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Analog Devices Inc./Maxim Integrated MAX8632ETI+TG51
- Part No.:
- MAX8632ETI+TG51
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Special Purpose Regulators
- Package:
- -
- Datasheet:
-
MAX8632ETI+TG51.pdf
- Description:
- INTEGRATED CIRCUIT
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Product details
Overview
MAX8632ETI+TG51 from Maxim Integrated is a highly integrated DDR power-supply IC combining a synchronous-buck PWM controller (VDDQ), a sourcing/sinking LDO (VTT), and a 10mA reference buffer (VTTR). It delivers up to 15A buck output down to 0.7V from 2V–28V input, ±3A VTT sourcing/sinking, and 1% tracking accuracy between VTT/VTTR and VREFIN/2 - optimized for DDR I/II memory power in desktops, notebooks, and graphics cards.
For engineers reviewing the MAX8632ETI+TG51 datasheet, MAX8632ETI+TG51 pinout, MAX8632ETI+TG51 application, or MAX8632ETI+TG51 equivalent, key selection criteria include Quick-PWM™ 100ns load-step response, independent programmable current limits for buck and LDO, flexible sequencing via SHDN/STBY, and all-ceramic capacitor support with only 20µF required for VTT.
Technical Context
The MAX8632ETI+TG51 implements Maxim's proprietary Quick-PWM™ architecture - a constant-on-time, voltage-feed-forward control scheme that achieves 100ns transient response while maintaining near-constant switching frequency (200kHz–600kHz) across wide VIN/VOUT ratios. Its on-time is inversely proportional to VIN and directly proportional to VOUT, eliminating need for external compensation.
Buck and LDO sections operate independently: the buck controller drives external n-channel MOSFETs with lossless foldback current limiting (via PGND1–LX sensing), while the VTT LDO supports ±3A peak sourcing/sinking with 1% tracking to VREFIN/2 and no bulk capacitors required. Both sections feature dedicated power-good comparators (POK1/POK2) and UVLO thresholds referenced to REFIN.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range (VIN) | 2V to 28V - enables direct connection to wide-range DC bus (e.g., 3.3V, 5V, 12V, 24V rails) without pre-regulation. |
| Buck Output Current | Up to 15A - sufficient for high-density DDR2 memory subsystems with multiple DIMMs. |
| VTT Sourcing/Sinking | ±3A peak - meets JEDEC DDR termination current requirements under fast bidirectional line switching. |
| Switching Frequency | 200kHz to 600kHz (selectable via TON pin) - avoids IF bands and enables optimized inductor size vs. EMI trade-off. |
| VTT/VTTR Tracking Accuracy | ±1% of VREFIN/2 - ensures precise DDR termination voltage matching across temperature and load. |
| Load Transient Response | 100ns - minimizes VDDQ droop during DDR burst accesses, reducing timing margin risk. |
| Soft-Start Time | 1.7ms - prevents inrush current into large output capacitors during power-up sequencing. |
Pinout & Package
MAX8632ETI+TG51 is housed in a thermally enhanced 5mm × 5mm, 28-pin thin QFN package with exposed pad (EP) for low thermal resistance. Pin 1 is marked by dot; EP must be star-connected to GND and PGND2 per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| TON (Pin 1) | On-Time Selection Input | Four-level logic selects nominal switching frequency: GND = 600kHz, open = 300kHz, REF = 450kHz, AVDD = 200kHz. |
| OVP/UVP (Pin 2) | Protection Enable Control | Selects OVP (116% trip), UVP (70% trip), discharge mode, or disables both - critical for DDR safe shutdown. |
| ILIM (Pin 4) | Valley Current-Limit Threshold | Sets buck current limit from 45mV (fixed) to 235mV (adjustable) - enables lossless foldback without sense resistor. |
| POK1 (Pin 5) | Buck Power-Good Output | Open-drain signal asserts low if VDDQ deviates >±10% or during soft-start - used for system enable sequencing. |
| VTT (Pin 12) | LDO Termination Output | Delivers ±3A sourced/sunk current with <1% tracking to VREFIN/2 - powers DDR DQ/DQS termination networks. |
