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NXP Semiconductors MC17XSG500DEKR2
- Part No.:
- MC17XSG500DEKR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC17XSG500DEKR2.pdf
- Description:
- HIGH-SIDE SWITCH, 32V, PENTA 17M
- Quantity:
- Payment:
- Shipping:
Inventory:1,120
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Product details
Overview
MC17XSG500DEKR2 from NXP Semiconductors is a penta-channel high-side smart power switch IC designed for robust load control, real-time diagnostics, and fail-safe operation in automotive and industrial 12 V/24 V systems. It delivers five 17 mΩ protected high-side outputs (OUT1–OUT5), 16-bit 5.0 MHz SPI interface with daisy-chain capability, programmable current sensing, and operates across 7.0–30 V VPWR with sleep current < 35 μA at 125 °C - used in LED lighting control and DC motor drive circuits.
For engineers reviewing the MC17XSG500DEKR2 datasheet, MC17XSG500DEKR2 pinout, MC17XSG500DEKR2 application, or MC17XSG500DEKR2 equivalent, key selection considerations include its SOIC32-EP package with exposed pad, -40 °C to +125 °C operating range, integrated overcurrent/overtemperature/undervoltage protection per channel, Fail-safe mode with direct IN1–IN4 control, and analog feedback via CSNS/CSNS SYNCB pins.
Technical Context
The MC17XSG500DEKR2 implements SMARTMOS technology with five self-protected high-side power channels, each featuring active clamp circuitry for inductive load switching and configurable overcurrent profiles. Its embedded 8-bit PWM module supports per-channel duty cycle and frequency prescaling up to 400 Hz.
Control is dual-mode: Normal mode uses 16-bit SPI (5.0 MHz max) for full configuration and diagnostics including open-load, short-to-VCC/ground, overtemperature, and clock-fail detection; Fail mode activates on LIMP assertion or SPI failure, enabling direct IN1–IN4 input control of OUT1–OUT4 while disabling OUT5/OUT6 and retaining overload/overtemperature protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output count | 5 independent high-side switches (OUT1–OUT5) with individual protection and diagnosis |
| RDS(on) per channel | 17 mΩ - enables ≤5.5 A continuous output current with low conduction loss and thermal rise |
| VPWR operating range | 7.0 V to 30 V - fully specified for 12 V/24 V automotive and industrial battery systems |
| SPI interface | 16-bit, 5.0 MHz full-duplex with daisy-chain support - allows compact multi-device control without additional MCU GPIOs |
| Operating temperature | -40 °C to +125 °C - qualified for under-hood and industrial control environments |
| Sleep current | <35 μA at 125 °C - meets ultra-low-power requirements for always-on vehicle modules |
| Protection features | Overcurrent, overtemperature, undervoltage, reverse polarity (-16 V), ground disconnect - eliminates need for external protection components |
Pinout & Package
MC17XSG500DEKR2 uses a 32-pin SOIC package with exposed thermal pad (SOIC32-EP), optimized for thermal dissipation in high-current applications and PCB layout compatibility across the MC32XSG family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CP | Charge pump capacitor connection | External capacitor node for internal gate-drive voltage generation; required for reliable high-side switching |
| RSTB | SPI reset and sleep enable | Active-low input that initializes registers, clears faults, and forces low-current sleep mode; internal pull-down |
| CSB | SPI chip select | Enables SPI transaction when pulled low; internal pull-up ensures bus isolation when inactive |
| SCLK | SPI serial clock | Master-provided clock (≤5.0 MHz); data sampled on rising edge; internal pull-down |
| SI | SPI serial input | Receives 16-bit commands (address + data + WD toggle); internal pull-down |
| SO | SPI serial output | Drives status/diagnostic data on falling edge; high-impedance when CSB high |
| OUT1–OUT5 | Protected high-side power outputs | Five 17 mΩ SMARTMOS channels delivering load current with active clamp, overcurrent, and thermal shutdown |
| CSNS | Analog current/voltage/temperature sense | Single pin multiplexed via SPI to report OUT[1:5] current, VPWR, or die temperature - enables MCU ADC monitoring |
| CSNS SYNCB | ADC synchronization signal | Open-drain output synchronized to current-sense sampling; requires external VCC pull-up for precise timing |
| IN1–IN4 | Direct control inputs (Fail mode) | Wake-up and channel control pins; assert high to activate corresponding OUT1–OUT4 in Fail mode |
