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Analog Devices Inc./Maxim Integrated MAX8668ETEV+T

Part No.:
MAX8668ETEV+T
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Voltage Regulators - Linear + Switching
Package:
16-WFQFN Exposed Pad
Datasheet:
AetrixMAX8668ETEV+T.pdf
Description:
IC REG QUAD BUCK/LNR SYNC 16TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,284

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Product details

Overview

The MAX8668ETEV+T from Maxim Integrated is a dual step-down DC-DC converter with dual low-noise LDO regulators, designed to power microprocessors and DSPs in portable electronics. It delivers 600mA on OUT1 and 1200mA on OUT2, supports adjustable output voltages from 0.6V to 3.3V, operates at 1.5MHz hysteretic-PWM, and achieves 100µA no-load supply current with all outputs enabled - enabling compact, high-efficiency power management in smartphones and digital cameras.

For engineers reviewing the MAX8668ETEV+T datasheet, MAX8668ETEV+T pinout, MAX8668ETEV+T application, or MAX8668ETEV+T equivalent, this page provides verified technical context, validated pin functions, confirmed regulator sequencing behavior, real-world load transient performance (e.g., 10µs response for 300mA step), and precise voltage positioning design implications for PCB layout and capacitor selection.

Technical Context

The MAX8668ETEV+T integrates two synchronous step-down converters using a proprietary hysteretic-PWM control scheme operating at 1.5MHz, enabling use of 2.2µH chip inductors and minimizing external component count. Each buck stage features p-channel high-side switches (RDS(ON) ≤ 0.6Ω) and n-channel synchronous rectifiers with valley-current limiting and 100ns minimum on-time.

It includes two independent 300mA LDOs (OUT3/OUT4) with 1.7V minimum input, 250mV max dropout at full load, 75µVRMS output noise (100Hz–100kHz), and individual enable inputs (EN3/EN4) tied to IN34. All four regulators support independent soft-start (100µs for LDOs, 25–45µs for bucks) and thermal shutdown at +160°C with 15°C hysteresis.

Key Specifications

Parameter Value and Actual Design Meaning
Step-down Output Range 0.6V to 3.3V (adjustable via FB1/FB2 resistor dividers); enables precise core voltage scaling for modern low-voltage processors.
OUT1/OUT2 Current Rating 600mA / 1200mA guaranteed; supports dual-core SoC rails with margin for transient peaks without derating.
Switching Frequency 1.5MHz fixed-frequency hysteretic-PWM; allows use of tiny 2.2µH 0805 inductors and reduces EMI filtering complexity.
No-Load Supply Current 100µA typical with all four regulators enabled; extends battery life in always-on standby modes of portable devices.
LDO Dropout Voltage 250mV max at 300mA load; permits operation from single-cell Li-ion (3.0V min) while maintaining regulation on 2.8V rails.
FB Regulation Voltage 0.600V ±1.5% over -40°C to +85°C; sets absolute accuracy baseline for output voltage programming tolerance.
Enable Timing (tEN) 15µs (buck), 35µs (LDO); enables tight sequencing control for multi-rail SoC power-up without external delay circuits.

Pinout & Package

MAX8668ETEV+T is housed in a 3mm × 3mm, 16-pin thin QFN package with exposed paddle (EP) that must be connected to GND, PGND1, and PGND2 for thermal and electrical integrity. The package supports reflow soldering per JEDEC J-STD-020 and has a maximum junction temperature of +150°C.

Pin/Terminal Circuit Role Design Meaning
1 (EN3) Enable input for LDO OUT3 Active-high logic; drives high or ties to IN34 to activate OUT3; pulls low to reduce quiescent current to <1µA.
2 (OUT3) LDO output rail 3 300mA capable; requires 4.7µF ceramic bypass to GND; internally discharged via 1kΩ in shutdown.
3 (IN34) Input supply for LDOs OUT3/OUT4 1.7V–5.5V range; must be ≤ VIN12; requires ≥4.7µF ceramic decoupling; powers both LDOs and EN3/EN4 logic.
4 (OUT4) LDO output rail 4 300mA capable; identical bypass and discharge behavior as OUT3; independent regulation from OUT3.
5 (EN4) Enable input for LDO OUT4 Functionally identical to EN3; enables independent sequencing of second LDO rail.
6 (GND) Analog ground reference Signal return for REF, FB1/FB2, and enable logic; must be star-connected to PGND1/PGND2 at EP.
7 (REF) 0.6V internal reference output Bypassed with 0.01µF ceramic; used for precision feedback; supplies bias to error amplifiers and FB comparators.
8 (FB2) Feedback input for step-down OUT2 Connects to resistor divider between OUT2 and GND; senses switched-side voltage for voltage positioning.
9 (PGND2) Power ground for step-down OUT2 High-current return path for LX2 switching loop; must be low-inductance connection to EP and IN12 capacitor.
10 (LX2) Switch node for step-down OUT2 Connects to inductor and synchronous rectifier; carries high di/dt; requires tight layout with minimal loop area.
11 (IN12) Input supply for step-down OUT1/OUT2 2.6V–5.5V range; must be ≥ VIN34; requires ≥10µF ceramic decoupling; powers buck controllers and EN1/EN2.
12 (LX1) Switch node for step-down OUT1 Identical function to LX2; separate high-frequency switching node for independent buck channel 1.
13 (PGND1) Power ground for step-down OUT1 Independent high-current return for LX1; routed separately from PGND2 until joined at EP.
14 (FB1) Feedback input for step-down OUT1 Connects to resistor divider between OUT1 and GND; enables programmable output with voltage positioning.
15 (EN1) Enable input for step-down OUT1 Active-high; ties to IN12 for default enable; controls startup timing and sequencing independence.
16 (EN2) Enable input for step-down OUT2 Functionally identical to EN1; allows staggered or simultaneous activation of dual buck outputs.
EP Exposed thermal paddle Must be soldered to solid GND plane; primary thermal path; connects internally to GND, PGND1, and PGND2.

