Analog Devices Inc./Maxim Integrated MAX8883EUTGG
- Part No.:
- MAX8883EUTGG
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- SOT-23-6
- Datasheet:
-
MAX8883EUTGG.pdf
- Description:
- IC REG LINEAR LDO
- Quantity:
- Payment:

- Shipping:

Inventory:1,181
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Product details
Overview
MAX8883EUTGG from Maxim Integrated is a dual low-noise, low-dropout linear regulator IC delivering two independent 3.0V outputs at up to 160mA each, operating from 2.5V to 6.5V input. It features 72mV dropout at 80mA load, 165µA quiescent current (both LDOs active), and independent logic-controlled shutdown inputs for power sequencing in portable electronics.
For engineers reviewing the MAX8883EUTGG datasheet, MAX8883EUTGG pinout, MAX8883EUTGG application, or MAX8883EUTGG equivalent, key selection criteria include dual-output voltage matching (3.0V/3.0V), SOT23-6 package constraints, independent SHDNA/SHDNB control timing, and low-noise performance requirements in battery-powered systems.
Technical Context
The MAX8883EUTGG integrates two P-channel MOSFET pass transistors with 1Ω typical RDS(ON), enabling load-proportional dropout and eliminating base-drive current loss. Its internal reference is shared but independently gated per output via SHDNA and SHDNB, allowing asymmetric enable/disable without cross-regulation.
Each LDO includes dedicated current limiting (160mA min guaranteed), thermal shutdown at +160°C with 10°C hysteresis, and channel-to-channel isolation >60dB at 10kHz. PSRR is 60dB at 100Hz and rolls off above 100kHz, optimized for clean DC supply generation rather than high-frequency noise rejection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage (A/B) | 3.0V / 3.0V - fixed, factory-trimmed outputs requiring no external feedback resistors. |
| Max Output Current | 160mA per channel - supports dual-core µP I/O rails or parallel sensor biasing without derating. |
| Dropout Voltage | 72mV at 80mA - enables operation down to VIN = 3.072V while maintaining regulation on both outputs. |
| Quiescent Current | 165µA (both LDOs on) - stable across load and dropout, critical for battery runtime in always-on subsystems. |
| PSRR | 60dB at 100Hz - suppresses low-frequency ripple from switching pre-regulators or noisy DC sources. |
| Output Noise | 320µVRMS (10Hz–100kHz) - measured with 4.7µF output cap; higher than MAX8882 due to lack of BP pin. |
| Shutdown Current | 10nA (both SHDNA & SHDNB low) - enables deep-sleep modes with nanowatt system leakage. |
Pinout & Package
The MAX8883EUTGG is housed in a 6-pin SOT23-6 package with exposed pad not electrically connected; GND pin serves as primary thermal path and must be soldered to a large copper area for thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - OUTB | Regulator B output terminal | Sources up to 160mA; requires 2.2µF ceramic capacitor (ESR <0.5Ω) to GND for stability. |
| 2 - GND | Power ground and thermal pad | Electrical reference and primary heat sink; must connect to PCB ground plane for thermal reliability. |
| 3 - SHDNA | Logic input for Regulator A shutdown | Active-low control: drives OUTA into high-Z when pulled ≤0.4V; reference remains active if SHDNB = high. |
| 4 - SHDNB | Logic input for Regulator B shutdown | Active-low control: drives OUTB into high-Z when pulled ≤0.4V; reference remains active if SHDNA = high. |
| 5 - IN | Main input supply rail | Accepts 2.5V–6.5V; powers both LDOs and internal reference; bypass with 2.2µF to GND. |
| 6 - OUTA | Regulator A output terminal | Sources up to 160mA; identical output characteristics and stability requirements as OUTB. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent shutdown controls | SHDNA and SHDNB allow granular power sequencing - e.g., keep sensor bias (OUTB) active while disabling processor core (OUTA). |
| P-channel MOSFET pass devices | Eliminates base-drive current loss, enabling constant 165µA quiescent current across full load and dropout range. |
| Thermal shutdown with hysteresis | Shuts down at +160°C junction temperature and re-enables only after cooling by 10°C, preventing thermal oscillation during overload. |
| Guaranteed current limiting | 160mA minimum per channel limits fault current during short-circuit events without external components. |
| High channel-to-channel isolation | >60dB at 10kHz prevents transient coupling between OUTA and OUTB - critical for mixed-signal SoC power domains. |
Applications
| Cellular Handset Baseband Power | Dual-Core Microcontroller I/O Rails |
|---|---|
Use Scenario: Powering baseband processor and RF transceiver analog sections in GSM/UMTS handsets with tight battery voltage swing. IC Role / Device Role / Timing Role: Dual LDO providing isolated 3.0V supplies to minimize noise coupling between digital baseband and sensitive RF analog blocks. Use Value: 72mV dropout extends usable battery life by enabling regulation until VIN drops to 3.072V, while independent shutdown allows RF section retention during baseband sleep. | Use Scenario: Supplying separate 3.0V rails to two independent MCU cores and their peripheral I/O banks in embedded control units. IC Role / Device Role / Timing Role: Single-package dual LDO delivering matched, low-noise voltage domains with independent enable control for core-level power gating. Use Value: 165µA quiescent current preserves battery autonomy in multi-core sleep states, and 160mA per rail supports burst-mode peripheral activation without cross-rail droop. |
| Portable Medical Sensor Hub | Digital Camera Image Sensor Bias |
Use Scenario: Powering analog front-end (AFE) and digital signal processor (DSP) in handheld ECG or pulse oximeter devices. IC Role / Device Role / Timing Role: Dual LDO supplying clean 3.0V to precision AFE and lower-noise 3.0V to DSP, with SHDNA used to gate AFE during measurement idle cycles. Use Value: 320µVRMS output noise meets clinical-grade signal integrity requirements, and thermal shutdown protects against enclosure overheating during extended use. | Use Scenario: Providing stable 3.0V bias to CMOS image sensor and its companion ISP in compact digital cameras. IC Role / Device Role / Timing Role: Dual LDO delivering synchronized startup and independent shutdown for sensor reset sequencing and ISP power-down during standby. Use Value: Independent SHDNA/SHDNB pins enable precise timing control - e.g., hold sensor bias active during ISP firmware reload while minimizing total system current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS79533DCKR | Single 3.3V LDO in SC70-5; no dual output or independent shutdown. | Requires two devices for dual-rail design; lacks SHDNA/SHDNB sequencing capability. | Select only if single-rail operation suffices and board space permits dual placement. |
| RT9013-30GB | Single 3.0V LDO in SOT23-5; 250mA output, 25µA IQ, but no second output or independent control. | Cannot replicate dual-output functionality; no provision for asymmetric enable/disable. | Use only for cost-sensitive single-rail designs where sequencing is handled externally. |
Compared with TPS79533DCKR and RT9013-30GB, the MAX8883EUTGG uniquely delivers matched dual 3.0V outputs with independent logic-controlled shutdown in a single SOT23-6 package - reducing component count, PCB area, and enabling true per-rail power management unachievable with single-channel alternatives.
