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Analog Devices Inc./Maxim Integrated MAX9994ETP

Part No.:
MAX9994ETP
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
RF Mixers
Package:
20-WQFN Exposed Pad
Datasheet:
AetrixMAX9994ETP.pdf
Description:
IC MIXER DOWN CONV 20-TQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,649

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Product details

Overview

MAX9994ETP from Maxim Integrated is a SiGe high-linearity downconversion mixer designed for RF-to-IF signal translation in cellular base-station receivers. It delivers 8.3dB conversion gain, +26.2dBm input IP3, and 9.7dB noise figure across 1400MHz–2200MHz RF and 1400MHz–2000MHz LO bands, supporting both high-side and low-side injection in UMTS/WCDMA, LTE, and cdma2000 systems.

For engineers reviewing the MAX9994ETP datasheet, MAX9994ETP pinout, MAX9994ETP application, or MAX9994ETP equivalent, this page provides verified technical context, real-world RF performance trade-offs (e.g., IIP3 vs. temperature), package-level thermal design guidance, and validated alternative mixers for multi-band base-station layout reuse.

Technical Context

The MAX9994ETP integrates a double-balanced passive SiGe mixer core, on-chip RF/LO baluns enabling single-ended 50Ω interfaces, a dual-input SPDT LO switch with 45dB isolation and 50ns switching time, and an integrated IF amplifier delivering differential 40MHz–350MHz output. Its architecture supports flexible frequency planning via selectable LO paths and wideband operation without external matching.

It operates from a single +4.75V to +5.25V supply, draws ≤235mA, and requires only -3dBm to +3dBm LO drive due to its internal two-stage LO buffer. The device is specified over -40°C to +85°C and features an exposed-pad 20-pin thin QFN (5mm × 5mm) optimized for RF thermal and grounding integrity.

Key Specifications

Parameter Value and Actual Design Meaning
RF Frequency Range 1400MHz–2200MHz: Covers full UMTS Band I/II/IV/V, LTE Bands 1/2/3/4/25, TD-LTE B38/B39/B40/B41, DCS1800, PCS1900.
LO Frequency Range 1400MHz–2000MHz: Enables both high-side (fLO > fRF) and low-side (fLO < fRF) injection for flexible IF placement.
IF Frequency Range 40MHz–350MHz: Supports standard IF architectures including 200MHz, 170MHz, and 150MHz outputs with differential interface.
Conversion Gain 8.3dB typical: Reduces need for post-mixer amplification; gain variation ±0.75dB over temperature ensures stable cascade design.
IIP3 +26.2dBm typical at 1900MHz RF/1700MHz LO: Enables handling of strong adjacent-channel interferers in dense base-station environments.
Noise Figure 9.7dB SSB: Critical for receiver sensitivity in low-SNR uplink scenarios; degrades to 19dB under blocking (fblock = 2100MHz).
LO Drive Requirement -3dBm to +3dBm: Low drive simplifies LO source selection; eliminates need for external LO amplifiers in most designs.

Pinout & Package

Package: 20-pin thin QFN-EP (5mm × 5mm) with exposed pad - thermally and electrically connected to GND for optimal RF performance and heat dissipation.

Pin/Terminal Circuit Role Design Meaning
1, 6, 8, 14 VCC Four independent power-supply pins; each must be bypassed locally to GND for stable high-frequency operation.
2 RF Single-ended 50Ω RF input; internally DC-shorted via balun - requires external DC-blocking capacitor.
3 TAP Center tap of internal RF balun; must be bypassed to GND near IC for balun common-mode stability.
4, 5, 10, 12, 13, 17 GND Dedicated ground terminals; routed directly to exposed pad for minimal inductance and EMI control.
7 LOBIAS Bias node for internal LO buffer; connects to VCC via 549Ω ±1% resistor to set LO drive strength.
9 LOSEL Digital control input: logic-low selects LO1, logic-high selects LO2 - enables frequency-hopping without external switches.
11 LO1 First single-ended 50Ω LO input; matched internally - requires only 22pF DC-blocking capacitor.
15 LO2 Second single-ended 50Ω LO input; identical interface to LO1; isolated by ≥45dB when unselected.
16 LEXT Connection for external 10nH inductor to GND; improves RF-to-IF and LO-to-IF isolation at cost of ~100mA DC current.
18, 19 IF-, IF+ Differential open-collector IF outputs; require external RF chokes to VCC for bias and impedance transformation.
20 IFBIAS IF amplifier bias node; connects to GND via 806Ω ±1% resistor to set IF gain and linearity trade-off.
EP Exposed Pad Thermal and electrical ground plane connection; must be soldered with multiple vias to PCB ground layer.

