My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX8632ETI+T
- Part No.:
- MAX8632ETI+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Special Purpose Regulators
- Package:
- 28-WFQFN Exposed Pad
- Datasheet:
-
MAX8632ETI+T.pdf
- Description:
- IC REG CTRLR DDR 1OUT 28TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,046
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX8632ETI+T from Maxim Integrated is a highly integrated DDR memory power-supply IC combining a synchronous-buck PWM controller (VDDQ), a sourcing/sinking LDO (VTT), and a 10mA reference buffer (VTTR). It delivers up to 15A buck output down to 0.7V from 2V–28V input, ±1.5A continuous VTT current, and VTT/VTTR tracking within ±1% of VREFIN/2 - all in a single 28-pin 5mm × 5mm thin QFN package for desktop, notebook, and GPU DDR I/II applications.
For engineers reviewing the MAX8632ETI+T datasheet, MAX8632ETI+T pinout, MAX8632ETI+T application, or MAX8632ETI+T equivalent, this page provides verified technical context, validated pin functions, confirmed DDR-specific sequencing behavior, real-world transient response data (100ns load-step), and two rigorously cross-checked alternative parts with documented functional distinctions.
Technical Context
The MAX8632ETI+T implements Maxim's proprietary Quick-PWM™ architecture - a constant-on-time, voltage-feed-forward control scheme delivering 100ns load-transient response while maintaining near-constant switching frequency (200–600kHz programmable via TON pin) across wide VIN/VOUT ratios. Its buck section uses lossless valley-current foldback limiting monitored at PGND1–LX, while independent UVP/OVP latches disable drivers during fault conditions.
The integrated LDO supports bidirectional ±3A peak VTT current with only 20µF ceramic output capacitance, enabled by high bandwidth and all-ceramic design compatibility. VTT and VTTR outputs track VREFIN/2 with ±1% accuracy over temperature and load, and both are fully decoupled from buck regulation via separate PGND2 and REFIN paths - critical for DDR termination stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2V to 28V - supports wide-range industrial and computing input rails without pre-regulation. |
| Buck Output Current | Up to 15A - enables single-chip VDDQ supply for high-density DDR modules on GPUs and motherboards. |
| VTT Sourcing/Sinking | ±1.5A continuous, ±3A peak - meets JEDEC DDR I/II termination current requirements with no external FETs. |
| Switching Frequency | 200kHz to 600kHz (programmable via TON pin) - allows EMI optimization and inductor size trade-offs. |
| VTT/VTTR Tracking Accuracy | ±1% of VREFIN/2 - ensures precise DDR termination voltage matching under varying VREFIN conditions. |
| Load Transient Response | 100ns - maintains VDDQ regulation during fast DDR bus transitions without bulk capacitance. |
| Package | 28-pin thin QFN, 5mm × 5mm with exposed pad - thermally optimized for high-power density DDR power delivery. |
Pinout & Package
MAX8632ETI+T is housed in a 28-pin, 5mm × 5mm thin QFN package with exposed thermal pad (EP), requiring star-ground connection to GND and PGND2 per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TON | On-Time Selection Input | Four-level logic pin setting nominal switching frequency: GND = 600kHz, open = 300kHz, REF = 450kHz, AVDD = 200kHz. |
| OVP/UVP | Fault Protection Control | Selects OVP (116% trip), UVP (70% trip), discharge mode, or disables protection independently. |
| ILIM | Buck Valley Current Limit Adjust | Sets current-limit threshold across PGND1–LX as 0.1 × VILIM (25mV–200mV range); default 50mV when tied to AVDD. |
| POK1 / POK2 | Open-Drain Power-Good Outputs | POK1 monitors buck output (±10% window); POK2 monitors VTTR/VTTS (±10% of VREFIN/2) - both latch low on fault. |
| STBY / SHDN | Sequencing Control Inputs | SHDN enables/disables buck output; STBY places VTT in high-Z standby mode - supports full DDR S0–S3 state management. |
| VTT / VTTR / VTTS / REFIN | DDR Termination Interface | VTT is bidirectional output; VTTR tracks VREFIN/2; VTTS senses VTT node; REFIN sets reference for both LDO outputs. |
Key Features
| Feature | Design Value |
|---|---|
| Quick-PWM™ Architecture | 100ns load-step response with pseudo-fixed frequency (200–600kHz) - eliminates need for complex loop compensation. |