| LIMP | Fail mode activation | Logic-high input forces immediate transition to Fail mode, disabling OUT5/OUT6 and enabling IN1–IN4 control |
| CLK | Device state feedback / PWM reference | Reports sleep/wake status; accepts external PWM clock (divided by 28 internally) for synchronized channel timing |
| VPWR | Main power supply | Exposed pad connects to 7–30 V battery rail; powers internal regulator, logic, analog, and gate drivers |
| VCC | Logic supply | 4.5–5.5 V supply for SPI I/Os, OUT6 driver, and CLK pin; must be present for bidirectional SPI communication |
| GND | Ground reference | Pins 9 & 24 provide low-impedance return path for logic, analog, and ESD; must be shorted on PCB |
Key Features
| Feature | Design Value |
|---|---|
| Programmable current sense ratio | Per-output current monitoring gain selectable via SPI - enables accurate low-current (<100 mA) and high-current (>5 A) load diagnostics |
| Dual-mode operation (Normal/Fail) | Seamless transition between SPI-controlled Normal mode and hardware-triggered Fail mode - ensures functional safety compliance without MCU intervention |
| EMC-optimized output configuration | SPI-adjustable slew rate and dynamic overcurrent profiles - reduces radiated emissions in sensitive lighting and motor control applications |
| External smart switch control (OUT6) | Dedicated logic-level output to drive an external high-current Smart Power Switch - extends system capacity beyond internal 5.5 A limit |
| Reverse polarity protection (-16 V) | Withstands battery misconnection events without latch-up or damage - eliminates need for external series diode or TVS |
Applications
| LED Lighting Control | DC Motor Drive |
|---|---|
Use Scenario: Controlling multiple LED strings in automotive exterior lighting (tail lamps, DRLs) with dimming, diagnostics, and thermal derating. IC Role / Device Role / Timing Role: High-side switch managing power delivery to LED loads; provides real-time current feedback and open-circuit detection via CSNS. Use Value: Enables ASIL-B–compatible lighting systems with single-chip fault reporting, eliminating discrete current-sense amplifiers and protection FETs. | Use Scenario: Driving small DC motors in industrial automation (valve actuators, fans) requiring stall detection and soft-start. IC Role / Device Role / Timing Role: Protected high-side driver with programmable overcurrent trip thresholds and active clamp during motor turn-off. Use Value: Prevents MOSFET destruction during inductive kickback and supports predictive maintenance via SPI-reported current trends. |
| Industrial Load Sequencing | Automotive Fail-Safe Systems |
Use Scenario: Sequential powering of sensors, solenoids, and relays in PLC I/O modules with coordinated timing and fault isolation. IC Role / Device Role / Timing Role: Multi-channel load manager with independent PWM control per output and daisy-chained SPI for compact board design. Use Value: Reduces BOM count by integrating five protected switches, current sensing, and diagnostics into one SOIC32-EP package. | Use Scenario: Safety-critical subsystems (e.g., brake light control) requiring guaranteed operation after communication loss or MCU reset. IC Role / Device Role / Timing Role: Fail-safe controller activated by LIMP pin or SPI timeout; directly drives OUT1–OUT4 using IN1–IN4 with retained protection. Use Value: Meets ISO 26262 ASIL-B requirements by maintaining basic functionality without software intervention during fault conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC07XSG517DEK | 54-pin SOIC-EP package; three 7.0 mΩ + two 17 mΩ outputs; same SPI interface and temperature range | Better suited for mixed-load systems requiring higher-current channels (e.g., HID ballasts + LEDs) | Select when needing lower RDS(on) on specific outputs and PCB space permits larger package |
| MC17XSG500EK | Identical electrical specs and pinout; differs only in tape-and-reel packaging (no R2 suffix) and unspecified temperature grade | Same functional use cases but may lack extended temperature validation for harsh environments | Choose MC17XSG500DEKR2 for production designs requiring guaranteed -40 °C to +125 °C operation and automated assembly |
Compared with MC07XSG517DEK, MC17XSG500DEKR2 offers uniform 17 mΩ RDS(on) across all five channels in a smaller SOIC32 footprint - ideal for space-constrained LED arrays. Versus MC17XSG500EK, the DEKR2 variant guarantees automotive-grade temperature qualification and is optimized for SMT line feeders via R2 tape-and-reel packaging.
