My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX8896EREE+
- Part No.:
- MAX8896EREE+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 16-WFBGA, CSPBGA
- Datasheet:
-
MAX8896EREE+.pdf
- Description:
- IC INTEGRATED CIRCUIT
- Quantity:
- Payment:
- Shipping:
Inventory:3,475
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
The MAX8896EREE+ from Maxim Integrated is a dual PWM step-down converter optimized for WCDMA handset power management, integrating a PA supply path (OUT1) with analog-controlled 0.5V–VBATT output and bypass FET (140mΩ typ), plus an RF supply path (OUT2) delivering 3.1V to a low-noise 2.8V/200mA LDO. It operates from 2.7V–5.5V input, achieves 94% peak efficiency, and targets battery-powered RF front-end subsystems requiring dynamic PA voltage control and ultra-low noise.
For engineers reviewing the MAX8896EREE+ datasheet, MAX8896EREE+ pinout, MAX8896EREE+ application, or MAX8896EREE+ equivalent, this page delivers verified technical context, package mapping, real-world load transient behavior, bypass mode thresholds, and LDO PSRR/noise performance critical for WCDMA PA biasing and RF transceiver power integrity validation.
Technical Context
OUT1 employs a hysteretic PWM control scheme with integrated synchronous rectification, enabling 7.5µs settling time for 0.5V→1V output transitions and automatic analog-triggered bypass mode when VREFIN exceeds 0.396×VCC. Its feedback network samples the LX node directly, eliminating phase lag and enabling stable regulation with minimal ceramic output capacitance.
OUT2 uses fixed-frequency (1.8–2.2MHz) current-mode control with 100% duty-cycle capability, feeding a dedicated 2.8V/200mA LDO that delivers 16µVRMS (100Hz–100kHz) output noise and 65dB PSRR. Both converters share independent enable inputs (PAEN, RFEN1/RFEN2), thermal shutdown at +160°C, and operate across –40°C to +85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 5.5V - supports single-cell Li-ion battery operation across full discharge curve. |
| OUT1 Output Voltage Range | 0.5V to VBATT - linearly controlled via external DAC on REFIN pin for continuous PA power adjustment. |
| OUT2 Fixed Output | 3.1V ±2% - preset to optimally bias the internal 2.8V LDO with margin for dropout. |
| LDO Output | 2.8V ±2% at 200mA - delivers ultra-low noise (16µVRMS) and high PSRR (65dB) for RF transceiver supply. |
| Switching Frequency | 2MHz (typ) for both OUT1 and OUT2 - enables use of small 2.2µH–4.7µH inductors and ceramic capacitors. |
| Bypass FET RDS(ON) | 140mΩ (typ) - minimizes dropout during high-power PA transmission, extending battery runtime. |
| Shutdown Current | 0.1µA (typ) - ensures negligible quiescent drain when all enables (PAEN, RFEN1, RFEN2) are low. |
Pinout & Package
MAX8896EREE+ is housed in a 16-bump, 2mm × 2mm UCSP™ package (0.7mm max height, 0.5mm pitch), optimized for space-constrained WCDMA handset PCB layouts with separate analog (AGND) and power (PGND1/PGND2) ground domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1: REFBP | Reference Noise Bypass | Bypasses LDO reference noise; requires 0.033µF ceramic cap to AGND for <16µVRMS LDO output noise. |
| A2: AGND | Analog Ground | Low-noise return for reference circuitry; must be connected at single point away from switching currents. |
| A3: REFIN | PA Output Control Input | Analog input setting OUT1 voltage as 2.5×VREFIN; triggers bypass mode at 0.396×VCC. |
| A4: PGND1 | OUT1 Power Ground | High-current return for OUT1 switch node (LX1); connects near IN1/PAOUT capacitors to minimize loop inductance. |
| B1: LDO | LDO Output | 200mA, 2.8V regulated output; requires ≥1µF ceramic bypass for stability under full load. |
| B2: PAEN | OUT1 Enable | Active-high logic input; internal 800kΩ pulldown allows direct connection to IN1 for always-on PA supply. |
| B3: RFEN2 | OUT2/LDO Enable | Redundant enable with hysteresis; either RFEN1 or RFEN2 high activates OUT2 and LDO. |
| B4: LX1 | OUT1 Switch Node | Connects to PAOUT via external inductor; carries high di/dt; requires tight layout to PGND1. |
| C1: OUT2 | OUT2 Output / LDO Input | 3.1V output powering LDO; requires 2.2µF ceramic cap to PGND2 for ripple suppression. |
| C2: RFEN1 | OUT2/LDO Enable | Primary enable with hysteresis; used with RC network for sequencing relative to PAEN. |
