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NXP Semiconductors MC10XS6325BEKR2
- Part No.:
- MC10XS6325BEKR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC10XS6325BEKR2.pdf
- Description:
- IC PWR SWITCH 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
MC10XS6325BEKR2 from NXP Semiconductors is a triple-channel automotive high-side switch IC with 25 mΩ RDS(on) on OUT1 and OUT3, 10 mΩ on OUT2, SPI 5.0 MHz daisy-chain interface, programmable current sensing, and integrated diagnostics for LED and halogen lamp control in body electronics modules. It operates from 7.0 V to 18 V, supports Limp Home mode, and features dynamic overcurrent threshold profiling to tolerate inrush while maintaining precise load monitoring.
For engineers reviewing the MC10XS6325BEKR2 datasheet, MC10XS6325BEKR2 pinout, MC10XS6325BEKR2 application, or MC10XS6325BEKR2 equivalent, key selection criteria include channel-specific RDS(on) values (25/10/25 mΩ), SOICW-EP 32-pin thermal performance, Fail-mode direct input control (IN1–IN4), analog feedback via CSNS/SYNCB, and compatibility with NXP's 12XS6 family software and PCB footprint.
Technical Context
The MC10XS6325BEKR2 implements three self-protected high-side power channels with independent PWM control per channel, programmable open-load detection thresholds (30–350 mA ON-state, 0.7–1.1 A OFF-state), and active clamp circuitry rated for 40 mJ (25 mΩ channel, TJ = 25 °C). Its SPI interface supports 16-bit register access for overcurrent profiles, thermal prewarning, fault reporting, and synchronized analog feedback multiplexing across current, battery voltage, and die temperature.
It integrates dual supply domains: VBAT (7.0–18 V) powers internal logic, charge pump, and gate drivers; VCC (4.5–5.5 V) supplies SPI I/Os and OUT6 driver. Sleep current is ≤5.0 µA at 12 V VBAT, and reverse polarity protection withstands –16 V. The device enters Fail mode upon SPI loss or LIMP assertion, retaining operational control via IN1–IN4 inputs while disabling OUT6.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RDS(on) (OUT1) | Max 41.0 mΩ at TJ = 150 °C - ensures low conduction loss and thermal margin for 25 mΩ-rated channel |
| RDS(on) (OUT2) | Max 17.5 mΩ at TJ = 150 °C - enables higher current capability for 10 mΩ-rated channel |
| RDS(on) (OUT3) | Max 41.0 mΩ at TJ = 150 °C - matches OUT1 for symmetrical dual 25 mΩ output configuration |
| Operating Voltage | 7.0 V to 18 V functional range - supports standard 12 V automotive battery with jump-start tolerance up to 28 V |
| Sleep Current | < 5.0 µA at VBAT = 12 V - minimizes parasitic drain in always-on vehicle networks |
| SPI Speed | 5.0 MHz - enables fast configuration and real-time fault reporting in daisy-chained ECU architectures |
| Thermal Shutdown | Active at TJ ≥ 150 °C - protects die integrity during sustained overload or poor heatsinking |
Pinout & Package
MC10XS6325BEKR2 uses a 32-pin SOICW-EP (exposed pad) package optimized for automotive thermal dissipation (RΘJB = 8.0 °C/W). The exposed VBAT pad serves as primary power source and thermal path.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT1, OUT2, OUT3 | High-side power outputs | Three protected switching nodes: OUT1/OUT3 = 25 mΩ, OUT2 = 10 mΩ - enable mixed-load driving (e.g., LED + halogen) |
| IN1, IN2, IN3 | Direct control inputs | Wake-up and Fail-mode channel control - retain functionality when SPI fails or MCU resets |
| CSB, SCLK, SI, SO | SPI interface signals | Daisy-chainable 5.0 MHz serial bus - allows single MCU to manage multiple 12XS6 devices with minimal GPIO use |
| CSNS, SYNCB | Analog feedback interface | CSNS outputs voltage proportional to selected parameter (load current/battery/temp); SYNCB provides A/D synchronization pulse |
| LIMP, RSTB | Fault management inputs | LIMP forces Fail mode; RSTB initializes registers and enables sleep - both have internal pull-downs for fail-safe default state |
| VBAT, GND | Main power terminals | VBAT (exposed pad) supplies all internal circuitry; GND pins must be shorted on PCB for ESD integrity and analog accuracy |
Key Features
| Feature | Design Value |
|---|---|
| Dual RDS(on) channel set | Combines 25 mΩ (OUT1/OUT3) and 10 mΩ (OUT2) outputs - supports heterogeneous lighting loads without external MOSFETs |
