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Analog Devices Inc./Maxim Integrated MAX8667ETEHR+T

Part No.:
MAX8667ETEHR+T
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Voltage Regulators - Linear + Switching
Package:
16-WFQFN Exposed Pad
Datasheet:
AetrixMAX8667ETEHR+T.pdf
Description:
IC REG QUAD BUCK/LNR SYNC 16TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,300

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Product details

Overview

MAX8667ETEHR+T from Maxim Integrated is a dual step-down DC-DC converter with dual integrated LDO regulators, designed to power low-voltage microprocessors and DSPs in portable electronics. It delivers guaranteed 600mA on OUT1 and 1200mA on OUT2, features factory-preset output voltages, operates at 1.5MHz hysteretic-PWM switching, and achieves 100µA no-load supply current with all regulators enabled.

For engineers reviewing the MAX8667ETEHR+T datasheet, MAX8667ETEHR+T pinout, MAX8667ETEHR+T application, or MAX8667ETEHR+T equivalent, key selection criteria include guaranteed output current per rail, individual enable control for sequencing, ultra-low quiescent current in multi-rail active mode, LDO dropout voltage at 300mA, and thermal shutdown behavior at +160°C.

Technical Context

The MAX8667ETEHR+T integrates two high-efficiency synchronous step-down converters (OUT1/OUT2) and two low-noise LDOs (OUT3/OUT4) on a single die. Its 1.5MHz hysteretic-PWM architecture enables compact 2.2µH inductors and maintains stable regulation across load transients without external compensation.

All four regulators feature independent enable inputs (EN1–EN4), separate input domains (IN12 for buck stages, IN34 for LDOs), and dedicated power grounds (PGND1/PGND2). The device implements undervoltage lockout (2.5V for IN12, 1.6V for IN34), soft-start (100µs for LDOs, variable for bucks), and thermal shutdown with 15°C hysteresis.

Key Specifications

Parameter Value and Actual Design Meaning
Step-down Output Current 600mA guaranteed on OUT1, 1200mA on OUT2 - supports core logic and I/O rails of low-power MPUs
LDO Output Current 300mA guaranteed per LDO (OUT3/OUT4) - sufficient for analog peripherals or memory interfaces
No-load Supply Current 100µA typical with all four regulators enabled - extends battery life in always-on subsystems
Switching Frequency 1.5MHz fixed-frequency hysteretic-PWM - enables use of tiny 2.2µH chip inductors (0805)
LDO Dropout Voltage 250mV max at 300mA load - allows operation from 1.7V IN34 down to 1.45V output
UVLO Thresholds IN12: 2.5V turn-on / 2.4V shutdown; IN34: 1.6V turn-on / 1.5V shutdown - prevents brownout instability
Thermal Shutdown +160°C activation with +15°C hysteresis - protects against sustained overload or poor PCB thermal design

Pinout & Package

MAX8667ETEHR+T is housed in a 3mm × 3mm, 16-pin thin QFN package with exposed paddle (EP), rated for -40°C to +85°C operation. The EP must be soldered to GND/PGND for thermal and electrical integrity.

Pin/Terminal Circuit Role Design Meaning
1 (EN3) Enable input for LDO OUT3 Active-high control; tie to IN34 or drive externally to sequence LDO activation independently
2 (OUT3) LDO regulator 3 output Factory-preset voltage; requires 4.7µF ceramic bypass to GND for stability and noise suppression
3 (IN34) Input supply for both LDOs 1.7V–5.5V range; must be ≤ VIN12; requires ≥4.7µF ceramic decoupling to ground
4 (OUT4) LDO regulator 4 output Factory-preset voltage; same bypass requirement as OUT3; discharged via 1kΩ internal resistor in shutdown
5 (EN4) Enable input for LDO OUT4 Independent control path; enables flexible power-up/down sequencing of analog subsystems
6 (GND) Analog ground reference Common return for REF, EN inputs, and feedback networks; must be low-impedance connection
7 (REF) Internal 0.6V reference output Bypass with 0.01µF ceramic capacitor; used for precision feedback in MAX8668 variants (not adjustable in MAX8667)
8 (OUT2 / FB2) Output or feedback node for buck 2 In MAX8667ETEHR+T: direct connection to OUT2; not configurable - factory preset voltage
9 (PGND2) Power ground for buck regulator 2 Separate return path for high-current LX2 switching loop; must connect to EP and system PGND
10 (LX2) Switch node for buck regulator 2 Connects to 2.2µH inductor; carries high di/dt; requires tight layout to minimize EMI and losses
11 (IN12) Input supply for both buck regulators 2.8V–5.5V range; must be ≥ VIN34; requires ≥10µF ceramic decoupling to ground
12 (LX1) Switch node for buck regulator 1 Same layout criticality as LX2; connects to second 2.2µH inductor; shares PGND1 return
13 (PGND1) Power ground for buck regulator 1 Dedicated return for LX1 switching current; routed separately from AGND but tied at EP
14 (OUT1 / FB1) Output or feedback node for buck 1 In MAX8667ETEHR+T: direct connection to OUT1; fixed output - no external resistor divider needed
15 (EN1) Enable input for buck regulator 1 Active-high; drives internal p-MOSFET gate; enables precise sequencing of processor core rail
16 (EN2) Enable input for buck regulator 2 Independent control of I/O or memory rail; supports staggered startup to limit inrush current
EP Exposed thermal paddle Must be soldered to GND/PGND plane; primary thermal path - critical for >1W dissipation handling

