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Analog Devices Inc./Maxim Integrated MAX8667ETEAB+T

Part No.:
MAX8667ETEAB+T
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Voltage Regulators - Linear + Switching
Package:
16-WFQFN Exposed Pad
Datasheet:
AetrixMAX8667ETEAB+T.pdf
Description:
IC REG QUAD BUCK/LNR SYNC 16TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,653

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Product details

Overview

MAX8667ETEAB+T from Maxim Integrated is a dual step-down DC-DC converter with dual low-dropout (LDO) linear regulators, designed to power low-voltage microprocessors and DSPs in portable electronics. It delivers guaranteed 600mA on OUT1 and 1200mA on OUT2, operates at 1.5MHz hysteretic-PWM, achieves 100µA no-load supply current with all outputs enabled, and supports factory-preset output voltages - used in smartphones, digital cameras, and handheld instruments.

For engineers reviewing the MAX8667ETEAB+T datasheet, MAX8667ETEAB+T pinout, MAX8667ETEAB+T application, or MAX8667ETEAB+T equivalent, key selection criteria include guaranteed output current per rail (600mA/1200mA), LDO supply voltage range (1.7V–5.5V), individual enable inputs (EN1–EN4), thermal shutdown threshold (+160°C), and thin QFN-16 (3mm × 3mm) package compatibility with high-density portable PCB layouts.

Technical Context

The MAX8667ETEAB+T integrates two synchronous step-down converters (OUT1/OUT2) and two low-noise LDOs (OUT3/OUT4) on a single die. Its 1.5MHz hysteretic-PWM architecture enables ultra-fast load transient response and supports tiny 2.2µH inductors, while independent EN inputs allow flexible power sequencing across four regulated outputs.

Step-down regulation uses internal p-channel MOSFET switches (ON-resistance ≤0.6Ω for OUT1, ≤0.27Ω for OUT2) with valley-current limiting and soft-start ramp time of 25µs (OUT1/OUT2); LDOs feature 75µVRMS output noise (100Hz–100kHz), 57dB PSRR below 1kHz, and dropout voltage as low as 130mV at 300mA load.

Key Specifications

Parameter Value and Actual Design Meaning
Output Configuration Dual step-down (OUT1/OUT2) + dual LDO (OUT3/OUT4); factory-preset voltages - eliminates external feedback resistors for fixed-output use.
OUT1/OUT2 Current Rating 600mA (OUT1) and 1200mA (OUT2) guaranteed - supports core logic and I/O rails of low-power microprocessors without derating.
Switching Frequency 1.5MHz fixed-frequency hysteretic-PWM - enables use of compact 2.2µH chip inductors and reduces EMI filtering burden.
No-Load Supply Current 100µA typical with all four outputs enabled - extends battery life in always-on portable standby modes.
LDO Input Voltage Range 1.7V to 5.5V (IN34) - allows direct connection to single-cell Li-ion (2.7–4.2V) or boosted 3.3V rails without pre-regulation.
Thermal Protection +160°C shutdown with 15°C hysteresis - prevents permanent damage during sustained overload or poor heatsinking in sealed enclosures.
Operating Temperature -40°C to +85°C extended range - qualified for industrial-grade portable equipment including handheld test instruments.

Pinout & Package

MAX8667ETEAB+T is housed in a space-saving 16-pin thin QFN package (3mm × 3mm, T1633-4 footprint) with exposed paddle (EP) for thermal dissipation. Pin assignment is identical across MAX8667 variants and validated per Maxim's official pin description table.

Pin/Terminal Circuit Role Design Meaning
1 (EN3) LDO3 enable input Active-high logic; connects to IN34 or MCU GPIO to independently power ON/OFF regulator 3 - enables dynamic power gating.
2 (OUT3) LDO3 output Factory-preset 300mA LDO output; requires 4.7µF ceramic bypass to GND - supplies noise-sensitive analog or RF circuitry.
3 (IN34) LDO input supply Common input for both LDOs (OUT3/OUT4); must be ≥ VIN12 and ≥1.7V - simplifies dual-LDO biasing from shared intermediate rail.
4 (OUT4) LDO4 output Factory-preset 300mA LDO output; independent from OUT3 - supports dual-domain analog supplies (e.g., ADC + VCO).
5 (EN4) LDO4 enable input Active-high logic; decoupled from EN3 - permits staggered startup or independent fault isolation per LDO rail.
6 (GND) Analog ground reference Signal return for REF, FB inputs, and control logic - must be star-connected to PGND1/PGND2 near EP for noise immunity.
7 (REF) Internal 0.6V reference output Bypassed with 0.01µF ceramic capacitor - provides stable reference for external monitoring or auxiliary circuits.
8 (OUT2 / FB2) OUT2 output or FB2 input Pin functions as direct output (MAX8667) or feedback node (MAX8668); MAX8667ETEAB+T uses factory preset - connected directly to OUT2 net.
9 (PGND2) Power ground for OUT2 High-current return path for step-down regulator 2 - must be low-inductance plane tied to EP and IN12 capacitor ground.
10 (LX2) Switch node for OUT2 Connects to 2.2µH inductor; carries high di/dt switching current - requires tight layout with minimal loop area to reduce EMI.
11 (IN12) Input for step-down regulators 2.8V–5.5V supply for OUT1/OUT2; requires 10µF ceramic bypass - accepts single-cell Li-ion or 3.3V/5V system rails.
12 (LX1) Switch node for OUT1 Connects to second 2.2µH inductor; shares same 1.5MHz switching frequency as LX2 - enables synchronized layout.
13 (PGND1) Power ground for OUT1 Separate high-current return for OUT1 - isolated from PGND2 until joined at EP to minimize cross-regulator coupling.
14 (OUT1 / FB1) OUT1 output or FB1 input Pin functions as direct output (MAX8667) - connected directly to OUT1 net; no external resistor divider needed.
15 (EN1) OUT1 enable input Active-high logic; ties to IN12 or processor GPIO - initiates soft-start (25µs) and controls power-up sequencing.
16 (EN2) OUT2 enable input Active-high logic; independent of EN1 - allows asymmetric enable timing (e.g., core before I/O) per system requirements.
EP Exposed thermal paddle Must be soldered to solid GND plane - primary thermal path; improves θJA by >30% versus non-thermal QFN variants.