| VTTS (Pin 9) | VTT Sense Input | Connects directly to VTT pin for accurate regulation; optional resistive divider allows VTT > VREFIN/2. |
| SHDN (Pin 27) | Global Shutdown Control | Rising edge clears OVP/UVP fault latches; pulls low to disable buck output and enter ultra-low-quiescent state. |
Key Features
| Feature | Design Value |
|---|---|
| Quick-PWM™ Architecture | 100ns load-step response with near-constant frequency - eliminates need for complex loop compensation in DDR applications. |
| All-Ceramic VTT Design | Only 20µF ceramic capacitance required - reduces board area, cost, and ESL vs. electrolytic/tantalum solutions. |
| Independent Sequencing Controls | SHDN and STBY inputs support full DDR operating states (active, standby, self-refresh, power-down) without external logic. |
| Lossless Buck Current Limit | Monitors PGND1–LX voltage drop - avoids power loss and accuracy drift of external sense resistors. |
| VTT/VTTR Tracking | Both outputs track VREFIN/2 within ±1% - ensures matched termination voltages essential for DDR signal integrity. |
Applications
| Desktop DDR Memory Power | Notebook DDR2 Power Delivery |
|---|---|
|
Use Scenario: Dual-channel DDR2 memory subsystem on ATX motherboard with 4× SO-DIMM slots. IC Role / Device Role / Timing Role: Generates VDDQ (1.8V), VTT (0.9V), and VTTR (0.9V) with synchronized startup and independent fault reporting (POK1/POK2). Use Value: Eliminates three discrete regulators; 1.7ms soft-start prevents rail collapse during cold boot; ±3A VTT handles simultaneous DQ line switching. |
Use Scenario: Space-constrained notebook mainboard requiring low-profile DDR2 termination supply. IC Role / Device Role / Timing Role: Provides compact, thermally efficient DDR2 termination with STBY-controlled low-IQ mode during suspend-to-RAM. Use Value: 5mm × 5mm QFN saves >40% PCB area vs. discrete solution; 20µF ceramic VTT cap reduces height and improves reliability. |
| Graphics Card VRM Subsystem | RAID Controller DDR Buffer Supply |
|
Use Scenario: High-bandwidth GPU memory interface with GDDR3/DDR2 coexistence on PCIe add-in card. IC Role / Device Role / Timing Role: Supplies VDDQ for memory controller and VTT/VTTR for termination, with POK1/POK2 enabling GPU reset coordination. Use Value: 100ns transient response maintains timing margins under GPU burst loads; 600kHz option minimizes inductor size at 12V input. |
Use Scenario: Enterprise RAID controller with multi-DIMM DDR2 buffer memory for cache acceleration. IC Role / Device Role / Timing Role: Delivers stable VTT/VTTR across 8+ DIMMs with independent current limiting to prevent single-point failure propagation. Use Value: ±3A VTT peak current supports worst-case JEDEC DDR2 termination; VTT/VTTR tracking ensures consistent signal eye opening. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR power-supply applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISL6537CRZ | Single-chip DDR1/2 solution with 12A buck + ±2A VTT; no VTTR buffer; fixed 1.8V/2.5V VDDQ only. | Lacks VTTR reference buffer and adjustable VDDQ; limited to DDR1/2, not DDR2+ with extended VREFIN range. | Choose ISL6537CRZ only if VTTR is generated externally and VDDQ is fixed at 1.8V/2.5V. |
| TPS51116PWR | Integrated DDR2/3 solution with 25A buck + ±3A VTT + VTTR; supports DDR3 VDDQ=1.5V; higher quiescent current (8mA vs. 5mA). | Supports DDR3 and higher-current DDR2 systems; requires larger 32-pin QFN; lacks Quick-PWM™ 100ns response. | Choose TPS51116PWR for DDR3 migration paths or >15A VDDQ needs; MAX8632ETI+TG51 preferred for DDR2 cost-sensitive designs with strict transient response. |
Compared with ISL6537CRZ and TPS51116PWR, MAX8632ETI+TG51 uniquely combines 15A Quick-PWM™ buck, ±3A VTT, and VTTR buffer in a 28-pin 5mm QFN - offering optimal balance of transient performance, integration density, and DDR2-specific features like VREFIN/2 tracking and skip-mode efficiency at light load.