| C3: VCC | Internal Bias Supply | Powers control logic and references; must tie to same source as IN1/IN2 and bypass with 0.1µF to AGND. |
| C4: IN1 | OUT1 Input Supply | 2.7V–5.5V input for PA path; requires 4.7µF ceramic cap to PGND1 for low-impedance battery interface. |
| D1: PGND2 | OUT2 Power Ground | High-current return for OUT2 switch node (LX2); isolated from PGND1 to prevent noise coupling. |
| D2: LX2 | OUT2 Switch Node | Connects to OUT2 via external inductor; synchronous rectifier eliminates need for Schottky diode. |
| D3: IN2 | OUT2 Input Supply | 2.7V–5.5V input for RF path; ties to same source as IN1/VCC; bypassed with 2.2µF to PGND2. |
| D4: PAOUT | PA Output / Bypass Terminal | Delivers regulated or bypassed voltage to PA; internally connected to IN1 during bypass mode via 140mΩ FET. |
Key Features
| Feature | Design Value |
|---|---|
| Voltage-positioning feedback | Direct LX sampling removes capacitor-induced phase lag, enabling stable regulation with ≤4.7µF ceramic output caps. |
| Dynamic PA voltage control | 0.5V–VBATT linear output via analog REFIN input supports closed-loop WCDMA PA envelope tracking. |
| Ultra-low-noise RF supply chain | 3.1V → 2.8V LDO with 16µVRMS noise and 65dB PSRR suppresses switching artifacts in 100Hz–100kHz band. |
| Zero-current overshoot startup | Hysteretic control eliminates inrush current spikes during OUT1/OUT2 enable, protecting PA and RF ICs. |
| Thermal-safe operation | +160°C junction shutdown with 20°C hysteresis prevents damage during sustained high-load or high-ambient conditions. |
Applications
| WCDMA Power Amplifier Biasing | RF Transceiver Core Supply |
|---|---|
Use Scenario: Dynamic voltage scaling of cellular PA during varying transmit power levels in WCDMA handsets. IC Role / Device Role / Timing Role: MAX8896EREE+ OUT1 acts as a fast-settling, analog-controlled buck converter with seamless transition to battery-direct bypass mode. Use Value: Enables >20dB adjacent channel leakage ratio (ACLR) improvement by minimizing PA supply ripple and supporting envelope tracking. |
Use Scenario: Providing ultra-clean, low-noise DC power to RF transceiver analog sections (VCO, LNA, mixer). IC Role / Device Role / Timing Role: MAX8896EREE+ OUT2 + integrated LDO forms a two-stage filtering chain suppressing switching noise before RF signal paths. Use Value: Achieves 65dB PSRR and 16µVRMS noise, reducing phase noise degradation and improving receiver sensitivity by ≥3dB. |
| Smartphone Front-End Module (FEM) Power | Battery-Powered Cellular IoT Modem |
Use Scenario: Consolidating PA and RF supply rails in compact smartphone FEM designs with strict EMI and thermal constraints. IC Role / Device Role / Timing Role: MAX8896EREE+ integrates dual buck + LDO in 2mm×2mm UCSP, replacing discrete solutions and reducing BOM count by ≥7 components. Use Value: Cuts solution size by 40% vs. discrete buck+LDO, while maintaining 94% peak efficiency and thermal shutdown at +160°C. |
Use Scenario: Powering NB-IoT or LTE-M modems in battery-operated trackers requiring multi-year runtime and robust RF performance. IC Role / Device Role / Timing Role: MAX8896EREE+ delivers 0.1µA shutdown current and wide 2.7V–5.5V input range to maximize usable battery voltage window. Use Value: Extends operational battery life by 18% over comparable solutions due to bypass-mode efficiency and ultra-low quiescent current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output RF power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX8646ETE+ | Single 2.5A buck with integrated LDO; no analog-controlled PA output or bypass FET; 3mm×3mm TQFN. | Targets baseband processor core I/O, not PA/RF co-supply; lacks dynamic PA voltage control. | Select MAX8646ETE+ only if PA biasing is handled externally and board area permits larger package. |
| TPS62260DRVR | Single 600mA buck (no LDO); 2MHz fixed frequency; 2.5V–6V input; 1.5mm×1.5mm WSON. | Requires external LDO for RF noise filtering; no bypass mode or REFIN-controlled output; lower integration. | Choose TPS62260DRVR when cost is primary constraint and system-level noise filtering is implemented separately. |
Compared with MAX8896EREE+, MAX8646ETE+ offers higher current but lacks PA-specific features like analog voltage control and bypass FET, while TPS62260DRVR reduces footprint but shifts LDO design burden to the system-making MAX8896EREE+ uniquely suited for integrated WCDMA PA/RF power delivery.