Key Features

Feature Design Value
Individual enable inputs (EN1–EN4) Enables full power sequencing control - e.g., boot core rail first, then I/O, then analog supplies
1.5MHz hysteretic-PWM architecture Eliminates need for external compensation; supports 2.2µH inductors and reduces board area by >30%
Ultra-low 100µA no-load current (all rails) Extends standby time in battery-powered devices where multiple rails remain active during sleep
Low-noise LDOs with 75µVRMS output noise Meets stringent noise requirements for RF receivers, ADC references, and audio codecs
Thermal shutdown with hysteresis Prevents thermal runaway under overload; auto-recovery at +145°C avoids manual reset requirement
Factory-preset outputs (no external resistors) Reduces BOM count and layout complexity - eliminates FB resistor tolerances and placement errors

Applications

Smartphone Application Processor Power Digital Camera Image Sensor Bias

Use Scenario: Powers ARM Cortex-A series application processors requiring tightly regulated 1.2V core and 1.8V I/O rails, plus 2.8V sensor interface and 3.3V lens actuator.

IC Role / Device Role / Timing Role: Dual buck regulators supply dynamic CPU/GPU loads; dual LDOs deliver low-noise bias for image signal processing and autofocus circuits.

Use Value: 100µA no-load current extends standby time; individual EN pins allow staggered boot to avoid battery sag; 1.5MHz switching minimizes EMI near RF front-end.

Use Scenario: Supplies CMOS image sensor with separate 1.2V digital core, 2.8V analog pixel array, and 3.3V timing generator - all from single-cell Li-ion input.

IC Role / Device Role / Timing Role: OUT1/OUT2 provide high-current, fast-transient response for digital/analog domains; OUT3/OUT4 deliver ultra-low-noise bias for pixel readout and clock synthesis.

Use Value: 75µVRMS LDO noise ensures <68dB SNR in 12-bit ADCs; factory presets eliminate calibration overhead; thermal shutdown protects sensor during extended video capture.

Portable Medical Pulse Oximeter Handheld Industrial Scanner

Use Scenario: Powers LED drivers, photodiode amplifier, MCU, and Bluetooth radio in compact wearable oximeters operating from coin-cell or rechargeable LiPo.

IC Role / Device Role / Timing Role: Buck regulators drive high-efficiency red/IR LEDs; LDOs supply precision op-amps and ADC reference; EN control enables duty-cycled measurement bursts.

Use Value: 250mV LDO dropout enables operation down to 1.45V output from 1.7V input - maximizes usable battery range; 100µA quiescent current extends weeks-long battery life.

Use Scenario: Supplies barcode scanner engine (laser diode driver, CMOS imager), ARM-based controller, and wireless module in rugged handheld scanners.

IC Role / Device Role / Timing Role: OUT1 powers laser driver (600mA pulsed); OUT2 feeds imager (1.2A peak); LDOs supply MCU VDDIO and RF transceiver LNA - all sequenced via EN pins.

Use Value: Independent EN control prevents bus contention during cold start; 1.5MHz switching avoids interference with 2.4GHz BLE/Wi-Fi bands; thermal protection safeguards against enclosure overheating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-buck + dual-LDO power management applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS65023RSBR 3 buck + 2 LDO; 2.25MHz switching; 1.5V–6.5V input; no factory-preset option - all outputs adjustable Requires external resistors for all outputs; higher pin count (32-QFN); supports higher input voltage Choose when adjustable outputs and wider VIN range are required; avoid if BOM simplification and fixed-voltage reliability are priorities
RT8070ZSP Dual buck only (no integrated LDOs); 2A/2A outputs; 500kHz–1.5MHz programmable frequency; requires external LDOs for analog rails Higher current capability but adds discrete LDOs, increasing solution size and component count Choose when >1.2A buck current is needed and LDOs can be added externally; avoid when space-constrained or low-noise analog supply is mandatory

Compared with TPS65023RSBR and RT8070ZSP, the MAX8667ETEHR+T offers the smallest footprint (16-pin 3×3mm QFN), lowest no-load current with all rails active (100µA), and factory-preset outputs eliminating tuning - making it optimal for cost-sensitive, space-constrained portable designs where fixed voltage rails are acceptable.

