Analog Devices Inc./Maxim Integrated MAX9967BGCCQ+B0U

Overview

MAX9967BGCCQ+B0U from Maxim Integrated is a dual-channel, low-power, high-speed ATE driver/comparator/load (DCL) IC designed for automated test equipment. It integrates three-level pin drivers, dual comparators, programmable clamps, and a 35mA active load per channel, operating across -1.5V to +6.5V with 500Mbps data rate and ±100mV driver offset (MAX9967B variant). It enables at-speed parametric IOH/IOL testing and contact continuity verification in memory ATE systems.

For engineers reviewing the MAX9967BGCCQ+B0U datasheet, MAX9967BGCCQ+B0U pinout, MAX9967BGCCQ+B0U application, or MAX9967BGCCQ+B0U equivalent, key selection considerations include its 100-pin TQFP-EPR package with exposed die pad, differential ECL/LVPECL/LVDS-compatible control inputs, digitally programmable slew rate, low timing dispersion (<±50ps prop delay match), and independent per-channel reference support-critical for multi-site parallel test architectures requiring channel isolation.

Technical Context

The MAX9967BGCCQ+B0U implements a dual-channel architecture where each channel contains independent driver, comparator, clamp, and active-load subsystems. Its driver supports high-impedance, active-termination (3rd-level), and drive modes with <2.5ns propagation delay and <1.5ns rise/fall time (3VP-P, 50Ω); comparators deliver <±100mV offset and <±25ps matching within package, with open-collector outputs configurable for ECL/LVPECL logic families.

Control is managed via a 3-wire CMOS serial interface supporting low-leakage mode (60nA), slew-rate programming (25%/50%/75%/100% of full speed), and tri-state/terminate configuration. The device uses separate ±5.25V/9.75V supplies (VEE/VCC), features an integrated die temperature monitor (3.43V @ +70°C, +10mV/°C), and operates up to +100°C junction temperature with thermal management enabled by the 8mm × 8mm exposed top die pad.

Key Specifications

Pinout & Package

MAX9967BGCCQ+B0U is housed in a 100-pin, 14mm × 14mm body, 0.5mm pitch TQFP-EPR (Exposed Pad Reversed) package with an 8mm × 8mm exposed die pad on the top surface for enhanced thermal conduction. Pin functions are organized into dual symmetric channel groups (CH1/CH2), each with dedicated driver (DHV_, DLV_, DTV_), comparator (CHV_, CLV_, CPHV_, CPLV_), clamp (CPHV_, CPLV_), load (LDH_, LDL_), and control (DATA_, NDATA_, RCV_, NRCV_, LDEN_, NLDEN_) terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ATE driver/comparator/load applications.

Compared with MAX9967AGCCQ, the MAX9967BGCCQ+B0U trades tighter offset matching for per-channel reference flexibility-essential for multi-site ATE scalability. Against MAX9967BLCCQ, it offers identical performance with verified traceability to the same wafer lot and qualification batch, ensuring consistent reliability in volume production.

Availability

MAX9967BGCCQ+B0U is available at Aetrix Electronics and suitable for memory ATE channel interfaces, PCI/VXI programmable instruments, and low-cost SoC ATE subsystems requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial-grade test equipment.

Supply support for MAX9967BGCCQ+B0U includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog and mixed-signal ICs for industrial, communications, and test equipment markets, with expertise in high-speed interface, power management, and sensor signal conditioning.

The MAX9967 product line delivers integrated pin electronics for automated test equipment, targeting memory, SoC, and digital instrument applications where channel density, timing accuracy, and thermal efficiency are critical design constraints.

FAQ

What is the primary function of the MAX9967BGCCQ+B0U in ATE systems?

The MAX9967BGCCQ+B0U serves as a dual-channel driver/comparator/load (DCL) IC that performs simultaneous high-speed drive, precise voltage comparison, and programmable current sourcing/sinking on a single DUT pin. In ATE systems, it enables at-speed parametric testing (IOH/IOL), contact continuity verification, and waveform acquisition-functions essential for memory and SoC test platforms. Its per-channel reference architecture makes the MAX9967BGCCQ+B0U especially valuable in multi-site parallel test configurations.

Does the MAX9967BGCCQ+B0U support LVDS and ECL logic families?

Yes, the MAX9967BGCCQ+B0U supports LVDS, ECL, LVPECL, and GTL logic families through its differential control inputs (DATA_, NDATA_, RCV_, NRCV_, LDEN_, NLDEN_), which feature optional internal 50Ω termination resistors and compatible voltage thresholds. These inputs accept differential swings from ±0.15V to ±1.0V and operate with termination voltages ranging from -2.1V to +3.5V, allowing direct interfacing with industry-standard ATE controller ASICs without level-shifting circuitry.

How does the low-leakage mode (60nA) benefit IDDQ testing?

The low-leakage mode of the MAX9967BGCCQ+B0U reduces DUT pin leakage current to just 60nA (at TJ < +90°C), minimizing parasitic loading during quiescent current (IDDQ) measurements. This enables accurate detection of nanoamp-level defect currents in CMOS devices-critical for identifying gate oxide shorts or latch-up conditions in high-reliability memory and SoC production testing. The mode is activated via the LLEAK control bit in the serial interface.

What thermal management features does the MAX9967BGCCQ+B0U include?

The MAX9967BGCCQ+B0U incorporates an 8mm × 8mm exposed die pad on the top surface of its 100-pin TQFP-EPR package, enabling direct thermal coupling to heatsinks or cold plates. Combined with its specified +70°C to +100°C internal die temperature range and thermal coefficient of +10mV/°C on the TEMP pin, this design supports sustained 2.3W total power dissipation in still-air environments. Thermal derating is linear at 167mW/°C above +70°C ambient.

Can the MAX9967BGCCQ+B0U be used for both drive and high-impedance compare modes in the same test sequence?

Yes, the MAX9967BGCCQ+B0U supports dynamic mode switching between drive, high-impedance (Hi-Z), and active-termination (3rd-level) states with sub-4ns propagation delays (t_PDDZ = 3.2ns, t_PDZD = 3.3ns). Its integrated clamps stabilize DUT waveforms during Hi-Z receive, while the dual comparators provide precise threshold-based pass/fail evaluation-all controllable via the 3-wire serial interface. This enables true bidirectional pin electronics behavior within a single IC per DUT pin.