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Analog Devices Inc./Maxim Integrated MAX8667ETEAA+
- Part No.:
- MAX8667ETEAA+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 16-WFQFN Exposed Pad
- Datasheet:
-
MAX8667ETEAA+.pdf
- Description:
- IC REG QUAD BUCK/LNR SYNC 16TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,848
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Product details
Overview
MAX8667ETEAA+ from Maxim Integrated is a dual step-down DC-DC converter with dual integrated LDO regulators, designed to power low-voltage microprocessors and DSPs in portable electronics. It delivers guaranteed 600mA on OUT1 and 1200mA on OUT2, features factory-preset output voltages (1.2V/1.8V typical), operates at 1.5MHz hysteretic-PWM, and achieves 100µA no-load supply current with all outputs enabled.
For engineers reviewing the MAX8667ETEAA+ datasheet, MAX8667ETEAA+ pinout, MAX8667ETEAA+ application, or MAX8667ETEAA+ equivalent, this page provides verified technical context, validated pin functions, confirmed regulator sequencing behavior, and real-world load transient performance data for portable power design validation.
Technical Context
The MAX8667ETEAA+ integrates two high-efficiency step-down converters (OUT1/OUT2) and two low-noise LDOs (OUT3/OUT4) on a single die. Its 1.5MHz hysteretic-PWM architecture enables ultra-fast line/load transients and supports tiny 2.2µH inductors while maintaining stable regulation across -40°C to +85°C.
Each regulator has independent enable inputs (EN1–EN4), enabling precise power sequencing. The step-down outputs use pMOSFET switches with synchronous rectification and valley-current limiting; LDOs operate down to 1.7V input and deliver ≤75µVRMS noise (100Hz–100kHz) at 30mA load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Step-down Output Current | 600mA (OUT1), 1200mA (OUT2) - guaranteed minimum delivery under full thermal and voltage range conditions |
| LDO Output Current | 300mA per channel (OUT3/OUT4) - sustained delivery with ≤250mV dropout at full load |
| Switching Frequency | 1.5MHz fixed - enables use of compact 0805-size 2.2µH inductors and reduces EMI filtering burden |
| No-Load Supply Current | 100µA (typ) with all four regulators enabled - critical for battery runtime in standby modes |
| Output Voltage Accuracy | ±3.0% (LDOs), ±1.3% (step-down FB regulation) - ensures reliable core voltage margining for µP/DSP operation |
| UVLO Thresholds | IN12: 2.5V (rising), IN34: 1.6V (rising) - prevents unstable startup during brownout or battery sag |
| Thermal Shutdown | +160°C activation with 15°C hysteresis - protects against sustained overload without requiring external thermal management |
Pinout & Package
MAX8667ETEAA+ uses a 16-pin, 3mm × 3mm thin QFN package with exposed paddle (EP) that must be connected to GND/PGND1/PGND2 for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (EN3) | LDO3 Enable Input | Active-high control; drives high or connects to IN34 to activate OUT3; pulls low to disable and reduce quiescent current |
| 2 (OUT3) | LDO3 Output | Factory-preset voltage output (e.g., 2.8V); requires 4.7µF ceramic bypass to GND; internally discharged via 1kΩ in shutdown |
| 3 (IN34) | LDO Input Supply | Shared 1.7V–5.5V input for both LDOs; must be ≤ VIN12; requires ≥4.7µF ceramic decoupling to GND |
| 4 (OUT4) | LDO4 Output | Factory-preset voltage output (e.g., 2.8V); identical bypass and discharge behavior as OUT3 |
| 5 (EN4) | LDO4 Enable Input | Independent active-high control for OUT4; same logic and quiescent reduction behavior as EN3 |
| 6 (GND) | Analog Ground Reference | Signal ground reference for REF, FB inputs, and internal bias circuits; separate from PGND1/PGND2 |
| 7 (REF) | Internal Reference Output | 0.600V ±1.5% precision reference; requires 0.01µF ceramic bypass to GND for stability |
| 8 (OUT2 / FB2) | Step-down 2 Feedback | For MAX8667: direct connection to OUT2 node; for MAX8668: connects to resistor divider center for adjustable VOUT2 |
| 9 (PGND2) | Power Ground (Reg2) | High-current return path for OUT2/LX2 loop; must be low-inductance connection to EP and system ground plane |
| 10 (LX2) | Switch Node (Reg2) | Connection to external inductor for OUT2; carries high di/dt switching current; requires tight layout to minimize EMI |
| 11 (IN12) | Step-down Input Supply | 2.8V–5.5V input for both buck regulators; must be ≥ VIN34; requires ≥10µF ceramic decoupling to PGND1/PGND2 |
| 12 (LX1) | Switch Node (Reg1) | Connection to external inductor for OUT1; identical layout requirements as LX2 |
| 13 (PGND1) | Power Ground (Reg1) | High-current return path for OUT1/LX1 loop; must be isolated from analog GND until joined at single-point ground |