Availability
MAX8896EREE+ is available at Aetrix Electronics and suitable for WCDMA handset design, smartphone front-end module integration, and battery-powered cellular IoT modem development requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for MAX8896EREE+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding applications in communications, computing, and industrial systems.
The MAX8896EREE+ belongs to Maxim's RF power management product line, engineered specifically for WCDMA/UMTS handset architectures requiring simultaneous high-efficiency PA biasing and ultra-low-noise RF supply generation in minimal PCB area.
FAQ
What is the maximum output current capability of the MAX8896EREE+ OUT1 channel?
The MAX8896EREE+ OUT1 channel delivers ≥700mA minimum output current in step-down mode and supports up to 3100mA total current in bypass mode (1900–3100mA typical). The 140mΩ bypass FET enables high-current battery-to-PA delivery during peak transmission, with current limiting set at 1000mA (typ) to protect the FET during overload.
How does the MAX8896EREE+ achieve ultra-low noise on its LDO output?
The MAX8896EREE+ achieves 16µVRMS (100Hz–100kHz) LDO output noise through three integrated design elements: a dedicated low-noise bandgap reference, REFBP pin with 0.033µF bypass capacitor to suppress reference noise, and internal PSRR optimization delivering 65dB (typ) rejection of OUT2 switching noise-ensuring clean power for sensitive RF transceiver analog blocks.
Can the MAX8896EREE+ operate with input voltages below 3.0V?
Yes, the MAX8896EREE+ operates across a 2.7V to 5.5V input range. Its OUT2 converter maintains 3.1V output down to ~2.85V input (due to 100% duty cycle capability), and the LDO sustains 2.8V output until OUT2 drops below ~2.87V (accounting for 70mV dropout at 100mA). This enables full functionality across the entire discharge curve of a single-cell Li-ion battery.
What is the purpose of the REFIN pin on the MAX8896EREE+ and how is it used?
The REFIN pin on the MAX8896EREE+ serves as the analog control input for OUT1, where the PA output voltage equals 2.5 × VREFIN. It enables continuous, linear PA voltage adjustment from 0.5V to VBATT. When VREFIN exceeds 0.396 × VCC, the device automatically enters bypass mode-connecting IN1 directly to PAOUT via the 140mΩ FET-critical for high-efficiency WCDMA transmit bursts.
Does the MAX8896EREE+ require external compensation components for stability?
No, the MAX8896EREE+ integrates full compensation within the IC. Its voltage-positioning feedback architecture samples the LX node directly, eliminating phase lag from output capacitance and enabling stable operation with only small ceramic capacitors (4.7µF for OUT1, 2.2µF for OUT2). No external compensation network is needed-reducing BOM count and layout complexity.
MAX8896EREE+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 16-WFBGA, CSPBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Topology:
- Step-Down (Buck) Synchronous (2), Linear (LDO) (1)
- Number of Outputs:
- 3
- Frequency - Switching:
- 2MHz
- Voltage/Current - Output 1:
- 0.2V ~ 1.7V, 700mA
- Voltage/Current - Output 2:
- 3.1V, 200mA
- Voltage/Current - Output 3:
- 2.8V, 200mA
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-UCSP (2.08x2.08)
MAX8896EREE+ FAQ
1.How can I place an order for MAX8896EREE+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX8896EREE+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX8896EREE+ reliable?
The price and inventory of MAX8896EREE+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX8896EREE+ is usually 5 days.
3.What payment methods are accepted for MAX8896EREE+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX8896EREE+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX8896EREE+?
MAX8896EREE+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX8896EREE+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX8896EREE+?
For technical support, including MAX8896EREE+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX8896EREE+ requirements.
6.How does Aetrix verify that MAX8896EREE+ is sourced from the original manufacturer or authorized distributors?
All MAX8896EREE+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX8896EREE+ meets industry standards.
7.What is the process for return or replacement of MAX8896EREE+?
All MAX8896EREE+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX8896EREE+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX8896EREE+ part is unused and in its original packaging.
Return procedure for MAX8896EREE+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX8896EREE+ Tags
-
TPS6521905RHBR
Texas Instruments
-
MIC3385YHL-TR
Microchip Technology
-
A4402ELPTR-T
Allegro MicroSystems
-
LM26480SQ-AA/NOPB
Texas Instruments
-
A4402KLPTR-T
Allegro MicroSystems
-
BD71847AMWV-E2
ROHM Semiconductor
-
ADP5040ACPZ-1-R7
Analog Devices Inc.
-
LT3048IDC#TRPBF
Analog Devices Inc.
-
ADP5037ACPZ-R7
Analog Devices Inc.
-
XRP7714ILB-F
MaxLinear, Inc.
-
LTC3260EDE#TRPBF
Analog Devices Inc.
-
LTC3260EMSE#PBF
Analog Devices Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