Availability
MAX8883EUTGG is available at Aetrix Electronics and suitable for cellular telephony, portable medical instrumentation, digital imaging, and dual-core microcontroller applications requiring stable component supply and long-term production continuity.
Supply support for MAX8883EUTGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, automotive, and portable applications.
The MAX8882/MAX8883 product line targets battery-powered portable electronics requiring ultra-low quiescent current, low-noise dual-rail regulation, and minimal board footprint - specifically addressing power sequencing and efficiency challenges in space-constrained handheld devices.
FAQ
What output voltages does the MAX8883EUTGG provide?
The MAX8883EUTGG provides two fixed, factory-trimmed 3.0V outputs - one on OUTA (pin 6) and one on OUTB (pin 1). These are non-adjustable and require no external feedback components. The top-mark "AAZU" confirms the 3.0V/3.0V variant per Maxim's ordering guide. Each output delivers up to 160mA continuously with ±2% accuracy over temperature and load.
How does shutdown work on the MAX8883EUTGG compared to the MAX8882?
The MAX8883EUTGG uses two independent active-low shutdown inputs - SHDNA (pin 3) for OUTA and SHDNB (pin 4) - enabling selective disable of either output while keeping the other active and the internal reference powered. In contrast, the MAX8882 uses a single SHDN pin (pin 4) that disables both outputs simultaneously. This makes the MAX8883EUTGG suitable for applications requiring asymmetric power sequencing.
Does the MAX8883EUTGG support low-noise operation like the MAX8882?
No - the MAX8883EUTGG lacks the BP (bypass) pin present on the MAX8882, so it cannot achieve the same 40µVRMS noise performance. Its specified output noise is 320µVRMS (10Hz–100kHz) with 4.7µF output capacitance. The absence of BP means noise filtering relies solely on output capacitor selection and layout; no external 0.01µF ceramic bypass is possible.
What thermal considerations apply to the MAX8883EUTGG in SOT23-6?
The MAX8883EUTGG uses pin 2 (GND) as its primary thermal path. To maintain safe junction temperature, this pin must be soldered to a large PCB copper area or ground plane - not just a narrow trace. At 80mA per output and 3.6V input, power dissipation is ~272mW; without adequate thermal sinking, junction temperature can exceed the +150°C absolute maximum rating, triggering thermal shutdown at +160°C.
Can the MAX8883EUTGG replace the MAX8882EUTGG in an existing design?
No direct replacement is possible without board modification. Although both share the same SOT23-6 package and 3.0V/3.0V output configuration, the MAX8883EUTGG replaces the MAX8882's SHDN (pin 4) and BP (pin 3) with SHDNA (pin 3) and SHDNB (pin 4). Pin 3 and pin 4 functions are swapped and incompatible - using MAX8883EUTGG in a MAX8882 layout would leave both regulators permanently disabled or cause undefined behavior.
MAX8883EUTGG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- SOT-23-6
- Packaging:
- Bulk
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 2
- Voltage - Input (Max):
- 6.5V
- Voltage - Output (Min/Fixed):
- 3.3V, 3.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.144V @ 80mA
- Current - Output:
- 160mA, 160mA
- Current - Quiescent (Iq):
- 265 µA
- Current - Supply (Max):
- -
- PSRR:
- 10dB (100Hz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature, Short Circuit
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-6
MAX8883EUTGG FAQ
1.How can I place an order for MAX8883EUTGG through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX8883EUTGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX8883EUTGG reliable?
The price and inventory of MAX8883EUTGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8883EUTGG is usually 5 days.
3.What payment methods are accepted for MAX8883EUTGG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8883EUTGG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX8883EUTGG?
MAX8883EUTGG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX8883EUTGG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX8883EUTGG?
For technical support, including MAX8883EUTGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8883EUTGG requirements.
6.How does Aetrix verify that MAX8883EUTGG is sourced from the original manufacturer or authorized distributors?
All MAX8883EUTGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8883EUTGG meets industry standards.
7.What is the process for return or replacement of MAX8883EUTGG?
All MAX8883EUTGG units undergo pre-shipment inspection (PSI). If there is an issue with MAX8883EUTGG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX8883EUTGG part is unused and in its original packaging.
Return procedure for MAX8883EUTGG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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