NXP Semiconductors MC32BC3770CSR2
- Part No.:
- MC32BC3770CSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Battery Chargers
- Package:
- 25-WFBGA, WLCSP
- Datasheet:
-
MC32BC3770CSR2.pdf
- Description:
- IC BATT CHG LI-ION 1CELL 25WLCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC32BC3770CSR2 from NXP Semiconductors is a fully programmable 2.0 A synchronous switch-mode Li-ion battery charger with intelligent dual-path power delivery, integrated OVP and power FETs, 1.5 MHz switching frequency, and I²C-programmable charge parameters (fast-charge current up to 2000 mA, regulation voltage 4.1–4.475 V). It enables system boot from dead battery in handheld consumer devices.
For engineers reviewing the MC32BC3770CSR2 datasheet, MC32BC3770CSR2 pinout, MC32BC3770CSR2 application, or MC32BC3770CSR2 equivalent, key selection considerations include its 20 V input tolerance, thermal regulation at 100 °C, VSYS output tracking capability, and WLCSP-25 package compatibility with space-constrained IoT and wearable designs.
Technical Context
The MC32BC3770CSR2 integrates a buck charger and boost regulator sharing a 1.5 MHz PWM controller, enabling simultaneous system power (VSYS) and battery charging (CHGOUT) with intelligent power-path arbitration. Its dual-path architecture uses Q4 (30 mΩ) to dynamically route power between battery and system load based on VBUS presence and VSYS regulation state.
It implements adaptive input current limiting (AICL) with programmable 4.3–4.9 V threshold, thermal regulation that linearly reduces fast-charge current above 100 °C (3.33 %/°C), and safety timers for trickle (45 min), pre-charge (45 min), and fast-charge (3.5–5.5 hr) modes - all configurable via 400 kHz I²C interface with register-level control of CV/CC thresholds, recharge voltage, and weak-battery detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Charge Current | Up to 2.0 A fast-charge current; programmable in 50 mA steps from 100–2000 mA for precise thermal and runtime optimization. |
| Battery Regulation | 4.1–4.475 V range in 25 mV steps; ±1.0 % accuracy over -40 to 85 °C ensures safe Li-ion full-charge compliance. |
| Input Voltage Range | 4.0–6.2 V operating; 20 V absolute max rating allows robust USB/DCP adapter interfacing with transient protection headroom. |
| Switching Frequency | 1.5 MHz typical; minimizes external inductor (1.0 μH) and capacitor footprint for ultra-compact PCB layouts. |
| I²C Interface | 400 kHz full-speed; enables real-time configuration of charge profiles, safety thresholds, and interrupt masking without firmware reflash. |
| Thermal Regulation | Active reduction of charge current starting at 100 °C junction temperature; maintains system power (VSYS) while protecting battery integrity. |
| VSYS Output | 3.6 V regulated (min 3.5 V) when VBUS present; tracks BATREG + ICHG × 30 mΩ in battery-powered mode for seamless transition. |
Pinout & Package
The MC32BC3770CSR2 is housed in a 25-bump, 2.27 mm × 2.17 mm, 0.4 mm pitch Wafer-Level Chip-Scale Package (WLCSP), optimized for high-density portable applications with minimal board area and thermal resistance (θJA = 48 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VBUS (A1, A2) | USB/DCP adapter input | Dual-pin input node supporting up to 20 V; internally clamped and discharged via 100 kΩ resistor in charge mode; used as OTG output in boost mode. |
| PMID (B1) | VBUS bypass output | High-side MOSFET connection node; supplies clean VBUS-derived power to system rails; requires local 2.2 μF ceramic decoupling to PGND. |
| LX (C1, D1) | Switching node | Connects to 1.0 μH inductor; dual-pin layout reduces trace inductance and EMI; must be shorted externally for optimal efficiency. |
| CHGOUT (C5, D5, E5) | Battery charger output | Direct connection to battery anode; three parallel pins reduce IR drop and thermal stress during 2.0 A charging; bypassed with 4.7 μF ceramic. |
| VSYS (D4, E3, E4) | System supply output | Primary power rail for SoC/peripherals; regulated at 3.6 V from VBUS or tracks BATREG + ICHG×30 mΩ when battery-powered. |
| BATSNSN (C3), BATREG (C4) | Battery sensing terminals | Differential sensing of battery cathode/anode enables accurate voltage regulation and OVP; critical for remote sense accuracy in high-current paths. |
| SCL/SDA (A4, A5) | I²C serial interface | Full-speed (400 kHz) bidirectional control bus; requires 1.5–2.2 kΩ pull-ups to VIO; supports dynamic reconfiguration of all charge parameters. |