| Dynamic overcurrent threshold | Adjusts trip point during inrush - prevents false shutdown on cold LED startup while maintaining accurate short-circuit detection |
| Programmable current sensing ratio | Enables precise load current monitoring across varying LED forward voltages - critical for closed-loop brightness control |
| Limp Home mode | Activates predefined safe output states (e.g., reduced-duty PWM) upon communication loss - maintains partial lighting function during ECU faults |
| Fail-mode direct input control | IN1–IN3 retain channel ON/OFF control when SPI is inactive - eliminates need for external watchdog or backup MCU logic |
Applications
| Automotive Front Lighting Control | Body Control Module (BCM) Interior Lighting |
|---|---|
Use Scenario: Driving adaptive front-lighting systems with mixed LED daytime running lights (DRL) and halogen position lamps. IC Role / Device Role / Timing Role: High-side switch managing three independent loads: DRL (OUT2, 10 mΩ), position lamp (OUT1, 25 mΩ), and turn signal (OUT3, 25 mΩ) with synchronized PWM dimming. Use Value: Single IC replaces discrete FETs and sense resistors; dynamic overcurrent profiling avoids nuisance trips during DRL cold start. | Use Scenario: Controlling map lights, dome lights, and courtesy lamps in premium vehicle cabins with fade-in/fade-out effects. IC Role / Device Role / Timing Role: PWM-controlled high-side driver delivering smooth 0–100% brightness scaling via SPI-programmed 8-bit duty cycles per channel. Use Value: Integrated current sensing enables real-time LED health monitoring; CSNS/SYNCB allows MCU to sample current synchronously with PWM edges. |
| Rear Combination Lamp Management | Truck & Bus Stop/Tail Lamp Control |
Use Scenario: Managing brake, tail, and reverse lamps in rear combination assemblies where thermal constraints limit PCB area. IC Role / Device Role / Timing Role: Triple high-side switch providing independent control of incandescent brake lamp (OUT1), LED tail lamp (OUT2), and halogen reverse lamp (OUT3). Use Value: Exposed-pad SOICW-EP package achieves RΘJB = 8.0 °C/W - sustains 4 A continuous current per 25 mΩ channel without external heatsink. | Use Scenario: Powering high-current stop/tail lamps in commercial vehicles subject to 24 V battery systems and load-dump transients. IC Role / Device Role / Timing Role: Robust high-side driver operating across 7.0–28 V extended range with –16 V reverse polarity protection and 40 V absolute max VBAT. Use Value: Active clamp circuitry absorbs 40 mJ (25 mΩ channel) during inductive load switching - eliminates need for external TVS diodes on lamp outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC10XS6325EK | No internal pull-down on IN1–IN4; different RDS(on) max (16.0/39.0 mΩ vs. 17.5/41.0 mΩ) | Same pinout and SPI interface but requires external pull-downs for Fail-mode reliability in noisy environments | Select MC10XS6325EK only if board-level pull-downs are already implemented and tighter RDS(on) spec is required |
| MC25XS6300BEK | Three 25 mΩ channels (vs. 25/10/25 mΩ); no OUT4/OUT6 support; identical SOICW-EP package | Designed for uniform high-current loads (e.g., three identical LED arrays); lacks mixed-RDS(on) flexibility | Choose MC25XS6300BEK when all three loads demand identical 25 mΩ performance and OUT6 control is unnecessary |
Compared with MC10XS6325EK and MC25XS6300BEK, MC10XS6325BEKR2 uniquely balances mixed-channel RDS(on) values, integrated Fail-mode pull-downs, and OUT6 smart-switch control - making it optimal for cost-sensitive, thermally constrained automotive lighting nodes requiring heterogeneous load management.
Availability
MC10XS6325BEKR2 is available at Aetrix Electronics and suitable for automotive body electronics, lighting control units, and electronic control modules requiring stable component supply, AEC-Q100 qualification, and long-term production continuity.
Supply support for MC10XS6325BEKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive power management and embedded processing.
The MC10XS6325BEKR2 belongs to NXP's 12XS6 family of SMARTMOS high-side switches, designed specifically for centralized automotive lighting control with enhanced diagnostics, robustness, and software/hardware scalability across ECU platforms.