Availability
MAX8632ETI+TG51 is available at Aetrix Electronics and suitable for desktop motherboards, notebook platforms, and graphics card designs requiring stable component supply, long-term lifecycle support, and guaranteed lead-free compliance.
Supply support for MAX8632ETI+TG51 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a leader in high-performance analog, mixed-signal, and power-management ICs, serving computing, communications, and industrial markets since 1983.
The MAX8632ETI+TG51 belongs to Maxim's DDR power-supply product line, engineered specifically for JEDEC-compliant DDR I/II memory termination and core voltage generation with emphasis on transient response, sequencing flexibility, and space-constrained layouts.
FAQ
What is the maximum supported input voltage for MAX8632ETI+TG51?
The MAX8632ETI+TG51 supports an input voltage range of 2V to 28V on the VIN pin. This wide range allows direct connection to common system rails including 3.3V, 5V, 12V, and 24V supplies without intermediate regulation - critical for flexibility in desktop, notebook, and graphics card power architectures. Absolute maximum rating is +30V.
How does MAX8632ETI+TG51 achieve VTT and VTTR voltage tracking?
The MAX8632ETI+TG51 achieves VTT and VTTR tracking by referencing both outputs to VREFIN/2 using internal precision dividers and error amplifiers. When REFIN is set to 1.5V or 2.5V, VTT and VTTR regulate to within ±1% of half that value - ensuring matched termination voltages essential for DDR signal integrity and JEDEC compliance.
Can MAX8632ETI+TG51 operate in pulse-skipping mode?
Yes, MAX8632ETI+TG51 supports pulse-skipping mode via the SKIP pin: connecting SKIP to GND enables discontinuous conduction mode at light loads, improving efficiency. Connecting SKIP to AVDD forces continuous PWM operation for lower noise and predictable ripple - selectable based on system EMI and efficiency requirements.
What is the purpose of the TON pin on MAX8632ETI+TG51?
The TON pin on MAX8632ETI+TG51 sets the nominal switching frequency of the buck controller via four-level logic: TON = GND selects 600kHz, open selects 300kHz, REF selects 450kHz, and AVDD selects 200kHz. This allows designers to optimize frequency for inductor size, EMI filtering, and efficiency without changing external components.
Does MAX8632ETI+TG51 require external MOSFETs for the buck stage?
Yes, MAX8632ETI+TG51 is a controller IC - it drives two external n-channel MOSFETs (high-side and synchronous rectifier) via DH and DL gate-driver outputs. This architecture enables scalable power delivery up to 15A while allowing optimization of FET RDS(ON), Qg, and thermal performance for specific input/output conditions.
MAX8632ETI+TG51 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- -
- Voltage - Input:
- -
- Number of Outputs:
- -
- Voltage - Output:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
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- Mounting Type:
- -
- Supplier Device Package:
- -
MAX8632ETI+TG51 FAQ
1.How can I place an order for MAX8632ETI+TG51 through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX8632ETI+TG51 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX8632ETI+TG51 reliable?
The price and inventory of MAX8632ETI+TG51 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8632ETI+TG51 is usually 5 days.
3.What payment methods are accepted for MAX8632ETI+TG51?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8632ETI+TG51 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX8632ETI+TG51?
MAX8632ETI+TG51 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX8632ETI+TG51 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX8632ETI+TG51?
For technical support, including MAX8632ETI+TG51 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8632ETI+TG51 requirements.
6.How does Aetrix verify that MAX8632ETI+TG51 is sourced from the original manufacturer or authorized distributors?
All MAX8632ETI+TG51 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8632ETI+TG51 meets industry standards.
7.What is the process for return or replacement of MAX8632ETI+TG51?
All MAX8632ETI+TG51 units undergo pre-shipment inspection (PSI). If there is an issue with MAX8632ETI+TG51, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX8632ETI+TG51 part is unused and in its original packaging.
Return procedure for MAX8632ETI+TG51:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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