Availability
MC17XSG500DEKR2 is available at Aetrix Electronics and suitable for automotive lighting control, industrial motor drive, and fail-safe power distribution systems requiring stable component supply, long-term lifecycle support, and AEC-Q100–aligned reliability.
Supply support for MC17XSG500DEKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in power management and functional safety.
The MC32XSG product line was engineered to replace electromechanical relays and discrete high-side drivers in 12 V/24 V systems - delivering integrated protection, digital diagnostics, and fail-safe operation for next-generation vehicle ECUs and industrial controllers.
FAQ
What is the maximum continuous output current supported by MC17XSG500DEKR2?
The MC17XSG500DEKR2 supports up to 5.5 A continuous output current per channel (OUT1–OUT5) when operated within its thermal limits - verified at 125 °C ambient with proper PCB copper pour and thermal vias under the exposed pad. This rating assumes 17 mΩ RDS(on), junction temperature ≤150 °C, and adequate heatsinking per JEDEC JESD51-7 thermal resistance (RΘJA = 17.4 °C/W).
Does MC17XSG500DEKR2 support daisy-chained SPI communication?
Yes, MC17XSG500DEKR2 supports daisy-chained SPI communication using its SO (serial output) pin connected to the SI (serial input) of the next device. This enables control and diagnostics of multiple MC17XSG500DEKR2 ICs using a single MCU SPI port, reducing GPIO count and simplifying firmware architecture for multi-channel systems.
How does the Fail-safe mode operate on MC17XSG500DEKR2?
MC17XSG500DEKR2 enters Fail-safe mode when the LIMP pin is asserted high or SPI communication fails (e.g., watchdog timeout). In this mode, OUT1–OUT4 are controlled directly by IN1–IN4 inputs, OUT5 and OUT6 are disabled, and all protection functions remain active - ensuring safe, deterministic behavior without MCU involvement during critical faults.
What is the purpose of the CSNS and CSNS SYNCB pins on MC17XSG500DEKR2?
The CSNS pin on MC17XSG500DEKR2 provides an analog voltage proportional to selected parameters (OUT1–OUT5 current, VPWR, or die temperature) via SPI-programmable multiplexer. The CSNS SYNCB pin is an open-drain output that synchronizes the MCU's ADC sampling to the internal current-sense acquisition window - enabling precise, jitter-free measurements without software timing overhead.
Can MC17XSG500DEKR2 drive incandescent bulbs and halogen lamps?
Yes, MC17XSG500DEKR2 is explicitly qualified for incandescent and halogen lamp control. Its robust overcurrent protection, active clamp circuitry, and reverse polarity tolerance (-16 V) handle high inrush currents and filament cold-resistance surges. The device also supports thermal derating and open-load detection - essential for lamp health monitoring and burn-out indication in automotive lighting systems.
MC17XSG500DEKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- General Purpose
- Number of Outputs:
- 6
- Ratio - Input:Output:
- 2:3
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- SPI
- Voltage - Load:
- 7V ~ 30V
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Current - Output (Max):
- -
- Rds On (Typ):
- 17mOhm
- Input Type:
- Non-Inverting
- Features:
- Internal PWM, Slew Rate Controlled, Status Flag
- Fault Protection:
- Current Limiting (Fixed), Open Load Detect, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-HSOP
MC17XSG500DEKR2 FAQ
1.How can I place an order for MC17XSG500DEKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC17XSG500DEKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC17XSG500DEKR2 reliable?
The price and inventory of MC17XSG500DEKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC17XSG500DEKR2 is usually 5 days.
3.What payment methods are accepted for MC17XSG500DEKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC17XSG500DEKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC17XSG500DEKR2?
MC17XSG500DEKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC17XSG500DEKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC17XSG500DEKR2?
For technical support, including MC17XSG500DEKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC17XSG500DEKR2 requirements.
6.How does Aetrix verify that MC17XSG500DEKR2 is sourced from the original manufacturer or authorized distributors?
All MC17XSG500DEKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC17XSG500DEKR2 meets industry standards.
7.What is the process for return or replacement of MC17XSG500DEKR2?
All MC17XSG500DEKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC17XSG500DEKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC17XSG500DEKR2 part is unused and in its original packaging.
Return procedure for MC17XSG500DEKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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