FAQ
What is the RDS(on) specification for each output channel of the MC10XS6325BEKR2?
The MC10XS6325BEKR2 has three high-side outputs with differentiated RDS(on): OUT1 and OUT3 are rated at 25 mΩ (max 41.0 mΩ at TJ = 150 °C), while OUT2 is rated at 10 mΩ (max 17.5 mΩ at TJ = 150 °C). This configuration allows simultaneous driving of high-current halogen loads (via OUT2) and precision LED loads (via OUT1/OUT3) within a single IC. The MC10XS6325BEKR2 datasheet confirms these values in Table 2 under BEK version characteristics.
Does the MC10XS6325BEKR2 support daisy-chained SPI communication?
Yes, the MC10XS6325BEKR2 supports daisy-chained SPI communication at up to 5.0 MHz. Its SO pin connects directly to the SI pin of the next device in the chain, enabling a single MCU to configure and monitor multiple MC10XS6325BEKR2 units with minimal GPIO usage. This topology is explicitly documented in the "Features" section and Figure 1 of the MC12XS6D2 datasheet, and the MC10XS6325BEKR2 inherits full family compatibility.
How does the MC10XS6325BEKR2 handle communication loss with the host MCU?
Upon SPI communication loss, the MC10XS6325BEKR2 automatically enters Fail mode - remaining operational and protected while allowing continued control via IN1–IN4 direct inputs. In this state, OUT6 is disabled, but OUT1–OUT3 retain channel-level ON/OFF capability. This behavior is defined in Section 5.5.3 (Normal mode) and Section 5.4 (Functional description) of the MC12XS6D2 datasheet, ensuring functional safety without MCU intervention. The MC10XS6325BEKR2 implements this as a core architectural feature.
What thermal performance can be expected from the MC10XS6325BEKR2 in a typical automotive PCB layout?
The MC10XS6325BEKR2 uses a 32-pin SOICW-EP package with an exposed VBAT pad, achieving a junction-to-board thermal resistance (RΘJB) of 8.0 °C/W under JEDEC JESD51-8 conditions. With proper copper pour and thermal vias under the exposed pad, it sustains 4 A continuous current per 25 mΩ channel at TA = 85 °C. This value is specified in Table 5 of the MC12XS6D2 datasheet and applies directly to the MC10XS6325BEKR2 due to identical package construction.
Is the MC10XS6325BEKR2 qualified for automotive applications?
Yes, the MC10XS6325BEKR2 is AEC-Q100 qualified for automotive use, with operating temperature range of –40 °C to +125 °C (TA) and junction temperature limit of +150 °C. It includes automotive-grade protections: –16 V reverse polarity, 40 V absolute max VBAT, load-dump tolerance up to 28 V, and ESD ratings per HBM (±8 kV on VBAT/power pins). These qualifications are confirmed in Sections 4.2–4.4 of the MC12XS6D2 datasheet, which covers all 12XS6 family members including MC10XS6325BEKR2.
MC10XS6325BEKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 3
- Ratio - Input:Output:
- -
- Output Configuration:
- High Side
- Output Type:
- -
- Interface:
- SPI
- Voltage - Load:
- 7V ~ 18V
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Current - Output (Max):
- 4.5A, 9A
- Rds On (Typ):
- 10mOhm, 25mOhm
- Input Type:
- -
- Features:
- Status Flag
- Fault Protection:
- Open Load Detect, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC-EP
MC10XS6325BEKR2 FAQ
1.How can I place an order for MC10XS6325BEKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC10XS6325BEKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC10XS6325BEKR2 reliable?
The price and inventory of MC10XS6325BEKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC10XS6325BEKR2 is usually 5 days.
3.What payment methods are accepted for MC10XS6325BEKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC10XS6325BEKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC10XS6325BEKR2?
MC10XS6325BEKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC10XS6325BEKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC10XS6325BEKR2?
For technical support, including MC10XS6325BEKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC10XS6325BEKR2 requirements.
6.How does Aetrix verify that MC10XS6325BEKR2 is sourced from the original manufacturer or authorized distributors?
All MC10XS6325BEKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC10XS6325BEKR2 meets industry standards.
7.What is the process for return or replacement of MC10XS6325BEKR2?
All MC10XS6325BEKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC10XS6325BEKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC10XS6325BEKR2 part is unused and in its original packaging.
Return procedure for MC10XS6325BEKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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