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NXP Semiconductors MC17XSG500DEK
- Part No.:
- MC17XSG500DEK
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC17XSG500DEK.pdf
- Description:
- HIGH-SIDE SWITCH, 32V, PENTA 17M
- Quantity:
- Payment:
- Shipping:
Inventory:4,985
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Product details
Overview
MC17XSG500DEK from NXP Semiconductors is a penta-channel high-side smart power switch designed for robust load control, protection, and diagnostics in automotive and industrial 12 V/24 V systems. It features five 17 mΩ RDS(on) channels, 5.0 MHz SPI interface, fail-safe direct-input control (IN1–IN4), and –16 V reverse polarity protection. It drives LED lighting, halogen lamps, and DC motors while delivering programmable current sensing and thermal shutdown.
For engineers reviewing the MC17XSG500DEK datasheet, MC17XSG500DEK pinout, MC17XSG500DEK application, or MC17XSG500DEK equivalent, key selection considerations include its SOIC32-EP package with exposed pad, 7.0–30 V VPWR operating range, ultra-low 25 μA sleep current at 25 °C, and SPI-configurable PWM duty cycle per channel.
Technical Context
The MC17XSG500DEK implements SMARTMOS technology with integrated charge pump, active clamp circuitry for inductive load switching, and dual-supply architecture: VPWR (7–30 V) powers analog/switching blocks, while VCC (4.5–5.5 V) supplies SPI I/O and OUT6 logic. Its 16-bit SPI supports daisy-chaining and real-time fault reporting including open-load, overcurrent, overtemperature, and undervoltage detection.
It operates across four modes-Sleep, Normal, Fail, and Power Off-with automatic transition logic: wake-up via IN1–IN4 or RSTB initiates Normal mode if no fail condition exists; LIMP assertion or SPI watchdog timeout forces Fail mode, disabling OUT5/OUT6 and enabling direct control of OUT1–OUT4. Analog feedback on CSNS is SPI-multiplexed among current sense, supply voltage, and die temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Channels | 5 independent high-side switches (OUT1–OUT5), each with 17 mΩ RDS(on) at TJ = 25 °C - enables parallel driving of medium-power loads without external heatsinking |
| Supply Voltage Range | VPWR: 7.0 V to 30 V functional; extended operation down to 6.0 V - supports cold-crank and battery-dip conditions in automotive applications |
| Sleep Current | 25 μA at VPWR = 24 V, TA = 25 °C - meets stringent automotive low-power requirements for always-on modules |
| SPI Interface | 16-bit full-duplex, 5.0 MHz max clock - allows fast configuration and diagnostic polling in real-time control loops |
| Protection Features | Reverse polarity (–16 V), thermal shutdown, active clamp energy (50 mJ), overload, undervoltage - eliminates need for external protection components |
| Operating Temperature | –40 °C to +125 °C ambient - qualified for under-hood and industrial control cabinet deployment |
| Package Thermal Resistance | RΘJA = 17.4 °C/W (4-layer board) - enables >5 A continuous output current with standard PCB copper area |
Pinout & Package
MC17XSG500DEK uses a 32-pin SOIC package with exposed thermal pad (SOIC32-EP), optimized for thermal dissipation and board-level EMI suppression. The exposed pad must be soldered to a large copper pour connected to GND for optimal thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CP | Charge pump capacitor connection | External capacitor stabilizes internal high-voltage gate drive - required for reliable MOSFET turn-on across full VPWR range |
| RSTB | Active-low reset and sleep enable | Pull-down default; asserting low initializes registers and forces Sleep mode - critical for safe power-up sequencing |
| CSB | SPI chip select | Active-low signal enabling SPI transaction; internal pull-up ensures SPI remains inactive during MCU boot |
| SCLK, SI, SO | SPI clock/data I/O | 5.0 MHz CMOS-compatible interface; SO is tri-state when CSB high - supports daisy-chain topology without level shifters |
| OUT1–OUT5 | Protected high-side power outputs | Each delivers up to 5.5 A continuous (17 mΩ); integrated clamping protects against inductive kickback |
| CSNS / CSNS SYNCB | Analog current/voltage/temperature feedback | CSNS provides ground-referenced analog output; SYNCB is open-drain sync pulse for MCU ADC sampling timing |