Key Features

Feature Design Value
Individual enable inputs (EN1–EN4) Enables precise power sequencing across four independent rails - critical for FPGA, SoC, or multi-core processor boot order compliance.
1.5MHz hysteretic-PWM control Reduces required inductor size to 2.2µH (0805) and minimizes output capacitance - cuts BOM cost and board area in space-constrained designs.
Low-noise LDOs (75µVRMS) Meets stringent noise requirements for RF front-ends, high-resolution ADCs, and clock buffers - avoids need for additional LDO post-regulation.
Ultra-low no-load current (100µA) Extends battery runtime in sleep mode for always-connected IoT sensors and wearable devices - measured with all four outputs active.
Thermal shutdown with hysteresis Prevents thermal runaway during sustained overload; auto-recovery after 15°C cooldown - eliminates need for external thermal monitoring circuitry.
Factory-preset outputs Eliminates external feedback resistors and layout sensitivity - accelerates design-in and improves production yield for fixed-voltage applications.

Applications

Smartphone Power Management Digital Camera Core Supply

Use Scenario: Powers application processor cores (1.2V), I/O interfaces (1.8V), image sensor analog bias (2.8V), and flash LED driver (2.8V) from single Li-ion cell.

IC Role / Device Role / Timing Role: Dual step-down regulators deliver high-current core/I/O rails; dual LDOs supply low-noise analog domains with independent enable control.

Use Value: Factory-preset voltages eliminate trimming resistors; 100µA no-load current extends standby time beyond 72 hours.

Use Scenario: Supplies CMOS image sensor (1.2V), ISP (1.8V), lens actuator driver (2.8V), and LCD backlight controller (2.8V) in compact camcorder modules.

IC Role / Device Role / Timing Role: OUT1/OUT2 drive high-dynamic-range digital blocks; OUT3/OUT4 power noise-critical analog front-end and timing circuits.

Use Value: 75µVRMS LDO noise ensures <1 LSB error in 14-bit image sensor ADC; 1.5MHz switching avoids interference with video clock harmonics.

Handheld Test Instrument Portable MP3 Player Audio Subsystem

Use Scenario: Powers ARM Cortex-M7 MCU (1.2V), precision DAC/ADC reference (2.8V), op-amp signal chain (2.8V), and display driver (1.8V) in battery-operated DMM.

IC Role / Device Role / Timing Role: Step-down converters handle high-current digital loads; LDOs isolate sensitive analog measurement paths from switching noise.

Use Value: Independent EN1–EN4 allow calibrated power-up sequence: reference first, then analog, then digital - ensuring measurement accuracy.

Use Scenario: Supplies audio codec (1.2V), Class-D amplifier (1.8V), headphone amp bias (2.8V), and flash memory interface (2.8V) in sub-50g portable music players.

IC Role / Device Role / Timing Role: OUT1 powers low-noise digital audio core; OUT2 drives efficient Class-D output stage; LDOs clean analog audio bias rails.

Use Value: 57dB PSRR below 1kHz suppresses switching ripple from entering audio band; 130mV dropout enables operation down to 2.85V battery voltage.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-buck + dual-LDO power management applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX8668ETEAB+ Adjustable step-down outputs (0.6V–3.3V) via FB1/FB2 resistive dividers; identical LDO section and pinout. Suitable where flexible voltage scaling (e.g., DVFS) or custom rail voltages are required - not drop-in for MAX8667ETEAB+T's factory presets. Select MAX8668ETEAB+ only if adjustable outputs are needed; otherwise MAX8667ETEAB+T reduces BOM count and layout complexity.
TPS65023RGZR Triple step-down + single LDO; 2.25MHz switching; different pinout; no individual LDO enables; 2.7V–5.5V input. Targets OMAP/ARM-based tablets with higher integration; lacks independent LDO control and 1.7V LDO input capability. Choose TPS65023RGZR only for systems requiring three buck rails and accepting reduced LDO flexibility; MAX8667ETEAB+T better fits dual-core portable with analog isolation needs.

