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NXP Semiconductors MC08XS6421CEKR2
- Part No.:
- MC08XS6421CEKR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC08XS6421CEKR2.pdf
- Description:
- MC08XS6421CEK - External Automot
- Quantity:
- Payment:
- Shipping:
Inventory:10,000
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Product details
Overview
MC08XS6421CEKR2 from NXP Semiconductors is a quad-channel automotive high-side switch IC with dual 8.0 mΩ and dual 21 mΩ output channels, SPI 5.0 MHz interface, programmable current sensing, and integrated protection (overcurrent, overtemperature, reverse polarity, undervoltage). It serves as a smart power driver for LED and incandescent lighting control in body control modules.
For engineers reviewing the MC08XS6421CEKR2 datasheet, MC08XS6421CEKR2 pinout, MC08XS6421CEKR2 application, or MC08XS6421CEKR2 equivalent, key selection considerations include RDS(on) asymmetry per channel, daisy-chainable SPI diagnostics, limp-home mode activation via LIMP pin, and compatibility with 7–18 V automotive battery rails under extended 6.08–28 V operation.
Technical Context
The MC08XS6421CEKR2 integrates four self-protected high-side power switches-two rated at 8.0 mΩ (OUT3/OUT1) and two at 21 mΩ (OUT4/OUT2)-with independent PWM control, dynamic overcurrent threshold profiling, and analog current/voltage/temperature feedback via CSNS. Its SPI-controlled architecture supports 16-bit register access for fault reporting, open-load detection, and thermal prewarning.
It operates across -40 °C to +125 °C ambient, uses VBAT (7–18 V functional range) for main power and VCC (4.5–5.5 V) for logic/SPI, and features fail-safe behavior: loss of SPI communication triggers automatic transition to direct IN1–IN4 control while maintaining full protection and limp-home capability via the LIMP input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RDS(on) Channels | Dual 8.0 mΩ (OUT1, OUT3) + dual 21 mΩ (OUT2, OUT4); enables mixed-load driving (e.g., low-R LED strings + higher-R halogen bulbs) on single IC. |
| SPI Interface | 5.0 MHz daisy-chainable; allows multi-device control with single MCU SPI bus and synchronized diagnostics across ECU lighting nodes. |
| Operating Voltage | 7.08–18 V functional range; extended mode 6.08–28 V supports jump-start and load-dump transients without shutdown. |
| Protection Features | Reverse polarity (-16 V), thermal shutdown (+150 °C TJ), overcurrent (11 A for 8 mΩ, 5.5 A for 21 mΩ), open-load detection, and undervoltage lockout. |
| Current Sensing | Programmable ratio via SPI; CSNS pin outputs analog voltage proportional to selected channel current, battery voltage, or die temperature. |
| Quiescent Current | <5.0 µA sleep current at 12 V VBAT; meets automotive low-power requirements for always-on lighting subsystems. |
| Package | 32-pin SOICW-EP (exposed pad); thermally optimized for PCB heat dissipation in high-current automotive environments. |
Pinout & Package
MC08XS6421CEKR2 is housed in a 32-pin SOICW-EP package with exposed thermal pad for enhanced power dissipation. Pin functions are validated per NXP Document MC12XS6D4 Rev. 2.0 (2016).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT1, OUT2, OUT3, OUT4 | High-side power outputs | Four protected switching channels: OUT1/OUT3 = 8.0 mΩ; OUT2/OUT4 = 21 mΩ; each independently controllable via SPI or direct INx inputs. |
| IN1–IN4 | Direct control inputs | Wake-up and fail-mode channel control; active-high inputs enable manual override when SPI fails or LIMP is asserted. |
| CSB, SCLK, SI, SO | SPI interface signals | Chip-select, clock, serial-in, serial-out; support 5.0 MHz daisy-chained configuration for multi-device diagnostics and control. |
| CSNS, SYNCB | Analog feedback & sync | CSNS outputs programmable analog signal (current/battery/temp); SYNCB provides open-drain timing pulse for synchronized MCU ADC sampling. |
| LIMP | Fail-mode activation | Active-high digital input forces immediate transition to limp-home mode with direct INx control and safety-critical protection enabled. |
| VBAT | Main power supply | Exposed pad connection to battery rail (7–18 V); powers internal regulator, gate drivers, and protection circuitry; rated for -16 V reverse polarity. |