| IN1–IN4 | Fail-mode direct control inputs | Pull-down default; high-assertion directly enables corresponding OUT1–OUT4 in Fail mode - enables hardware-fallback control |
| LIMP | Fail-mode activation input | High-assertion forces immediate entry into Fail mode, overriding SPI control - used for system-level safety interlock |
| VPWR / VCC / GND | Power rails | VPWR powers switching core; VCC powers SPI logic; separate GND pins (pins 9 & 24) must be shorted on PCB for ESD integrity |
Key Features
| Feature | Design Value |
|---|---|
| Penta high-side switch integration | Five matched 17 mΩ channels in single SOIC32-EP package - reduces BOM count and PCB area vs. discrete solutions |
| SPI-programmable current sense ratio | Configurable gain and multiplexing on CSNS pin - enables precise low-current (<100 mA) and high-current (>5 A) monitoring with one ADC channel |
| Dual-supply fault isolation | VCC loss disables SPI but preserves VPWR-powered protections - maintains load safety even during MCU power failure |
| Fail-safe direct-input control | IN1–IN4 retain functionality in Fail mode with no MCU involvement - satisfies ASIL-B functional safety requirements for lighting control |
| EMC-optimized output slew rate | Programmable dynamic overcurrent profiles and PWM frequency prescaling - reduces radiated emissions in sensitive vehicle domains |
Applications
| Automotive Exterior Lighting | Industrial Motor Control |
|---|---|
Use Scenario: Controlling LED headlamps, DRLs, and turn signals in 12 V vehicle architectures with CAN-based body controllers. IC Role / Device Role / Timing Role: High-side driver and diagnostic monitor for five independent lighting zones, providing open-load detection and thermal derating. Use Value: Eliminates need for five discrete high-side drivers and external current-sense resistors, reducing system cost by 35% and improving fault coverage per ISO 26262. | Use Scenario: Driving small DC motors in factory automation panels where space, reliability, and diagnostic traceability are critical. IC Role / Device Role / Timing Role: Smart power switch with embedded overcurrent profiling and synchronized PWM - replaces relay + driver + fuse stack. Use Value: Enables predictive maintenance via SPI-reported current trends and prevents nuisance trips during motor startup inductance surges. |
| Commercial Lighting Systems | HID Xenon Ballast Interfaces |
Use Scenario: Managing multi-zone low-voltage architectural lighting in office buildings using DALI or 0–10 V control interfaces. IC Role / Device Role / Timing Role: Load interface between microcontroller and 24 V LED strings, with programmable dimming curves and brownout recovery. Use Value: Supports smooth 0–100% dimming with <1% current ripple via 8-bit PWM resolution and eliminates flicker caused by discrete MOSFET gate charge variation. | Use Scenario: Providing controlled power sequencing and protection for HID xenon lamp ballasts in automotive projector headlamps. IC Role / Device Role / Timing Role: High-current inrush limiter and arc-fault protector during lamp ignition and steady-state operation. Use Value: Withstands 100 mJ clamp energy per channel and detects arc faults via fast overcurrent windowing - extends ballast lifetime by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC17XSG500EK | Identical electrical specs and pinout; differs only in tape-and-reel packaging (no R2 suffix) - same SOIC32-EP footprint and thermal performance | No functional difference; intended for manual or semi-automated assembly where reel packaging is not required | Select MC17XSG500EK for prototyping or low-volume production; MC17XSG500DEK for automated SMT lines requiring tape-and-reel delivery |
| MC07XSG517DEK | 54-pin SOIC-EP package with mixed RDS(on): 17 mΩ (OUT1/OUT2), 7.0 mΩ (OUT3–OUT5); higher current capability on three channels | Better suited for asymmetric loads (e.g., two LEDs + three motors); requires different PCB layout and thermal design due to larger package | Choose MC07XSG517DEK only when ≥11 A peak current is needed on OUT3–OUT5; otherwise MC17XSG500DEK offers superior cost and layout efficiency |
Compared with MC17XSG500EK, MC17XSG500DEK offers identical performance with optimized packaging for high-volume SMT; versus MC07XSG517DEK, it trades higher per-channel current for smaller footprint and lower system-level thermal complexity - making it ideal for space-constrained, symmetric-load applications like multi-LED arrays.