Key Features

Feature Design Value
Integrated RF and LO baluns Eliminates discrete baluns and matching networks - reduces BOM count and layout area while maintaining 50Ω single-ended interface.
Dual-input LO SPDT switch Enables seamless frequency-hopping between two LO sources with 50ns settling and ≥45dB port-to-port isolation - critical for GSM/EDGE burst-mode operation.
Low LO drive requirement (-3dBm to +3dBm) Reduces LO source complexity and power consumption; avoids need for driver amplifiers in most base-station transceiver designs.
Differential IF output (40MHz–350MHz) Provides inherent 2RF–2LO spurious rejection improvement and supports high-dynamic-range ADC interfacing without additional balun loss.
External current-setting resistors (R1/R2) Allows trade-off between supply current (206–235mA) and performance (IIP3/NF) - supports power-constrained or thermal-limited deployments.

Applications

UMTS/WCDMA Base Stations LTE/TD-LTE Base Stations

Use Scenario: Downconverting 2110–2170MHz UMTS Band I uplink signals to 190MHz IF in macrocell receivers.

IC Role / Device Role / Timing Role: High-linearity active mixer performing RF-to-IF translation with integrated LO buffering and baluns.

Use Value: Achieves +26.2dBm IIP3 and 9.7dB NF to meet stringent ACLR and sensitivity specs without external gain stages.

Use Scenario: Supporting multi-band LTE eNodeB receivers covering Bands 1/3/7/38/40/41 with shared LO architecture.

IC Role / Device Role / Timing Role: Dual-LO-path mixer enabling rapid band switching via LOSEL control in TDD/FDD configurations.

Use Value: 50ns LO switching time and 45dB LO1/LO2 isolation prevent inter-band leakage during dynamic reconfiguration.

cdma2000/cdmaOne Base Stations Predistortion Receivers

Use Scenario: Processing 1930–1990MHz cdma2000 reverse-link signals in legacy 3G infrastructure upgrades.

IC Role / Device Role / Timing Role: Wideband mixer operating across 1400–2200MHz RF with stable gain and NF over temperature.

Use Value: ±0.75dB gain variation and ±0.5dB IIP3 variation from -40°C to +85°C ensure consistent linearization loop performance.

Use Scenario: Capturing feedback path signals in digital predistortion (DPD) loops for GaN PA linearization.

IC Role / Device Role / Timing Role: High-dynamic-range mixer capturing PA output spectrum with minimal added distortion.

Use Value: 67dBc 2RF–2LO rejection and differential IF output suppress spurious content that corrupts DPD coefficient calculation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar downconversion mixer applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX9996ETP+ Same pinout and functional compatibility; LO range extended to 1900–2400MHz - no change to PCB layout required. Targeted at higher-frequency bands (e.g., LTE Band 42/43, 5G n77/n78) where MAX9994ETP's 2000MHz LO limit is insufficient. Select MAX9996ETP+ when LO frequency exceeds 2000MHz; retains identical biasing, IF interface, and thermal design.
MAX9993ETP+ Functionally compatible but not pin-compatible; lacks integrated LO switch and baluns - requires external matching components. Suitable for cost-sensitive or space-tolerant designs where board area and component count are less constrained than in dense macro base stations. Choose MAX9993ETP+ only if layout flexibility exists and external baluns/switches are acceptable; otherwise MAX9994ETP offers superior integration.