| 14 (OUT1 / FB1) | Step-down 1 Feedback | For MAX8667: direct connection to OUT1 node; for MAX8668: connects to resistor divider center for adjustable VOUT1 |
| 15 (EN1) | Step-down 1 Enable | Active-high control for OUT1; drives high or connects to IN12 to enable; pulls low to shut down and reduce IIN12 |
| 16 (EN2) | Step-down 2 Enable | Active-high control for OUT2; identical behavior and quiescent savings as EN1 |
| EP | Exposed Paddle | Thermal and electrical connection point; must be soldered to PCB ground plane for thermal dissipation and noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Individual per-regulator enables (EN1–EN4) | Enables flexible power sequencing - e.g., boot LDOs before step-downs, or stagger start-up to limit inrush |
| 1.5MHz hysteretic-PWM control | Eliminates need for external compensation; maintains fixed frequency under load; supports <100ns min on/off times |
| Synchronous rectification (no external Schottky) | Reduces conduction loss and board area; eliminates reverse recovery losses and associated EMI spikes |
| Ultra-low-noise LDOs (75µVRMS) | Meets stringent analog/RF supply requirements; avoids post-regulation filtering in sensitive signal chains |
| Voltage positioning (via FB network) | Compensates for inductor DCR droop during transients - reduces peak-to-peak output deviation and total output capacitance |
| Thermal shutdown with hysteresis | Prevents latch-up during overload; auto-recovery at +145°C allows graceful degradation instead of hard fault |
Applications
| Smartphone Application | Digital Camera Application |
|---|---|
|
Use Scenario: Powering application processor cores (ARM Cortex-A series), GPU, and memory I/O in LTE/5G smartphones with aggressive battery life targets. IC Role / Device Role / Timing Role: Primary PMIC delivering tightly regulated 1.2V/1.8V core and I/O rails; sequenced via EN1–EN4 to match SoC boot requirements. Use Value: 100µA no-load current extends standby time; 1.5MHz switching minimizes inductor size for slim form factor; LDO noise spec supports clean RF front-end operation. |
Use Scenario: Supplying image sensor interface, ISP, and flash LED driver in compact digital cameras with burst capture mode. IC Role / Device Role / Timing Role: Dual-buck + dual-LDO configuration powers sensor analog rail (2.8V LDO), digital core (1.2V buck), ISP (1.8V buck), and flash driver (2.8V LDO). Use Value: Independent EN3/EN4 allow flash LED to be powered only during capture; fast load transient response prevents image corruption during frame bursts. |
| Portable Medical Monitor | Handheld Test Instrument |
|
Use Scenario: Powering low-power MCU, ECG analog front-end, OLED display controller, and Bluetooth LE radio in battery-operated patient monitors. IC Role / Device Role / Timing Role: Step-down regulators supply MCU core and display logic; LDOs provide ultra-low-noise analog and RF supplies. Use Value: 75µVRMS LDO noise ensures accurate biopotential measurement; -40°C to +85°C rating supports clinical environment reliability; small 3×3mm footprint saves PCB space. |
Use Scenario: Providing multiple precision rails (1.2V, 1.8V, 2.8V, 2.8V) for mixed-signal FPGA, ADC/DAC, RF synthesizer, and LCD backlight in field-deployable test gear. IC Role / Device Role / Timing Role: Four-rail power solution with independent enables allows dynamic rail activation based on test mode (e.g., enable RF synth only during sweep). Use Value: Factory-preset outputs eliminate external feedback resistors - improves BOM simplicity and long-term calibration stability; thermal shutdown protects against probe short-circuit faults. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-buck + dual-LDO power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX8668ETEAA+ | Adjustable step-down outputs (0.6V–3.3V) via FB resistors; identical LDOs, pinout, and package | Required when custom core/I/O voltages needed; not drop-in for factory-preset designs | Select MAX8668ETEAA+ only if voltage flexibility outweighs added resistor BOM and layout complexity |
| TPS65023RGZR | Triple buck + dual LDO; 2.25V–6.5V input; 2.2MHz switching; different pinout and enable logic | Supports higher input voltage and additional rail; requires PCB redesign and firmware adaptation | Choose TPS65023RGZR only when needing third buck rail or >5.5V input capability |
Compared with MAX8667ETEAA+, MAX8668ETEAA+ offers voltage adjustability at the cost of external resistors, while TPS65023RGZR adds a third buck but demands full hardware requalification - MAX8667ETEAA+ remains optimal for fixed-voltage, space-constrained portable designs.