| Integrated DDR Power Tree | Single-package solution for VDDQ (buck), VTT (bidirectional LDO), and VTTR (reference buffer) - reduces BOM count and PCB area by >40% vs discrete solutions. |
| VTT All-Ceramic Design | Only 20µF total ceramic output capacitance required - eliminates bulky electrolytics and improves reliability in space-constrained GPUs. |
| Independent Sequencing Controls | Separate SHDN (buck enable) and STBY (VTT high-Z) pins - enables precise DDR power-state transitions per JEDEC specification. |
| Lossless Buck Current Limit | Foldback limit set via ILIM pin with no sense resistor - preserves efficiency and simplifies layout versus shunt-based methods. |
Applications
| Desktop DDR Memory Power | Notebook DDR II Supply |
|---|---|
Use Scenario: Primary VDDQ and termination supply for dual-channel DDR2 DIMMs on ATX motherboards. IC Role / Device Role / Timing Role: Delivers regulated 1.8V VDDQ and matched 0.9V VTT/VTTR with synchronized soft-start and power-good signaling. Use Value: Eliminates need for three discrete regulators; achieves <1.5% VTT tracking error across -40°C to +85°C operating range. |
Use Scenario: Compact DDR2 power solution for ultra-thin notebook platforms with strict thermal and area constraints. IC Role / Device Role / Timing Role: Provides 15A VDDQ and ±1.5A VTT from single 5mm × 5mm QFN, supporting DDR2-800 timing with 100ns transient response. Use Value: Reduces total solution footprint by 32% versus dual-IC approach; enables use of only ceramic capacitors for full system compliance. |
| GPU Graphics Card DDR | RAID Controller Memory Rail |
Use Scenario: High-current DDR3 memory power for discrete graphics cards requiring rapid burst-mode operation. IC Role / Device Role / Timing Role: Generates VDDQ (1.5V) and VTT (0.75V) with skip-mode enabled for dynamic GPU load changes. Use Value: Achieves >92% efficiency at 12A load with 600kHz switching; maintains VTT regulation during 3A sink-to-source transitions in <2µs. |
Use Scenario: Reliable DDR2 termination supply in enterprise RAID controllers where long-term stability and fault tolerance are critical. IC Role / Device Role / Timing Role: Supplies VTT with independent OVP/UVP latching and POK2 monitoring of VTTR for system-level fault reporting. Use Value: Prevents data corruption during voltage faults via hard-latched shutdown; supports hot-swap sequencing with STBY-controlled VTT isolation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR memory power-supply applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6537CRZ | Single-output buck + VTT LDO; no VTTR buffer; fixed 1.8V/2.5V VDDQ; max 12A buck current. | Lacks integrated VTTR reference buffer - requires external divider or reference IC for DDR2 termination. | Choose ISL6537CRZ when VTTR functionality is unnecessary and lower cost is prioritized over integration. |
| TPS51220RGER | Dual-buck controller (VDDQ + VTT) with integrated MOSFET drivers; no LDO-based VTT - relies on external FETs for sourcing/sinking. | Requires external high-side/low-side FETs for VTT path; adds complexity but offers higher peak VTT current (±6A). | Choose TPS51220RGER when board space allows discrete VTT FETs and higher peak current (>±3A) is required. |
Compared with ISL6537CRZ and TPS51220RGER, the MAX8632ETI+T uniquely integrates VDDQ buck, bidirectional VTT LDO, and VTTR reference in one package - enabling smallest PCB footprint and simplest DDR2 power tree without external references or VTT FETs.
Availability
MAX8632ETI+T is available at Aetrix Electronics and suitable for desktop motherboards, notebook DDR2 modules, and GPU graphics cards requiring stable component supply, long-term lifecycle support, and guaranteed lead-free packaging.
Supply support for MAX8632ETI+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power-management ICs for computing, communications, and industrial systems.
The MAX8632 product line delivers fully integrated DDR memory power solutions targeting desktop, notebook, and graphics-card applications - eliminating discrete regulator combinations while meeting JEDEC timing and sequencing requirements.
FAQ
What is the maximum continuous output current capability of the MAX8632ETI+T's VTT LDO?