Compared with MAX9996ETP+, the MAX9994ETP provides lower LO frequency coverage but identical integration and thermal performance; compared with MAX9993ETP+, it delivers full signal-chain integration (baluns, switch, buffer) at the cost of fixed pinout - making it optimal for high-density, multi-band base-station platforms requiring layout reuse.

Availability

MAX9994ETP is available at Aetrix Electronics and suitable for UMTS/LTE base stations, cdma2000 infrastructure, and predistortion receiver modules requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX9994ETP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, industrial, and automotive markets.

The MAX9994ETP belongs to Maxim's high-linearity SiGe mixer family, engineered specifically for cellular infrastructure receivers demanding wide bandwidth, exceptional IIP3, and integrated RF front-end functionality in compact QFN packages.

FAQ

What is the maximum RF input power the MAX9994ETP can handle without damage?

The MAX9994ETP has an absolute maximum RF input power rating of +12dBm. While its input 1dB compression point is +12.6dBm, continuous operation above +12dBm is not advised per datasheet Note 7. For reliable long-term operation in base-station receivers, keep peak RF input below +10dBm to maintain linearity margin and avoid accelerated aging.

Does the MAX9994ETP require external baluns for RF and LO inputs?

No - the MAX9994ETP integrates on-chip RF and LO baluns, enabling direct single-ended 50Ω connections to both RF and LO ports. Only external DC-blocking capacitors (e.g., 22pF for LO, unspecified value for RF) are required; no external transformers or matching networks are needed for nominal operation.

How does the LOSEL pin control mixer operation in the MAX9994ETP?

The LOSEL pin is a digital logic input that selects between LO1 and LO2 ports: driving LOSEL low selects LO1, while driving it high selects LO2. This enables fast (<50ns) switching between two independent LO sources - essential for frequency-hopping systems like GSM/EDGE or multi-band TDD base stations using the MAX9994ETP.

What is the purpose of the LEXT pin on the MAX9994ETP?

The LEXT pin connects to an external 10nH inductor (or 0Ω resistor) to ground. When used with the inductor, LEXT improves RF-to-IF and LO-to-IF isolation by providing a low-impedance AC path for common-mode currents. Approximately 100mA DC flows through this path, so a low-DCR wire-wound inductor is mandatory for stable operation.

Can the MAX9994ETP operate with a 3.3V supply instead of the specified 4.75V–5.25V range?

No - the MAX9994ETP is not characterized or guaranteed for operation below 4.75V. Its internal LO buffer, IF amplifier, and mixer core require the full 4.75V–5.25V supply range to meet datasheet specifications for conversion gain, IIP3, and noise figure. Using 3.3V will result in undefined performance and potential functional failure.

MAX9994ETP Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
MAX9994
Package/Case:
20-WQFN Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
RF Type:
Cellular, DCS, EDGE, PCS, UMTS, WLL
Frequency:
1.7GHz ~ 2.2GHz
Number of Mixers:
1
Gain:
8.3dB
Noise Figure:
9.7dB
Secondary Attributes:
Down Converter
Current - Supply:
235mA
Voltage - Supply:
4.75V ~ 5.25V
Mounting Type:
Surface Mount
Supplier Device Package:
20-TQFN (5x5)

MAX9994ETP FAQ

1.How can I place an order for MAX9994ETP through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX9994ETP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX9994ETP reliable?

The price and inventory of MAX9994ETP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX9994ETP is usually 5 days.

3.What payment methods are accepted for MAX9994ETP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX9994ETP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX9994ETP?

MAX9994ETP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX9994ETP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX9994ETP?

For technical support, including MAX9994ETP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX9994ETP requirements.

6.How does Aetrix verify that MAX9994ETP is sourced from the original manufacturer or authorized distributors?

All MAX9994ETP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX9994ETP meets industry standards.

7.What is the process for return or replacement of MAX9994ETP?

All MAX9994ETP units undergo pre-shipment inspection (PSI). If there is an issue with MAX9994ETP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX9994ETP part is unused and in its original packaging.

Return procedure for MAX9994ETP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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