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NXP Semiconductors MC17XS6500EEK
- Part No.:
- MC17XS6500EEK
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC17XS6500EEK.pdf
- Description:
- HIGH-SIDE SWITCH, 12V, PENTA 17M
- Quantity:
- Payment:
- Shipping:
Inventory:3,195
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Product details
Overview
MC17XS6500EEK from NXP Semiconductors is a penta-channel high-side smart power switch IC designed for robust load control, real-time diagnostics, and fail-safe operation in automotive and industrial 12 V/24 V systems. It delivers 17 mΩ RDS(on) per channel (OUT1–OUT5), supports 7.0–30 V VPWR operation with <5.0 μA sleep current, and integrates 16-bit 5.0 MHz SPI for programmable overcurrent profiling, PWM duty cycle control, and open-load detection.
For engineers reviewing the MC17XS6500EEK datasheet, MC17XS6500EEK pinout, MC17XS6500EEK application, or MC17XS6500EEK equivalent, this device serves as a precision-controlled, thermally protected, daisy-chainable high-side driver for LED lighting, halogen lamps, DC motors, and HID ballasts-requiring validated SPI register mapping, analog current sense synchronization, and reverse polarity (-16 V) resilience.
Technical Context
The MC17XS6500EEK implements SMARTMOS technology with five self-protected high-side power channels, each featuring active clamp circuitry for inductive load switching and configurable dynamic overcurrent profiles. Its dual-supply architecture separates VPWR (7–30 V, powers gate drivers and analog blocks) from VCC (4.5–5.5 V, powers SPI I/O and OUT6 logic).
It operates across four modes-Sleep, Normal, Fail, and Power Off-with Fail mode enabling direct IN1–IN4 control of OUT1–OUT4 while disabling OUT5/OUT6. Diagnostics include short-to-VPWR, short-to-ground, open-load, overtemperature, and undervoltage reporting via SPI-readable status registers and analog CSNS feedback.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RDS(on) (per channel) | 17 mΩ - Enables ≤5.5 A continuous output current with low conduction loss and thermal rise under 12 V/24 V supply. |
| VPWR operating range | 7.0 V to 30 V - Fully specified operation across automotive battery ranges including cold-crank and load-dump transients. |
| Sleep current | <5.0 μA at VPWR = 24 V - Meets ultra-low-power requirements for always-on vehicle modules without battery drain. |
| SPI clock frequency | Up to 5.0 MHz - Supports fast configuration updates and real-time fault reporting in daisy-chained multi-device systems. |
| Operating temperature | –40 °C to +125 °C - Qualified for under-hood and industrial control environments with junction limit up to +150 °C. |
| Reverse polarity protection | –16 V - Prevents damage during battery misconnection; activates internal clamping and forces safe output state. |
| Current sense resolution | SPI-programmable multiplexer on CSNS - Allows MCU to monitor individual channel current, supply voltage, or die temperature using one analog input. |
Pinout & Package
MC17XS6500EEK uses a 32-pin SOIC-EP (exposed pad) package optimized for thermal dissipation and PCB layout compatibility within the MC32XSG family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VPWR | Power supply input | Main high-voltage rail (7–30 V); powers internal regulators, gate drivers, and analog blocks; exposed pad must be soldered for thermal and electrical integrity. |
| VCC | Logic supply | 5 V ±10 % supply for SPI interface, OUT6 driver, and digital I/O; required for bidirectional communication and fault register reads. |
| OUT1–OUT5 | High-side power outputs | Five independent, protected p-channel switches with 17 mΩ RDS(on); each includes overload, overtemperature, and open-load diagnostics. |
| CSNS / CSNS SYNCB | Analog feedback pair | CSNS outputs voltage proportional to selected parameter (current/voltage/temp); SYNCB provides open-drain sync pulse for MCU ADC sampling alignment. |
| IN1–IN4 | Direct control inputs | Wake-up and Fail-mode channel control pins; internally pulled down; enable hardware-fallback operation when SPI fails or LIMP is asserted. |
| RSTB / CSB / SCLK / SI / SO | SPI interface signals | Standard 4-wire SPI with chip select, reset, and daisy-chain capability; all logic-level compatible with 5 V MCUs and include internal pull resistors. |
Key Features
| Feature | Design Value |
|---|---|
| Penta high-side switch integration | Five independent 17 mΩ channels reduce board space vs. discrete solutions while enabling per-channel diagnostics and PWM control. |