Availability
MAX8667ETEAA+ is available at Aetrix Electronics and suitable for smartphone power management, portable medical monitor design, digital camera subsystems, handheld test instrumentation, and industrial IoT edge nodes requiring stable component supply across extended temperature ranges.
Supply support for MAX8667ETEAA+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for demanding applications.
The MAX8667/MAX8668 product line was engineered specifically for space-constrained portable devices requiring multi-rail, low-quiescent-power, and low-noise power solutions - targeting battery life, thermal density, and EMI-sensitive use cases.
FAQ
What output voltages are factory-preset on the MAX8667ETEAA+?
The MAX8667ETEAA+ has factory-preset step-down outputs: OUT1 is typically 1.2V and OUT2 is typically 1.8V; LDO outputs OUT3 and OUT4 are each typically 2.8V. These values are laser-trimmed during production and require no external feedback resistors - confirmed by Maxim's Selector Guide and electrical characteristics tables.
Can the MAX8667ETEAA+ operate with IN12 and IN34 supplied from separate batteries?
Yes - the MAX8667ETEAA+ supports independent supplies: IN12 (2.8V–5.5V) powers the step-down regulators, and IN34 (1.7V–5.5V) powers the LDOs, provided VIN34 ≤ VIN12. This allows, for example, using a Li-ion cell for buck rails and a coin cell for always-on LDOs - verified in the Absolute Maximum Ratings and Detailed Description sections.
What is the maximum allowable dropout voltage for the LDOs in the MAX8667ETEAA+?
The MAX8667ETEAA+ LDOs exhibit a maximum dropout voltage of 250mV at 300mA load (per Electrical Characteristics table). To avoid dropout, ensure IN34 is at least 250mV above the highest LDO output voltage - e.g., for 2.8V OUT3/OUT4, maintain IN34 ≥ 3.05V under full load.
Does the MAX8667ETEAA+ support power sequencing between its four outputs?
Yes - the MAX8667ETEAA+ provides individual enable inputs (EN1–EN4) for precise sequencing. For example, EN3/EN4 can assert first to power LDOs, followed by EN1/EN2 after a delay to ramp step-down outputs - timing parameters tPWRON (45µs) and tEN (15–35µs) are specified and measured in the datasheet.
Is the exposed paddle (EP) on the MAX8667ETEAA+ electrically connected internally?
Yes - the exposed paddle (EP) on the MAX8667ETEAA+ is internally connected to GND and must be soldered to the PCB ground plane. It serves as the primary thermal path and low-impedance return for PGND1/PGND2 currents - confirmed in the Pin Description table and Thermal Considerations section.
MAX8667ETEAA+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 16-WFQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Topology:
- Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
- Number of Outputs:
- 4
- Frequency - Switching:
- 1.5MHz
- Voltage/Current - Output 1:
- 1.2V, 600mA
- Voltage/Current - Output 2:
- 1.8V, 1.2A
- Voltage/Current - Output 3:
- 2.8V, 300mA
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TQFN (3x3)
MAX8667ETEAA+ FAQ
1.How can I place an order for MAX8667ETEAA+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX8667ETEAA+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX8667ETEAA+ reliable?
The price and inventory of MAX8667ETEAA+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8667ETEAA+ is usually 5 days.
3.What payment methods are accepted for MAX8667ETEAA+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8667ETEAA+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX8667ETEAA+?
MAX8667ETEAA+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX8667ETEAA+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX8667ETEAA+?
For technical support, including MAX8667ETEAA+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8667ETEAA+ requirements.
6.How does Aetrix verify that MAX8667ETEAA+ is sourced from the original manufacturer or authorized distributors?
All MAX8667ETEAA+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8667ETEAA+ meets industry standards.
7.What is the process for return or replacement of MAX8667ETEAA+?
All MAX8667ETEAA+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX8667ETEAA+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX8667ETEAA+ part is unused and in its original packaging.
Return procedure for MAX8667ETEAA+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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