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NXP Semiconductors MC10XS6200BEKR2
- Part No.:
- MC10XS6200BEKR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC10XS6200BEKR2.pdf
- Description:
- IC PWR SWITCH 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:975
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Product details
Overview
MC10XS6200BEKR2 from NXP Semiconductors is a triple-channel automotive high-side switch IC with 10 mΩ RDS(on) on OUT1 and OUT2, 25 mΩ on OUT3, SPI 5.0 MHz control, programmable current sensing, and Fail-safe operation for LED and incandescent lamp driving in ECU modules. It supports 7.0–18 V operation, <5.0 µA sleep current, and reverse polarity protection to –16 V.
For engineers reviewing the MC10XS6200BEKR2 datasheet, MC10XS6200BEKR2 pinout, MC10XS6200BEKR2 application, or MC10XS6200BEKR2 equivalent, this page delivers verified technical context, exact pin functions, real-world lighting control use cases, and two validated alternative parts - all grounded in NXP's MC12XS6D2 Rev. 4.0 documentation and official package data.
Technical Context
The MC10XS6200BEKR2 implements three self-protected high-side power channels with independent PWM control per channel, dynamic overcurrent threshold profiling, and analog current/voltage/temperature feedback via CSNS. Its SPI interface enables daisy-chain configuration, fault reporting (open load, short-to-battery, overtemperature), and Limp Home activation via dedicated INx and LIMP inputs.
It operates across –40 °C to +125 °C ambient, uses VBAT (7.0–18 V) as main supply with internal regulation, and draws only 1.2 µA typical sleep current at 12 V. The device enters Fail mode upon SPI loss or LIMP assertion, retaining direct IN1–IN4 control of outputs while disabling OUT6 and maintaining protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RDS(on) (OUT1/OUT2) | Max 17.5 mΩ at TJ = 150 °C - ensures low conduction loss for 10 mΩ-rated channels driving up to 9 A continuous loads |
| RDS(on) (OUT3) | Max 41.0 mΩ at TJ = 150 °C - optimized for higher-voltage, lower-current loads like halogen lamps |
| SPI Speed | 5.0 MHz - enables fast configuration and real-time fault reporting in daisy-chained lighting ECUs |
| Operating Voltage (VBAT) | 7.0–18 V full-spec range; extended 6.0–28 V - supports cold-crank and load-dump conditions without functional loss |
| Sleep Current | 1.2 µA typical at 12 V - meets automotive ultra-low-power requirements for always-on lighting control nodes |
| Reverse Polarity Protection | –16 V - prevents damage during battery misconnection in vehicle assembly or service |
| Thermal Shutdown | Active at TJ ≥ 150 °C with prewarning - enables graceful degradation before shutdown in enclosed headlamp housings |
Pinout & Package
MC10XS6200BEKR2 is housed in a 32-pin SOICW-EP (exposed pad) package, Pb-free, with thermal pad connected to VBAT for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 CP | Charge Pump Capacitor | External capacitor connection for gate drive voltage boosting - required for reliable high-side FET turn-on at low VBAT |
| 2 RSTB | SPI Reset Input | Active-low initialization signal; internal pull-down - used to reset fault registers and force low-power sleep state |
| 3 CSB | SPI Chip Select | Active-low SPI transaction enable; internal pull-up to VCC - enables daisy-chaining by asserting low to start communication |
| 4 SCLK | SPI Clock Input | Master-provided bit-shift clock; internal pull-down - synchronizes 16-bit register reads/writes at up to 5.0 MHz |
| 5 SI | SPI Serial Input | Data input sampled on SCLK rising edge; internal pull-down - receives configuration and control commands from MCU |
| 6 VCC | Logic Supply | 5.0 V ±10 % supply for SPI I/Os, CLK, and OUT6 driver - must be present for bidirectional SPI communication |
| 7 SO | SPI Serial Output | Data output changing on SCLK falling edge; high-Z when CSB high - feeds data to MCU or next daisy-chained device |
| 8 OUT6 | Smart Power Switch Control | Open-drain logic-level output; internal pull-down - drives external high-current switch (e.g., MC33880) in Normal mode only |
| 9–10 NC | No Connect | Not bonded; recommended tied to GND - avoids floating nodes and reduces EMI susceptibility |
| 11–12 OUT2 | High-Side Output Channel 2 | 10 mΩ RDS(on) protected power output - drives LED arrays or incandescent bulbs with integrated overcurrent and thermal protection |
| 13–14 OUT4 | No Connect | Not connected for MC10XS6200BEK variant - must be tied to GND per NXP recommendation |
| 15–18 NC | No Connect | Not bonded; recommended tied to GND - maintains signal integrity and thermal uniformity across exposed pad |
| 19–21 OUT3 | High-Side Output Channel 3 | 25 mΩ RDS(on) protected power output - suited for higher-resistance loads like halogen filaments or HID ballast preheating |
| 22–23 OUT1 | High-Side Output Channel 1 | 10 mΩ RDS(on) protected power output - primary channel for high-efficiency LED backlighting or DRL control |
| 25 CSNS | Analog Feedback Multiplexer | Ground-referenced output proportional to selected parameter (IOUT, VBAT, or die temp); SPI-programmable - enables precise closed-loop current monitoring |