| VCC | Logic supply | 5.0 V ±10% supply for SPI I/Os, logic, and OUT6 driver; must be present for bidirectional SPI communication and register access. |
Key Features
| Feature | Design Value |
|---|---|
| Dual RDS(on) channel pairing | Enables simultaneous driving of diverse loads (e.g., 8 mΩ for high-current LED arrays, 21 mΩ for lower-power halogen lamps) without external current limiting. |
| Dynamic overcurrent threshold | Adjusts trip point during inrush to avoid false shutdown while maintaining precise short-circuit detection during steady-state operation. |
| Programmable current sensing ratio | Allows calibration of CSNS output scaling per channel, improving measurement accuracy for LED current regulation and diagnostics. |
| Limp-home mode | Guarantees fail-operational lighting control via IN1–IN4 pins when SPI communication fails, preserving basic functionality without MCU intervention. |
| Compatible PCB footprint & SPI driver | Shares mechanical layout and software API with other 12XS6 family members (e.g., MC08XS6421EK, MC08XS6421BEK), enabling hardware/software reuse across lighting variants. |
Applications
| Front Fog Lamp Control | Rear Combination Lamp |
|---|---|
|
Use Scenario: Driving dual-filament halogen bulbs (low-beam + fog) with independent dimming and diagnostics in compact front-end modules. IC Role / Device Role: High-side switch providing channel-isolated power delivery, real-time current monitoring, and open-load detection per filament. Use Value: Eliminates need for discrete sense resistors and protection ICs; reduces BOM count by integrating 4-channel control, diagnostics, and thermal management in one SOICW-EP package. |
Use Scenario: Controlling brake, tail, turn, and reverse LEDs in rear lamp assemblies with strict EMC and thermal constraints. IC Role / Device Role: Quad-channel driver managing mixed LED types (high-brightness brake + low-current position) with synchronized PWM dimming. Use Value: Dual RDS(on) values allow optimal efficiency per load type; CSNS+SYNCB enables precise current regulation and EMI-compliant edge shaping across all channels. |
| Central Body Controller Lighting Hub | HID Xenon Ballast Interface |
|
Use Scenario: Consolidating interior lighting (dome, map, courtesy) and exterior marker lights into a single ECU node with centralized diagnostics. IC Role / Device Role: Scalable high-side switch supporting up to four independent lighting zones with SPI-based fault logging and thermal prewarning. Use Value: Daisy-chainable SPI reduces MCU GPIO usage and wiring complexity; ultra-low sleep current (<5 µA) extends battery life during vehicle off-state. |
Use Scenario: Providing controlled power sequencing and protection for HID ballasts during ignition and fault conditions. IC Role / Device Role: Robust high-side switch delivering stable 12 V start-up power with active clamp energy handling (200 mJ @ 25 °C for 8 mΩ channels). Use Value: Integrated active clamping absorbs inductive kickback from ballast transformers, eliminating need for external TVS diodes and reducing board space. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC08XS6421EK | No R2 tape-and-reel suffix; identical electrical specs, pinout, and firmware; differs only in packaging format (bulk vs. reel). | Same automotive lighting use cases; suitable for prototype builds or low-volume production where tape-and-reel is not required. | Select MC08XS6421EK for evaluation or small-batch assembly; MC08XS6421CEKR2 is optimized for automated SMT line feeding. |
| MC08XS6421BEK | Includes "B" variant marking; confirmed identical RDS(on), SPI interface, protection features, and thermal specs per NXP orderable parts table. | Functionally interchangeable in all lighting applications; used in legacy designs where "B" revision was specified in BOMs. | MC08XS6421BEK offers drop-in replacement for existing designs; MC08XS6421CEKR2 provides latest traceability and packaging compliance (Pb-free EK suffix). |
Compared with MC08XS6421EK and MC08XS6421BEK, MC08XS6421CEKR2 delivers identical electrical performance and pin compatibility while adding tape-and-reel logistics support and updated Pb-free marking-making it the preferred choice for volume automotive production with automated placement.