Key Features

Feature Design Value
Hysteretic-PWM architecture Delivers stable 1.5MHz switching without external compensation, reducing design cycle time and BOM count.
Voltage positioning via FB sensing Enables intentional VOUT droop matching inductor DCR, cutting peak-to-peak transient deviation by up to 50%.
Individual regulator enables (EN1–EN4) Supports arbitrary power-up/down sequencing for multi-rail SoCs without external GPIO or sequencer ICs.
Synchronous rectification Eliminates need for external Schottky diodes, improving light-load efficiency and reducing thermal footprint.
Low-noise LDOs (75µVRMS) Meets stringent analog/RF supply requirements in camera modules and audio codecs without added ferrite beads.
Thermal shutdown with hysteresis +160°C trip with 15°C hysteresis prevents thermal runaway during sustained overload or poor heatsinking.

Applications

Smartphone Application Digital Camera Application

Use Scenario: Powering application processor cores (ARM Cortex-A series), GPU, and memory I/O in LTE/5G smartphones with dynamic voltage scaling.

IC Role / Device Role / Timing Role: Dual buck regulators supply VDD_CPU (1.2V/600mA) and VDD_GPU (1.8V/1200mA); LDOs deliver clean 2.8V for image sensor interface and 3.3V for SDIO.

Use Value: 100µA no-load current extends standby time; voltage positioning minimizes required bulk capacitance per rail, saving PCB area.

Use Scenario: Providing regulated rails to CMOS image sensor, ISP, and flash LED driver in compact digital cameras.

IC Role / Device Role / Timing Role: OUT1 powers sensor analog core (1.2V/600mA); OUT2 supplies digital ISP (1.8V/1200mA); OUT3/OUT4 feed sensor interface (2.8V) and flash logic (3.3V).

Use Value: 75µVRMS LDO noise prevents image banding; 1.5MHz switching avoids interference with sensor pixel clock harmonics.

Portable Media Player Handheld Test Instrument

Use Scenario: Delivering multiple low-noise, tightly regulated voltages to audio DAC, RF tuner, and display controller in MP3/DVD players.

IC Role / Device Role / Timing Role: Buck converters drive main SoC rails; LDOs isolate sensitive audio circuitry (OUT3 = 3.3V for DAC, OUT4 = 1.8V for codec PLL).

Use Value: Independent EN3/EN4 allows muting audio LDOs during playback pause, cutting system quiescent current by 20µA per rail.

Use Scenario: Generating precision rails for ADC reference, op-amp front-end, and microcontroller in battery-powered handheld meters.

IC Role / Device Role / Timing Role: OUT1 supplies 3.3V MCU core; OUT2 powers 5V analog front-end via charge pump; OUT3/OUT4 deliver 2.5V reference and 1.2V ADC digital.

Use Value: 0.6V FB reference enables accurate 2.5V generation with <±1% error; thermal shutdown protects against probe short-circuit faults.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-buck-with-LDO applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS65023RSBR 3 buck + 2 LDO, 2.25–6V input, fixed 1.2/1.5/1.8V buck outputs, no adjustable range; 1.2MHz sync buck; 125µA no-load. Fixed-output architecture limits flexibility for custom SoC voltage scaling; better suited for TI OMAP-based designs. Select when fixed 1.2V/1.5V/1.8V rails match target SoC and board space allows larger 4×4mm QFN.
RT8070ZSP Dual adjustable buck (0.6–5.5V), no integrated LDOs; requires external LDOs for low-noise rails; 2.5MHz operation; 50µA no-load. Lacks on-die LDOs - increases BOM count and layout complexity for noise-sensitive analog rails. Choose only if system already uses discrete low-noise LDOs and higher switching frequency is needed to shrink inductors.