| SPI-configurable overcurrent profiles | Dynamic OCLO window timing and threshold adjustment per channel allows precise matching to diverse load types (LED, motor, lamp). |
| Fail-safe direct-input mode | IN1–IN4 retain control of OUT1–OUT4 during SPI failure or LIMP assertion-ensuring functional safety without MCU intervention. |
| Programmable current sense ratio | CSNS output scaling factor selectable via SPI enables accurate low-current (<100 mA) and high-current (>5 A) monitoring with same ADC reference. |
| Reverse polarity & ground disconnect | –16 V tolerance and automatic output disable during ground loss prevent latch-up, ESD damage, and uncontrolled load behavior. |
Applications
| Automotive Exterior Lighting | Industrial Motor Control |
|---|---|
Use Scenario: Driving sequential LED headlamp arrays with adaptive beam shaping and thermal derating. IC Role / Device Role / Timing Role: High-side switch providing PWM-modulated current control, real-time channel temperature feedback, and open-circuit detection per lamp segment. Use Value: Eliminates need for external current-sense shunts and discrete protection ICs while supporting ASIL-B–compatible diagnostics via SPI-reported fault codes. | Use Scenario: Controlling 24 V DC brush motors in automated conveyor systems with stall detection and soft-start ramping. IC Role / Device Role / Timing Role: Load driver with programmable overcurrent trip delay and autorestart on overload, synchronized to PLC scan cycle via CSNS SYNCB. Use Value: Reduces system BOM by integrating motor phase control, current limiting, and thermal shutdown into single IC with no external components required. |
| Halogen Lamp Management | HID Xenon Ballast Interface |
Use Scenario: Managing inrush-limited halogen bulb arrays in commercial vehicle interior lighting with dimming and burn-out detection. IC Role / Device Role / Timing Role: High-side switch delivering controlled turn-on slew rate, inrush current limiting, and filament open-load verification via analog CSNS. Use Value: Extends bulb life by eliminating cold-filament surge and enables predictive maintenance through gradual resistance drift tracking. | Use Scenario: Powering and monitoring HID xenon ballasts in architectural lighting systems requiring ignition pulse sequencing and arc stability supervision. IC Role / Device Role / Timing Role: High-current switch with fast active-clamp response to inductive kickback during ballast ignition and stable current regulation during arc phase. Use Value: Prevents ballast damage from repeated ignition failures by detecting short-circuit-to-ground faults within 2 μs and latching OFF affected channel. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC17XSG500DEK | Identical 32-pin SOIC-EP package, 17 mΩ RDS(on), –40 °C to +125 °C rating, and SPI register map; differs only in tape-and-reel packaging suffix (DEK vs EEK). | No functional difference; both support same diagnostic features, fail-safe modes, and current sense programming. | Select MC17XSG500DEK for volume tape-and-reel procurement; MC17XS6500EEK is functionally identical and pin-compatible. |
| MC07XSG517EK | 54-pin SOIC-EP package with mixed RDS(on): 17 mΩ (OUT1/OUT2), 7.0 mΩ (OUT3–OUT5); higher current capability (11 A) on three channels but larger footprint and different pinout. | Better suited for hybrid loads requiring both high-current (motors) and precision-current (LEDs) channels on same IC. | Choose MC07XSG517EK only if mixed RDS(on) and higher 11 A rating on OUT3–OUT5 are required; not drop-in compatible due to pin count and layout mismatch. |
Compared with MC17XSG500DEK, MC17XS6500EEK offers identical electrical performance and software compatibility but may differ in reel packaging and traceability labeling; versus MC07XSG517EK, it trades higher per-channel current capacity and mixed RDS(on) for smaller 32-pin footprint and uniform 17 mΩ channel matching-making it optimal for space-constrained, homogeneous-load applications.
Availability
MC17XS6500EEK is available at Aetrix Electronics and suitable for automotive exterior lighting, industrial motor control, and HID xenon ballast applications requiring stable component supply, long-term lifecycle support, and AEC-Q100–aligned reliability.
Supply support for MC17XS6500EEK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in power management and smart actuation ICs.