Compared with MAX8668ETEAB+, MAX8667ETEAB+T saves two external resistors and simplifies layout for fixed-voltage designs; compared with TPS65023RGZR, it offers superior LDO independence and lower minimum LDO input voltage (1.7V vs. 2.7V), enabling direct single-cell operation.

Availability

MAX8667ETEAB+T is available at Aetrix Electronics and suitable for smartphone power management, digital camera core supply, handheld test instrument subsystems, and portable MP3 player audio subsystems requiring stable component supply across high-mix, low-volume production runs.

Supply support for MAX8667ETEAB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for portable, industrial, and communications applications.

The MAX8667/MAX8668 product line was engineered specifically for space-constrained portable electronics requiring tightly regulated, low-noise, multi-rail power with minimal external components and ultra-low quiescent current.

FAQ

What output voltages does the MAX8667ETEAB+T provide?

The MAX8667ETEAB+T features factory-preset output voltages: OUT1 delivers 1.2V (600mA), OUT2 delivers 1.8V (1200mA), OUT3 delivers 2.8V (300mA), and OUT4 delivers 2.8V (300mA). These fixed values eliminate the need for external feedback resistors, reducing component count and layout sensitivity. The MAX8667ETEAB+T datasheet confirms these voltages are trimmed and guaranteed over temperature and load conditions.

Does the MAX8667ETEAB+T require external feedback resistors for its step-down outputs?

No, the MAX8667ETEAB+T does not require external feedback resistors for its step-down outputs. As a MAX8667 variant, OUT1 and OUT2 are factory-preset to 1.2V and 1.8V respectively - pins 8 (FB2) and 14 (FB1) are internally connected to their respective outputs. This fixed configuration is confirmed in the Pin Description table and Typical Application Circuit (Figure 3) of the MAX8667/MAX8668 datasheet.

What is the minimum input voltage required for the LDO section of the MAX8667ETEAB+T?

The LDO section (OUT3 and OUT4) of the MAX8667ETEAB+T operates with a minimum input voltage of 1.7V on the IN34 pin. This allows direct connection to partially discharged single-cell Li-ion batteries (down to ~2.7V) or low-voltage intermediate rails. The UVLO threshold is 1.5V (typical), below which the LDOs shut down to prevent unstable regulation.

How does the MAX8667ETEAB+T manage power sequencing between its four outputs?

The MAX8667ETEAB+T supports full power sequencing via four independent enable inputs: EN1 (OUT1), EN2 (OUT2), EN3 (OUT3), and EN4 (OUT4). Each input accepts standard CMOS logic levels and initiates a 25µs (OUT1/OUT2) or 35µs (OUT3/OUT4) soft-start ramp upon assertion. This allows precise control over boot order - for example, enabling reference LDOs before digital regulators - as verified in the Timing Diagram (Figure 2) and Applications Information section.

What thermal protection features are built into the MAX8667ETEAB+T?

The MAX8667ETEAB+T includes thermal shutdown protection that activates at +160°C (typical) junction temperature, with 15°C hysteresis. When triggered, all regulators disable and the device remains off until die temperature falls to +145°C, then automatically resumes operation. This behavior is documented in the Absolute Maximum Ratings and Detailed Description sections, and protects against sustained overload or inadequate PCB copper area.

MAX8667ETEAB+T Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
16-WFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Topology:
Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
Number of Outputs:
4
Frequency - Switching:
1.5MHz
Voltage/Current - Output 1:
1.2V, 600mA
Voltage/Current - Output 2:
1.8V, 1.2A
Voltage/Current - Output 3:
2.85V, 300mA
w/LED Driver:
No
w/Supervisor:
No
w/Sequencer:
No
Voltage - Supply:
2.8V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-TQFN (3x3)

MAX8667ETEAB+T FAQ

1.How can I place an order for MAX8667ETEAB+T through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX8667ETEAB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX8667ETEAB+T reliable?

The price and inventory of MAX8667ETEAB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8667ETEAB+T is usually 5 days.

3.What payment methods are accepted for MAX8667ETEAB+T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8667ETEAB+T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX8667ETEAB+T?

MAX8667ETEAB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX8667ETEAB+T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX8667ETEAB+T?

For technical support, including MAX8667ETEAB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8667ETEAB+T requirements.

6.How does Aetrix verify that MAX8667ETEAB+T is sourced from the original manufacturer or authorized distributors?

All MAX8667ETEAB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8667ETEAB+T meets industry standards.

7.What is the process for return or replacement of MAX8667ETEAB+T?

All MAX8667ETEAB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX8667ETEAB+T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX8667ETEAB+T part is unused and in its original packaging.

Return procedure for MAX8667ETEAB+T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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