Availability
MC17XSG500DEK is available at Aetrix Electronics and suitable for automotive exterior lighting, industrial motor control, and commercial low-voltage lighting systems requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for MC17XSG500DEK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in power management and functional safety.
The MC32XSG product line was engineered to replace electromechanical relays and discrete high-side drivers in 12 V/24 V systems, delivering integrated protection, diagnostics, and SPI configurability for ASIL-B compliant designs.
FAQ
What is the maximum continuous output current per channel for MC17XSG500DEK?
The MC17XSG500DEK supports up to 5.5 A continuous output current per channel (OUT1–OUT5) when operated within its thermal limits - verified at VPWR = 24 V, TA = 25 °C, and RΘJA = 17.4 °C/W on a 4-layer PCB. Derating is required above 85 °C ambient; full 5.5 A is sustained only with adequate copper pour on the exposed pad.
Does MC17XSG500DEK support daisy-chained SPI communication?
Yes, MC17XSG500DEK supports daisy-chained SPI communication using its SO pin connected to the SI pin of the next device. The 16-bit full-duplex interface operates up to 5.0 MHz and maintains register integrity across chains - enabling centralized control of multiple MC17XSG500DEK devices with a single MCU SPI port.
How does the fail-safe mode operate on MC17XSG500DEK?
In Fail mode, MC17XSG500DEK disables OUT5 and OUT6 while allowing direct control of OUT1–OUT4 via IN1–IN4 inputs. This hardware fallback operates independently of SPI, retains all protections (overcurrent, thermal, reverse polarity), and activates automatically upon LIMP assertion or SPI watchdog timeout - ensuring deterministic behavior during MCU or communication failure.
What is the purpose of the CSNS and CSNS SYNCB pins on MC17XSG500DEK?
The CSNS pin outputs an analog voltage proportional to selected parameters (OUT1–OUT5 current, VPWR, or die temperature), programmable via SPI. CSNS SYNCB is an open-drain synchronization pulse that aligns with CSNS transitions - enabling precise, jitter-free sampling by an external MCU ADC to avoid measurement aliasing during PWM operation.
Is MC17XSG500DEK compatible with 5 V microcontrollers?
Yes, MC17XSG500DEK is fully compatible with 5 V microcontrollers: its SPI interface uses 5.0 V CMOS logic levels (VIH = 3.5 V min, VIL = 0.85 V max), and VCC must be supplied at 4.5–5.5 V. The SO output drives to VCC – 0.4 V high and 0.4 V low - ensuring clean signal integrity without level-shifting circuitry.
MC17XSG500DEK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Tube
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 6
- Ratio - Input:Output:
- 2:3
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- SPI
- Voltage - Load:
- 7V ~ 30V
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Current - Output (Max):
- -
- Rds On (Typ):
- 17mOhm
- Input Type:
- Non-Inverting
- Features:
- Internal PWM, Slew Rate Controlled, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-HSOP
MC17XSG500DEK FAQ
1.How can I place an order for MC17XSG500DEK through Aetrix?
Please submit a Request for Quotation (RFQ) for MC17XSG500DEK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC17XSG500DEK reliable?
The price and inventory of MC17XSG500DEK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC17XSG500DEK is usually 5 days.
3.What payment methods are accepted for MC17XSG500DEK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC17XSG500DEK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC17XSG500DEK?
MC17XSG500DEK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC17XSG500DEK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC17XSG500DEK?
For technical support, including MC17XSG500DEK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC17XSG500DEK requirements.
6.How does Aetrix verify that MC17XSG500DEK is sourced from the original manufacturer or authorized distributors?
All MC17XSG500DEK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC17XSG500DEK meets industry standards.
7.What is the process for return or replacement of MC17XSG500DEK?
All MC17XSG500DEK units undergo pre-shipment inspection (PSI). If there is an issue with MC17XSG500DEK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC17XSG500DEK part is unused and in its original packaging.
Return procedure for MC17XSG500DEK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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