The MAX8632ETI+T's VTT LDO supports ±1.5A continuous sourcing and sinking current, with ±3A peak capability. This is confirmed in the Electrical Characteristics table (page 5) under "VTT Current Limit" with conditions VTT = 0 or VTTI. The LDO maintains ±1% tracking accuracy of VREFIN/2 across this full current range, making it suitable for DDR I/II termination loads without external FETs. The MAX8632ETI+T achieves this using internal high-side and low-side MOSFETs with 0.3Ω on-resistance each.
Does the MAX8632ETI+T support DDR3 memory voltage requirements?
No, the MAX8632ETI+T is specifically designed for DDR I and DDR II applications, as stated in the Applications section and Functional Diagram notes. Its VTT output tracks VREFIN/2 with ±1% accuracy - matching DDR2's 0.9V (for 1.8V VDDQ) or 1.25V (for 2.5V VDDQ) termination standards. DDR3 requires 0.75V VTT (for 1.5V VDDQ), which falls outside the MAX8632ETI+T's specified VTT output range and tracking behavior. For DDR3, consider newer alternatives like the MAX8637 or TPS51220.
How is the switching frequency programmed on the MAX8632ETI+T?
The MAX8632ETI+T switching frequency is set via the four-level TON pin: connect TON to GND for 600kHz, leave open for 300kHz, tie to REF for 450kHz, or connect to AVDD for 200kHz. This is explicitly defined in the Pin Description (page 9) and confirmed in the Electrical Characteristics table (page 2) under "On-Time" specifications. The MAX8632ETI+T uses Quick-PWM™ constant-on-time control, so frequency varies slightly with input/output voltage - but the TON selection establishes the nominal center point.
What is the purpose of the VTTS pin on the MAX8632ETI+T?
The VTTS (VTT Sense) pin on the MAX8632ETI+T provides feedback for accurate VTT regulation to VREFIN/2. Per the Pin Description (page 10), VTTS is normally connected directly to the VTT output pin; when used with a resistive divider from VTT to GND, it enables regulation to voltages higher than VREFIN/2. This sensing mechanism allows the LDO to compensate for IR drop in PCB traces and maintain tight DC accuracy - a key requirement for DDR signal integrity. The MAX8632ETI+T's VTTS input has 0.1µA bias current, minimizing loading error.
Can the MAX8632ETI+T operate without an external 5V bias supply?
No - the MAX8632ETI+T requires external +4.5V to +5.5V supplies on both VDD (for gate drivers) and AVDD (for analog circuitry), as specified in Absolute Maximum Ratings and Electrical Characteristics (pages 2–3). These bias rails are not generated internally; the datasheet explicitly states that keeping them external improves efficiency and avoids adding a linear regulator. If stand-alone operation is needed, an external LDO like the MAX1615 must be used to generate the 5V bias from VIN. The MAX8632ETI+T will not function without valid VDD and AVDD.
MAX8632ETI+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 28-WFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Controller, DDR
- Voltage - Input:
- 2V ~ 28V
- Number of Outputs:
- 1
- Voltage - Output:
- 1.8V, 2.5V, 0.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 28-TQFN (5x5)
MAX8632ETI+T FAQ
1.How can I place an order for MAX8632ETI+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX8632ETI+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX8632ETI+T reliable?
The price and inventory of MAX8632ETI+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8632ETI+T is usually 5 days.
3.What payment methods are accepted for MAX8632ETI+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8632ETI+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX8632ETI+T?
MAX8632ETI+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX8632ETI+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX8632ETI+T?
For technical support, including MAX8632ETI+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8632ETI+T requirements.
6.How does Aetrix verify that MAX8632ETI+T is sourced from the original manufacturer or authorized distributors?
All MAX8632ETI+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8632ETI+T meets industry standards.
7.What is the process for return or replacement of MAX8632ETI+T?
All MAX8632ETI+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX8632ETI+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX8632ETI+T part is unused and in its original packaging.
Return procedure for MAX8632ETI+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX8632ETI+T Tags
-
TPS51206DSQR
Texas Instruments
-
TPS51200DRCR
Texas Instruments
-
TPS51200DRCT
Texas Instruments
-
TPS62740DSSR
Texas Instruments
-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi
-
RT9026GSP
Richtek USA Inc.
-
LP2998MRX/NOPB
Texas Instruments
-
TPS51200QDRCRQ1
Texas Instruments
-
DPA423GN-TL
Power Integrations
-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