| 26 SYNCB | A/D Synchronization | Open-drain sync pulse; requires external VCC pull-up - triggers MCU ADC sampling aligned with current-sense window for noise immunity |
| 27 IN1 | Direct Control Input 1 | Wake-up and Fail-mode channel 1 control; internal pull-down - retains lamp ON/OFF function during SPI failure or MCU reset |
| 28 IN2 | Direct Control Input 2 | Wake-up and Fail-mode channel 2 control; internal pull-down - provides redundant control path for safety-critical lighting zones |
| 29 IN3 | Direct Control Input 3 | Wake-up and Fail-mode channel 3 control; internal pull-down - enables manual override or emergency signaling independent of software |
| 30 IN4 | No Connect | Not connected for MC10XS6200BEK - must be tied to GND to prevent unintended wake-up |
| 31 LIMP | Limp Home Activation | Active-high Fail mode entry; internal pull-down - forces degraded but functional operation (e.g., reduced brightness) during system faults |
| 32 CLK | PWM Clock Feedback | I/O pin reporting sleep state; accepts external PWM reference clock divided by 28 - allows synchronized multi-channel dimming |
| 33 VBAT | Main Power Supply | Exposed pad connected to battery rail (7–18 V); supplies internal regulator and power stages - thermal path to PCB for >2 W dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Dual 10 mΩ + single 25 mΩ high-side outputs | Enables mixed-load driving (e.g., LED DRL + halogen fog lamp) with matched thermal design and PCB footprint across family |
| Programmable current sensing ratio | Allows precise 1:100 to 1:1000 scaling of sensed current to CSNS voltage - eliminates external op-amp for LED current calibration |
| Dynamically shaped output edges | Reduces dv/dt-induced EMI during switching - meets CISPR 25 Class 5 without added ferrites in headlamp PCB layout |
| Fail mode with direct INx control | Maintains lighting functionality after SPI loss or MCU crash - satisfies ISO 26262 ASIL-B diagnostic coverage for exterior lamps |
| Integrated charge pump (CP pin) | Generates boosted gate voltage internally - ensures full enhancement of high-side MOSFETs even at 7 V battery, eliminating external boost IC |
| CSNS/SYNCB synchronized analog feedback | Enables time-aligned sampling of current and voltage - critical for accurate PWM-based LED brightness regulation under varying battery conditions |
Applications
| Front Fog Lamp Control | Daytime Running Light (DRL) |
|---|---|
|
Use Scenario: Driving in low-visibility conditions requiring immediate, reliable illumination without full headlight draw. IC Role / Device Role / Timing Role: High-side switch controlling 35 W halogen fog lamp via OUT3 (25 mΩ), with IN3 enabling manual override during Fail mode. Use Value: 25 mΩ RDS(on) minimizes voltage drop at 3.5 A load, ensuring stable filament temperature and consistent light output across 9–16 V battery range. |
Use Scenario: Continuous low-power LED illumination during daylight hours for vehicle conspicuity. IC Role / Device Role / Timing Role: Dual-channel PWM controller (OUT1 & OUT2, 10 mΩ) driving parallel LED strings with synchronized dimming via CLK input. Use Value: 10 mΩ RDS(on) limits conduction loss to <40 mW per channel at 2 A, enabling thermally robust DRL operation in compact front-end modules. |
| Rear Combination Lamp | Interior Courtesy Lighting |
|
Use Scenario: Integrated tail, brake, and turn-signal functions in space-constrained rear lamp assemblies. IC Role / Device Role / Timing Role: Independent channel control: OUT1 for tail lamp (constant current), OUT2 for brake (high-brightness pulse), OUT3 for turn (PWM flash). Use Value: SPI-configurable open-load detection thresholds (30 mA ON / 0.875 A OFF) reliably distinguish LED failures from wiring faults in multi-function circuits. |
Use Scenario: Soft-start, dimmable interior map and dome lights activated by door switches or CAN commands. IC Role / Device Role / Timing Role: Single-channel (OUT1) high-side driver with programmable slew rate and thermal prewarning for plastic housing thermal management. Use Value: Dynamic overcurrent threshold profiling prevents nuisance shutdown during LED inrush while detecting true short-circuits within 100 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC10XS6200EK | Same RDS(on) specs and pinout, but EK suffix indicates standard SOICW-EP (non-BE variant); lacks BEK's enhanced ESD robustness on digital I/O pins | Used where cost sensitivity outweighs need for highest ESD immunity in service-accessible modules | Select MC10XS6200EK only if board-level ESD protection (e.g., TVS diodes) is already implemented on CSB/SCLK/SI lines |
| MC10XS6225BEK | Swaps 10 mΩ/10 mΩ/25 mΩ channel assignment: OUT1=25 mΩ, OUT2=10 mΩ, OUT3=10 mΩ - different RDS(on) mapping per pin | Preferred for designs needing higher current on OUT2 (e.g., dual DRL strings) while using OUT1 for lower-power status indicators | Requires PCB layout revision due to altered channel resistance allocation; not a drop-in replacement for MC10XS6200BEKR2 |
Compared with MC10XS6200EK, MC10XS6200BEKR2 offers improved ESD tolerance on control pins without sacrificing performance; versus MC10XS6225BEK, it provides optimal 10 mΩ drive on both OUT1 and OUT2 for symmetrical high-efficiency LED loads, simplifying thermal design and current calibration.
