Analog Devices Inc./Maxim Integrated MAX8515AEZK+T

Overview

MAX8515AEZK+T from Maxim Integrated is a 1A, low-dropout linear regulator with PMOS pass transistor, operating from 1.425V to 3.6V input and delivering adjustable output from 0.5V to (VIN − 0.2V); features ±1.4% output accuracy over 0°C to +85°C, 200mV dropout at 1A, 320μA ground current, and integrated soft-start - used in post-regulation for high-efficiency server power rails.

For engineers reviewing the MAX8515AEZK+T datasheet, MAX8515AEZK+T pinout, MAX8515AEZK+T application, or MAX8515AEZK+T equivalent, key selection criteria include dropout voltage under full load, FB threshold stability across temperature, shutdown leakage, thermal shutdown threshold, and compatibility with 1μF/4.7μF ceramic capacitors without external compensation.

Technical Context

The MAX8515AEZK+T employs an internal p-channel MOSFET pass device with 100mΩ typical on-resistance, eliminating base-drive current and enabling stable operation down to 1.425V input while maintaining low quiescent current (340μA typ in dropout). Its error amplifier includes inherent soft-start and supports external feedback via FB pin for precise output programming.

It integrates short-circuit protection (2A current limit), thermal overload shutdown (trip at +165°C, restart at +150°C), and logic-controlled enable input with 1.2V rising threshold. The device lacks POK or POR outputs - distinguishing it from MAX8517/MAX8518 variants - and uses a fixed internal 500mV FB reference.

Key Specifications

Pinout & Package

The MAX8515AEZK+T is housed in a 10-pin μMAX® package (3mm × 5mm) with exposed pad (EP) soldered to PCB ground for thermal management. Pin 10 is internally pulled down to GND via 10kΩ resistor and must be left floating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPS7A4700RGWR and MCP1826T-1202E/DB, the MAX8515AEZK+T uniquely combines sub-200mV dropout at 1A, 500mV FB reference accuracy, and μMAX thermal packaging - making it optimal for compact, high-efficiency, adjustable LDO applications within its 1.425V–3.6V input window.

Availability

MAX8515AEZK+T is available at Aetrix Electronics and suitable for server power delivery, optical module biasing, notebook SoC I/O regulation, industrial FPGA core supplies, and embedded storage controller applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MAX8515AEZK+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated, now part of Analog Devices, designs precision analog, mixed-signal, and power management ICs for demanding industrial, communications, and computing applications.

The MAX8515AEZK+T belongs to Maxim's high-performance LDO family targeting low-input-voltage, high-current post-regulation - engineered for systems where dropout voltage, thermal efficiency, and output accuracy directly impact functional safety and energy efficiency.

FAQ

What is the FB reference voltage of the MAX8515AEZK+T, and how tightly is it specified?

The MAX8515AEZK+T features a fixed internal feedback reference voltage of 500mV, guaranteed between 497mV and 503mV over temperature (0°C to +85°C) and load conditions. This ±3mV tolerance enables precise output programming using external resistors and contributes to the device's ±1.4% overall output accuracy. The MAX8515AEZK+T does not support external reference injection or trimming - the 500mV reference is integral to its architecture and cannot be altered.

Does the MAX8515AEZK+T include power-good or reset functionality like the MAX8517 or MAX8518?

No, the MAX8515AEZK+T does not include power-good (POK) or power-on reset (POR) outputs. It is the base variant in the MAX8516/MAX8517/MAX8518 family and contains only EN, IN, OUT, FB, GND, and N.C. pins. Unlike the MAX8517 (which adds open-drain POK) or MAX8518 (which adds open-drain POR), the MAX8515AEZK+T omits these supervisory functions to reduce pin count and cost - making it ideal for applications where sequenced enable control suffices without status signaling.

What is the maximum continuous output current and corresponding dropout voltage for the MAX8515AEZK+T?

The MAX8515AEZK+T delivers up to 1A of continuous output current with a maximum dropout voltage of 200mV at that load, measured under conditions of VIN = 1.425V, VFB = 480mV, and TA = +25°C. This specification is guaranteed across the full operating temperature range (−40°C to +85°C) and ensures reliable regulation even when input voltage approaches the minimum 1.425V threshold - a key advantage for battery-powered or low-headroom system designs using the MAX8515AEZK+T.

Can the MAX8515AEZK+T operate stably with ceramic capacitors only, and what values are recommended?

Yes, the MAX8515AEZK+T is fully stable with ceramic capacitors only: a minimum 1μF ceramic capacitor between IN and GND, and a minimum 4.7μF ceramic capacitor between OUT and GND. These values ensure stability across the full −40°C to +85°C temperature range and up to 1A load. Smaller output capacitance (e.g., 2.2μF) may be used for loads below 500mA per the formula COUT = IOUT(max) × (1μF/200mA), but 4.7μF is the validated value for full 1A operation and optimal transient response in the MAX8515AEZK+T.

What thermal management provisions does the MAX8515AEZK+T package include, and how should they be implemented?

The MAX8515AEZK+T uses a 10-pin μMAX® package with an exposed thermal pad (EP) on the underside, which must be soldered directly to a PCB ground plane to achieve effective thermal dissipation. Ground pins (Pin 6 and EP) serve dual electrical and thermal roles. To maintain junction temperature below +150°C, designers must connect EP to a large copper area or multiple thermal vias to inner ground layers. The package's thermal resistance (θJA) is optimized for this layout - omitting EP grounding degrades power handling and risks thermal shutdown during sustained 1A operation.