ramp rates configurable via BUCK0SSR/BUCK0RSR registers (4 settings: 4.5–44 mV/μs), enabling fine-grained power sequencing control |
| Integrated Thermal Protection | Two-stage thermal alarm (120°C/140°C) plus 165°C shutdown with 15°C hysteresis prevents thermal runaway in compact enclosures |
| Active Discharge | LX-to-PG_ discharge resistance (100–140Ω per phase) ensures safe, controlled output voltage decay during disable, preventing backfeed |
Applications
| Smartphone Core Power | AI Edge Processor Supply |
|---|---|
|
Use Scenario: Powering ARM Cortex-A7x/A7xx or custom NPU cores in flagship smartphones during burst workloads (e.g., camera ISP, real-time video encoding). IC Role / Device Role / Timing Role: Quad-phase buck regulator delivering 16A peak current with <50μs startup delay and I²C-synchronized DVS transitions. Use Value: Enables sub-100ns voltage step response during DVFS events, reducing core idle time and improving energy-per-instruction efficiency. |
Use Scenario: Supplying vision processors (e.g., Qualcomm QCS610, MediaTek Genio 1200) in smart cameras performing machine vision inference at edge. IC Role / Device Role / Timing Role: High-accuracy, low-noise core rail generator with 0.28% initial VOUT tolerance and 3mVP-P ripple for analog front-end stability. Use Value: Maintains ADC reference integrity and reduces timing jitter in high-speed image sensor interfaces (e.g., MIPI CSI-2). |
| Gaming Handheld PSU | Drone Flight Controller Rail |
|
Use Scenario: Providing adaptive core voltage to AMD Ryzen Z1 Extreme or NVIDIA Tegra Orin Nano in portable gaming devices during GPU-intensive rendering. IC Role / Device Role / Timing Role: Multicore processor power management IC with Turbo Skip mode for sustained 12A+ loads and low-idle current during menu navigation. Use Value: Extends battery runtime by 18% vs. forced-PWM-only regulators while preserving <30mV transient margin during frame-rate spikes. |
Use Scenario: Powering flight control SoCs (e.g., STM32H7-based autopilots) in compact drones requiring ultra-low EMI and thermal resilience. IC Role / Device Role / Timing Role: Compact, thermally robust buck regulator with rotational phase spreading and integrated thermal alarms for uncooled environments. Use Value: Eliminates need for external thermal sensors and reduces layout area by 35% vs. discrete 4-phase solutions, easing conformal coating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad-phase buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ8633BGLE-Z | 3.3–16V input, 0.5–1.3V output, 15A max; uses external compensation; no Turbo Skip mode; 0.5% VOUT accuracy | Targets wider VIN range (e.g., 12V intermediate bus); lacks integrated DVS ramp control and thermal alarms | Preferred when higher input voltage or external loop tuning is required; not drop-in for battery-powered DVFS systems |
| TPS65988DHAR | USB-C PD controller with integrated 12A buck; 0.3–1.5V output; I²C + USB PD interface; 1.2% VOUT accuracy | Designed for USB-C power delivery ecosystems; includes Type-C port control logic and dead-battery charging | Chosen when USB-C host functionality and dual-role power delivery are mandatory; adds complexity for pure core-rail use |
Compared with MPQ8633BGLE-Z and TPS65988DHAR, the MAX77874CEWM+T uniquely combines battery-optimized VIN range, Turbo Skip efficiency, sub-30mV transient droop, and integrated thermal safety-making it optimal for space-constrained, thermally aggressive mobile SoC applications where DVFS responsiveness and reliability are critical.
Availability
MAX77874CEWM+T is available at Aetrix Electronics and suitable for smartphone core power, AI edge processor supply, and drone flight controller rail applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for MAX77874CEWM+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Wilmington, MA.
The MAX77874CEWM+T belongs to Analog Devices' MAX® Power Management portfolio, engineered specifically for high-current, low-voltage core power delivery in battery-operated multicore processors demanding exceptional transient response and thermal resilience.
FAQ
What is the maximum output current capability of the MAX77874CEWM+T?
The MAX77874CEWM+T delivers up to 16A total output current across its four interleaved phases, with each phase rated for 4.3A RMS. This is achieved using integrated high-side (65mΩ) and low-side (16mΩ) MOSFET drivers, enabling efficient power delivery to modern CPU/GPU cores without external power stages. The 16A rating is validated across –40°C to +85°C ambient temperature.
Does the MAX77874CEWM+T support dynamic voltage scaling (DVS)?
Yes, the MAX77874CEWM+T supports fully programmable DVS via dedicated DVS pin and I²C registers (BUCK0RSR[1:0]). Ramp rates are configurable from 4.5 to 44 mV/μs in four discrete steps, allowing precise control of voltage transition timing during processor frequency changes. The DVS function operates independently of enable state and includes a 1.5μs delay from DVS signal rise to first switching pulse.
What package type and dimensions does the MAX77874CEWM+T use?
The MAX77874CEWM+T uses a 48-bump Wafer-Level Package (WLP) with 0.35mm pitch, outline code W482B2+1. Its compact footprint measures approximately 3.0mm × 3.0mm with a maximum height of 0.5mm, making it suitable for ultra-thin mobile platforms. Thermal resistance is specified at θJA = 57°C/W on a standard four-layer PCB.
How does Turbo Skip mode improve efficiency compared to standard Skip mode?
Turbo Skip mode in the MAX77874CEWM+T retains the fast transient response of forced-PWM (≤25mV droop) while achieving quiescent currents near those of standard Skip mode (475–900μA typical). This is accomplished by selectively activating phases during light load while maintaining fast phase reactivation-eliminating the traditional trade-off between light-load efficiency and transient performance.
What thermal protection features are integrated into the MAX77874CEWM+T?
The MAX77874CEWM+T integrates three-tier thermal protection: Thermal Alarm 1 triggers at +120°C (5°C hysteresis), Thermal Alarm 2 at +140°C, and full thermal shutdown at +165°C (15°C hysteresis). All thresholds are junction-temperature monitored and reported via IRQ pin or I²C status registers, enabling system-level thermal management without external sensors.
MAX77874CEWM+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 48-WFBGA, WLBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, CPU GPU
- Voltage - Input:
- 2.7V ~ 4.8V
- Number of Outputs:
- 4
- Voltage - Output:
- 0.25V ~ 1.3V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-WLP (2.22x2.92)
MAX77874CEWM+T FAQ
1.How can I place an order for MAX77874CEWM+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX77874CEWM+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX77874CEWM+T reliable?
The price and inventory of MAX77874CEWM+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX77874CEWM+T is usually 5 days.
3.What payment methods are accepted for MAX77874CEWM+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX77874CEWM+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX77874CEWM+T?
MAX77874CEWM+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX77874CEWM+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX77874CEWM+T?
For technical support, including MAX77874CEWM+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX77874CEWM+T requirements.
6.How does Aetrix verify that MAX77874CEWM+T is sourced from the original manufacturer or authorized distributors?
All MAX77874CEWM+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX77874CEWM+T meets industry standards.
7.What is the process for return or replacement of MAX77874CEWM+T?
All MAX77874CEWM+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX77874CEWM+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX77874CEWM+T part is unused and in its original packaging.
Return procedure for MAX77874CEWM+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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