Availability
MC10XS6200BEKR2 is available at Aetrix Electronics and suitable for automotive lighting control, ECU power distribution, and LED driver modules requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified sourcing.
Supply support for MC10XS6200BEKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and scalable silicon solutions.
The MC10XS6200BEKR2 belongs to NXP's 12XS6 family of SMARTMOS high-side switches, designed specifically for centralized automotive lighting ECUs requiring functional safety, diagnostics, and mixed-load (LED/halogen) flexibility.
FAQ
What is the maximum continuous current rating for each output channel of the MC10XS6200BEKR2?
The MC10XS6200BEKR2 supports up to 9 A continuous current on its 10 mΩ channels (OUT1 and OUT2) and 4.5 A on its 25 mΩ channel (OUT3), provided junction temperature remains ≤150 °C. These ratings assume proper PCB copper area for thermal dissipation via the exposed VBAT pad and adherence to the specified RΘJA of 22 °C/W on a four-layer board.
Does the MC10XS6200BEKR2 support daisy-chained SPI communication?
Yes, the MC10XS6200BEKR2 supports daisy-chained SPI communication at up to 5.0 MHz. Its SO pin connects directly to the SI pin of the next device in the chain, enabling configuration and fault reporting across multiple MC10XS6200BEKR2 units using a single MCU SPI port and chip select line.
How does the Fail mode operate on the MC10XS6200BEKR2, and what triggers it?
The MC10XS6200BEKR2 enters Fail mode when either the LIMP pin is asserted high or SPI communication is lost (e.g., clock failure or timeout). In Fail mode, outputs remain controllable via direct inputs IN1–IN3, OUT6 is disabled, and built-in protections (overcurrent, overtemperature) stay active - ensuring safe, degraded operation of MC10XS6200BEKR2-controlled lamps.
What is the purpose of the CSNS and SYNCB pins on the MC10XS6200BEKR2?
The CSNS pin outputs an analog voltage proportional to selected parameters (output current, battery voltage, or die temperature), programmable via SPI. The SYNCB pin emits a synchronized open-drain pulse to trigger the MCU's ADC sampling precisely during the current-sense window - minimizing noise and enabling accurate real-time monitoring of MC10XS6200BEKR2 channel behavior.
Is the MC10XS6200BEKR2 compatible with 24 V commercial vehicle systems?
The MC10XS6200BEKR2 is rated for extended VBAT operation up to 28 V, covering 24 V nominal commercial vehicle systems during jump-start and load-dump transients. However, full specification compliance (e.g., RDS(on), timing, fault thresholds) applies only within the 7.0–18 V range; operation at 24 V requires validation of thermal performance and fault response under actual load conditions.
MC10XS6200BEKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 2
- Ratio - Input:Output:
- -
- Output Configuration:
- High Side
- Output Type:
- -
- Interface:
- SPI
- Voltage - Load:
- 7V ~ 18V
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Current - Output (Max):
- 9A
- Rds On (Typ):
- 10mOhm
- Input Type:
- -
- Features:
- Status Flag
- Fault Protection:
- Open Load Detect, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC-EP
MC10XS6200BEKR2 FAQ
1.How can I place an order for MC10XS6200BEKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC10XS6200BEKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC10XS6200BEKR2 reliable?
The price and inventory of MC10XS6200BEKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC10XS6200BEKR2 is usually 5 days.
3.What payment methods are accepted for MC10XS6200BEKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC10XS6200BEKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC10XS6200BEKR2?
MC10XS6200BEKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC10XS6200BEKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC10XS6200BEKR2?
For technical support, including MC10XS6200BEKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC10XS6200BEKR2 requirements.
6.How does Aetrix verify that MC10XS6200BEKR2 is sourced from the original manufacturer or authorized distributors?
All MC10XS6200BEKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC10XS6200BEKR2 meets industry standards.
7.What is the process for return or replacement of MC10XS6200BEKR2?
All MC10XS6200BEKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC10XS6200BEKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC10XS6200BEKR2 part is unused and in its original packaging.
Return procedure for MC10XS6200BEKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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