Availability
MC08XS6421CEKR2 is available at Aetrix Electronics and suitable for automotive lighting control, body electronics ECUs, and LED headlamp modules requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for MC08XS6421CEKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in SMARTMOS power integration and automotive-grade reliability.
The MC08XS6421CEKR2 belongs to NXP's 12XS6 family of automotive high-side switches, designed specifically for centralized lighting control systems requiring diagnostic precision, fail-operational safety, and scalable multi-channel integration.
FAQ
What is the RDS(on) configuration of MC08XS6421CEKR2?
MC08XS6421CEKR2 features four high-side switch channels with asymmetric RDS(on): OUT1 and OUT3 are rated at 8.0 mΩ, while OUT2 and OUT4 are rated at 21 mΩ. This dual-resistance design allows optimized driving of different load types-such as high-current LED arrays on the 8 mΩ channels and lower-power halogen or position lamps on the 21 mΩ channels-within a single IC without external current limiting components.
Does MC08XS6421CEKR2 support daisy-chained SPI communication?
Yes, MC08XS6421CEKR2 supports daisy-chained SPI communication at up to 5.0 MHz. The SO pin connects directly to the SI pin of the next device in the chain, enabling multi-node lighting control with minimal MCU GPIO usage. All devices in the chain share the same CSB and SCLK lines, and register access is managed via sequential addressing through the SPI interface.
How does MC08XS6421CEKR2 handle fail-safe operation?
MC08XS6421CEKR2 enters fail-safe (limp-home) mode when either the LIMP pin is driven high or SPI communication is lost. In this mode, OUT1–OUT4 are directly controlled by IN1–IN4 inputs, OUT6 is disabled, and full protection-including overcurrent, overtemperature, and undervoltage-is maintained. The device remains operational and controllable without MCU intervention, ensuring critical lighting functions remain active.
What is the purpose of the CSNS and SYNCB pins on MC08XS6421CEKR2?
The CSNS pin on MC08XS6421CEKR2 outputs an analog voltage proportional to the selected channel's current, battery voltage, or die temperature-programmable via SPI. The SYNCB pin is an open-drain synchronization signal that times MCU ADC sampling to ensure accurate, jitter-free current measurements. Together, they enable precise closed-loop LED current regulation and real-time thermal monitoring without additional external circuitry.
Is MC08XS6421CEKR2 compatible with standard SOICW-EP footprints used for other 12XS6 family members?
Yes, MC08XS6421CEKR2 uses the same 32-pin SOICW-EP package with exposed thermal pad as other members of the 12XS6 family, including MC08XS6421EK and MC08XS6421BEK. Its PCB footprint, thermal pad layout, and pin assignments are fully compatible, enabling hardware reuse across lighting variants and simplifying ECU design scalability without layout changes.
MC08XS6421CEKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 6
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- SPI
- Voltage - Load:
- 7V ~ 18V
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Current - Output (Max):
- 5.5A, 11A
- Rds On (Typ):
- 8mOhm, 21mOhm
- Input Type:
- CMOS
- Features:
- -
- Fault Protection:
- Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC-EP
MC08XS6421CEKR2 FAQ
1.How can I place an order for MC08XS6421CEKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC08XS6421CEKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC08XS6421CEKR2 reliable?
The price and inventory of MC08XS6421CEKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC08XS6421CEKR2 is usually 5 days.
3.What payment methods are accepted for MC08XS6421CEKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC08XS6421CEKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC08XS6421CEKR2?
MC08XS6421CEKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC08XS6421CEKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC08XS6421CEKR2?
For technical support, including MC08XS6421CEKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC08XS6421CEKR2 requirements.
6.How does Aetrix verify that MC08XS6421CEKR2 is sourced from the original manufacturer or authorized distributors?
All MC08XS6421CEKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC08XS6421CEKR2 meets industry standards.
7.What is the process for return or replacement of MC08XS6421CEKR2?
All MC08XS6421CEKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC08XS6421CEKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC08XS6421CEKR2 part is unused and in its original packaging.
Return procedure for MC08XS6421CEKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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