Availability

MAX8667ETEHR+T is available at Aetrix Electronics and suitable for smartphone power management, portable medical instrumentation, digital camera subsystems, and handheld industrial scanners requiring stable component supply across production lifecycles.

Supply support for MAX8667ETEHR+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for portable, industrial, and communications applications.

The MAX8667/MAX8668 product line was designed specifically for space-constrained portable electronics requiring highly integrated, low-quiescent-current power solutions with independent rail control - targeting smartphones, PDAs, and imaging devices.

FAQ

What output voltages does the MAX8667ETEHR+T provide?

The MAX8667ETEHR+T features factory-preset output voltages: OUT1 delivers 1.2V (600mA), OUT2 delivers 1.8V (1200mA), OUT3 delivers 2.8V (300mA), and OUT4 delivers 2.8V (300mA). These values are laser-trimmed during production and require no external resistors - unlike the adjustable MAX8668 variant. All outputs are confirmed in the Electrical Characteristics table of the MAX8667 datasheet.

Does the MAX8667ETEHR+T support power sequencing?

Yes, the MAX8667ETEHR+T provides full power sequencing control via four independent enable inputs: EN1 controls OUT1, EN2 controls OUT2, EN3 controls OUT3, and EN4 controls OUT4. Each enable has a defined power-on time (tPWRON = 25µs for bucks, 45µs for LDOs) and subsequent enable time (tEN = 15µs for bucks, 35µs for LDOs), allowing precise staggered startup to manage inrush current and avoid supply conflicts.

What is the minimum input voltage required for the MAX8667ETEHR+T to operate?

The MAX8667ETEHR+T requires IN12 ≥ 2.8V to power the buck regulators (OUT1/OUT2) and IN34 ≥ 1.7V to power the LDOs (OUT3/OUT4). Undervoltage lockout disables OUT1/OUT2 below 2.4V (typical) and OUT3/OUT4 below 1.5V (typical). Therefore, reliable operation begins at IN12 = 2.8V and IN34 = 1.7V, with both supplies needing to meet their respective thresholds simultaneously.

Can the MAX8667ETEHR+T be used with ceramic output capacitors only?

Yes, the MAX8667ETEHR+T is fully compatible with ceramic output capacitors. The recommended values are 2.2µF for OUT1/OUT2 (buck outputs) and 4.7µF for OUT3/OUT4 (LDO outputs), all using X5R or X7R dielectrics. Ceramic capacitors are explicitly specified in the Typical Application Circuit (Figure 3) and validated for stability across temperature and load - no tantalum or electrolytic capacitors are required.

How does thermal protection work in the MAX8667ETEHR+T?

The MAX8667ETEHR+T incorporates thermal shutdown that activates at +160°C junction temperature and resets at +145°C (15°C hysteresis). When triggered, all regulators shut down until the die cools sufficiently, then automatically resume operation. This behavior is documented in the Absolute Maximum Ratings and Electrical Characteristics tables, and protects the device during sustained overload, poor PCB thermal design, or ambient temperature excursions beyond +85°C.

MAX8667ETEHR+T Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
16-WFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Topology:
Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
Number of Outputs:
4
Frequency - Switching:
1.5MHz
Voltage/Current - Output 1:
1.8V, 600mA
Voltage/Current - Output 2:
1.2V, 1.2A
Voltage/Current - Output 3:
2.6V, 300mA
w/LED Driver:
No
w/Supervisor:
No
w/Sequencer:
No
Voltage - Supply:
2.8V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-TQFN (3x3)

MAX8667ETEHR+T FAQ

1.How can I place an order for MAX8667ETEHR+T through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX8667ETEHR+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX8667ETEHR+T reliable?

The price and inventory of MAX8667ETEHR+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8667ETEHR+T is usually 5 days.

3.What payment methods are accepted for MAX8667ETEHR+T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8667ETEHR+T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX8667ETEHR+T?

MAX8667ETEHR+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX8667ETEHR+T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX8667ETEHR+T?

For technical support, including MAX8667ETEHR+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8667ETEHR+T requirements.

6.How does Aetrix verify that MAX8667ETEHR+T is sourced from the original manufacturer or authorized distributors?

All MAX8667ETEHR+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8667ETEHR+T meets industry standards.

7.What is the process for return or replacement of MAX8667ETEHR+T?

All MAX8667ETEHR+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX8667ETEHR+T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX8667ETEHR+T part is unused and in its original packaging.

Return procedure for MAX8667ETEHR+T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MAX8667ETEHR+T Tags

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