Compared with TPS65023RSBR and RT8070ZSP, the MAX8668ETEV+T uniquely combines adjustable buck outputs (0.6–3.3V), integrated low-noise LDOs, and voltage positioning in a 3×3mm footprint - making it optimal for space-constrained, multi-rail portable designs requiring both flexibility and analog cleanliness.

Availability

MAX8668ETEV+T is available at Aetrix Electronics and suitable for smartphone power management, digital camera SoC sequencing, portable media player voltage scaling, handheld instrument precision rails, and battery-powered embedded systems requiring stable component supply across production lifecycles.

Supply support for MAX8668ETEV+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.

The MAX8668ETEV+T belongs to Maxim's portable power management product line, engineered specifically to consolidate multiple voltage rails in space- and efficiency-critical handheld devices while maintaining low noise and precise sequencing control.

FAQ

What is the input voltage range for the step-down regulators in MAX8668ETEV+T?

The step-down regulators (OUT1 and OUT2) of the MAX8668ETEV+T accept an input voltage range of 2.6V to 5.5V on the IN12 pin. This supply must be greater than or equal to the LDO input voltage (VIN34). Operation below 2.4V triggers undervoltage lockout, disabling the buck stages until VIN12 rises above 2.5V.

How does voltage positioning work on MAX8668ETEV+T buck outputs?

Voltage positioning in the MAX8668ETEV+T is implemented by sensing feedback (FB1/FB2) on the switched side of the inductor (LX node), causing intentional output droop proportional to load current and inductor DCR. This matches transient load-induced voltage sag, reducing peak-to-peak deviation and lowering required output capacitance - a verified behavior confirmed in Figures 3 and 5 of the MAX8668ETEV+T datasheet.

Can MAX8668ETEV+T LDOs operate from a 1.8V input supply?

Yes, the MAX8668ETEV+T LDOs (OUT3 and OUT4) support input voltages as low as 1.7V on the IN34 pin. At 1.8V input and 300mA load, the dropout voltage remains within specification (≤250mV), delivering ≥1.55V output - sufficient for powering 1.5V or 1.8V logic rails directly from partially discharged Li-ion cells.

What is the guaranteed output current for each regulator in MAX8668ETEV+T?

The MAX8668ETEV+T guarantees 600mA on step-down output OUT1, 1200mA on step-down output OUT2, and 300mA on each LDO output (OUT3 and OUT4). These values are production-tested and specified over the full -40°C to +85°C temperature range, with current-limit thresholds of 700–1100mA (OUT1) and 1333–2000mA (OUT2) for robust overload protection.

Does MAX8668ETEV+T require external compensation components?

No, the MAX8668ETEV+T uses a proprietary hysteretic-PWM control architecture that operates stably without external compensation networks. Its 1.5MHz fixed-frequency operation and internal error amplifier design eliminate the need for phase-compensation capacitors or resistors - simplifying layout and reducing BOM cost compared to traditional voltage-mode or current-mode controllers.

MAX8668ETEV+T Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
16-WFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Topology:
Step-Down (Buck) Synchronous (2), Linear (LDO) (2)
Number of Outputs:
4
Frequency - Switching:
1.5MHz
Voltage/Current - Output 1:
0.6V ~ 3.3V, 600mA
Voltage/Current - Output 2:
0.6V ~ 3.3V, 1.2A
Voltage/Current - Output 3:
3.3V, 300mA
w/LED Driver:
No
w/Supervisor:
No
w/Sequencer:
No
Voltage - Supply:
2.6V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-TQFN (3x3)

MAX8668ETEV+T FAQ

1.How can I place an order for MAX8668ETEV+T through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX8668ETEV+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX8668ETEV+T reliable?

The price and inventory of MAX8668ETEV+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8668ETEV+T is usually 5 days.

3.What payment methods are accepted for MAX8668ETEV+T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8668ETEV+T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX8668ETEV+T?

MAX8668ETEV+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX8668ETEV+T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX8668ETEV+T?

For technical support, including MAX8668ETEV+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8668ETEV+T requirements.

6.How does Aetrix verify that MAX8668ETEV+T is sourced from the original manufacturer or authorized distributors?

All MAX8668ETEV+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8668ETEV+T meets industry standards.

7.What is the process for return or replacement of MAX8668ETEV+T?

All MAX8668ETEV+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX8668ETEV+T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX8668ETEV+T part is unused and in its original packaging.

Return procedure for MAX8668ETEV+T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MAX8668ETEV+T Tags

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