The MC32XSG product line-including MC17XS6500EEK-is engineered for intelligent, protected high-side switching in harsh 12 V/24 V environments, emphasizing diagnostic richness, fail-operational safety, and seamless SPI integration with host microcontrollers.
FAQ
What is the maximum continuous output current supported by MC17XS6500EEK per channel?
The MC17XS6500EEK supports up to 5.5 A continuous output current per channel (OUT1–OUT5) when operated within its thermal limits-calculated using RΘJA = 17.4 °C/W and maximum junction temperature of +125 °C. This assumes proper PCB copper pour on the exposed pad and ambient temperature ≤85 °C. The 17 mΩ RDS(on) ensures minimal conduction loss at rated current, and the integrated overtemperature protection latches off any channel exceeding safe thermal thresholds.
Does MC17XS6500EEK require both VPWR and VCC supplies to operate fully?
Yes, MC17XS6500EEK requires both VPWR (7–30 V) and VCC (4.5–5.5 V) to achieve full functionality. VPWR powers the high-side drivers, charge pump, and analog blocks, while VCC supplies the SPI interface, OUT6 logic, and digital I/O buffers. Without VCC, SPI communication fails, SO remains high-impedance, and fault registers cannot be read-though the device remains in Fail mode with IN1–IN4 controllable outputs and basic protection active.
How does the CSNS pin function in MC17XS6500EEK, and what parameters can it report?
The CSNS pin on MC17XS6500EEK outputs an analog voltage proportional to one of three selectable parameters-output current (for any enabled OUT1–OUT5), VPWR supply voltage, or die temperature-based on SPI-programmed multiplexer settings. Its scaling factor (e.g., 10 mV/A or 100 mV/V) is configurable per channel, enabling precise MCU ADC measurement without external signal conditioning. The companion CSNS SYNCB pin provides a synchronous open-drain pulse to align ADC sampling with current measurement windows.
Can MC17XS6500EEK drive an external smart power switch, and how is that implemented?
Yes, MC17XS6500EEK includes dedicated OUT6-a logic-level high-side output pin designed to drive the gate or enable input of an external smart power switch. In Normal mode, OUT6 is controlled via SPI register settings; in Fail mode, it is forced OFF and non-controllable. This allows hierarchical power architecture where MC17XS6500EEK manages diagnostics and sequencing while delegating high-current switching to a separate device-enhancing system scalability and thermal partitioning.
What protection features are active during Fail mode operation of MC17XS6500EEK?
During Fail mode-triggered by LIMP pin assertion or SPI communication loss-MC17XS6500EEK maintains full protection on OUT1–OUT4, including overload (short-to-VPWR/ground), overtemperature, and undervoltage detection. Outputs are controlled directly by IN1–IN4, and autorestart behavior activates on mild overloads. Severe faults like OCHI1 or severe short-circuit cause immediate latching until next wake-up event. OUT5 and OUT6 remain OFF and unprotected in Fail mode, and analog feedback (CSNS) is disabled.
MC17XS6500EEK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Tube
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 6
- Ratio - Input:Output:
- 2:3
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- SPI
- Voltage - Load:
- 7V ~ 18V
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Current - Output (Max):
- 5.5A
- Rds On (Typ):
- 17mOhm
- Input Type:
- -
- Features:
- Internal PWM
- Fault Protection:
- Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-HSOP
MC17XS6500EEK FAQ
1.How can I place an order for MC17XS6500EEK through Aetrix?
Please submit a Request for Quotation (RFQ) for MC17XS6500EEK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC17XS6500EEK reliable?
The price and inventory of MC17XS6500EEK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC17XS6500EEK is usually 5 days.
3.What payment methods are accepted for MC17XS6500EEK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC17XS6500EEK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC17XS6500EEK?
MC17XS6500EEK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC17XS6500EEK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC17XS6500EEK?
For technical support, including MC17XS6500EEK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC17XS6500EEK requirements.
6.How does Aetrix verify that MC17XS6500EEK is sourced from the original manufacturer or authorized distributors?
All MC17XS6500EEK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC17XS6500EEK meets industry standards.
7.What is the process for return or replacement of MC17XS6500EEK?
All MC17XS6500EEK units undergo pre-shipment inspection (PSI). If there is an issue with MC17XS6500EEK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC17XS6500EEK part is unused and in its original packaging.
Return procedure for MC17XS6500EEK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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