| INTB (B5) | Interrupt output | Open-drain status indicator; asserts low on fault (thermal, OVP, timer expiry) or state change (VSYSOK/VSYSNG); enables host-driven error recovery. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-path power delivery | Enables immediate system boot from dead battery (<2.5 V) by powering VSYS directly from VBUS while simultaneously charging CHGOUT. |
| Intelligent power-path management | Q4 FET (30 mΩ) automatically connects battery to VSYS when VBUS absent and BATREG >2.4 V, maintaining uninterrupted system operation. |
| Adaptive input current limit (AICL) | Programmable 4.3–4.9 V threshold prevents USB port collapse by reducing charge current before VBUS drops below safe operating level. |
| Thermal regulation with current scaling | Linear reduction of fast-charge current above 100 °C (3.33 %/°C) preserves system power delivery while preventing thermal runaway. |
| USB-OTG boost capability | Configurable 5.0–5.2 V PMID output delivering up to 900 mA; activated via I²C command or dedicated CHGENB pin for peripheral enumeration. |
Applications
| Handheld Consumer Devices | Wearable Electronics |
|---|---|
Use Scenario: Smartphone or compact tablet with single-cell Li-ion battery requiring rapid charge and instant-on capability after deep discharge. IC Role / Device Role / Timing Role: Primary battery charger and system power manager; handles CC/CV charging, VSYS regulation, and dead-battery boot sequencing. Use Value: Enables <2.5 V cold-start without external LDO; 2.0 A fast-charge current cuts full-charge time by ~40% vs. 1.0 A alternatives while maintaining thermal safety. | Use Scenario: Smartwatch or fitness tracker with tight space constraints and need for reliable battery health monitoring. IC Role / Device Role / Timing Role: Integrated charger with battery voltage sensing (BATSNSN/BATREG), weak-battery detection (3.0–3.75 V programmable), and thermal regulation. Use Value: Remote sense accuracy ±1.0 % ensures precise end-of-charge termination; WLCSP-25 footprint (2.27 × 2.17 mm) fits sub-10 cm² PCBs. |
| IoT Edge Nodes | mPOS Terminals |
Use Scenario: Battery-powered sensor gateway operating intermittently on USB or wall adapter, requiring long-term reliability and low quiescent current. IC Role / Device Role / Timing Role: Dual-role power IC managing both charging (IBAT_SHDN ≤20 μA) and system supply (VSYS) with automatic VBUS/BAT arbitration. Use Value: Shutdown current <20 μA extends shelf life; AICL and safety timers prevent over-stress during unattended charging cycles. | Use Scenario: Mobile point-of-sale terminal using USB-C for both data and power, needing robust input protection and fast transaction readiness. IC Role / Device Role / Timing Role: High-voltage-tolerant (20 V) charger with OVP/UVLO, VSYS fast start-up (220 ms), and interrupt-driven fault reporting (INTB). Use Value: 20 V input rating absorbs USB-C transients; VSYSOK deglitch (27 ms) ensures stable power before host initialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar battery charger applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BQ25618RTWR | Lower 1.5 A max charge current; 1.2 MHz switching; no integrated OTG boost; different I²C register map. | Targeted at cost-sensitive wearables; lacks VSYS tracking mode and dual-path boot capability. | Select when OTG functionality and dead-battery boot are not required; verify register compatibility for firmware reuse. |
| MP2617GQZ | 2.0 A charge current; 500 kHz switching; external MOSFETs required; no integrated AICL or thermal regulation loop. | Suited for industrial designs where discrete FET selection and layout control are prioritized over integration. | Choose only if board area is unconstrained and thermal management can be implemented externally; higher BOM count. |
Compared with BQ25618RTWR and MP2617GQZ, the MC32BC3770CSR2 uniquely combines 2.0 A charging, 1.5 MHz high-frequency operation, integrated OTG boost, and true dual-path power delivery in a 2.27 mm × 2.17 mm WLCSP - enabling smaller form factors and faster system wake-up without compromising safety or configurability.
Availability
MC32BC3770CSR2 is available at Aetrix Electronics and suitable for handheld consumer devices, wearable electronics, IoT edge nodes, and mPOS terminals requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for MC32BC3770CSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and mobile applications, with core expertise in power management and mixed-signal integration.
The BC3770 product line was designed specifically for space-constrained, battery-powered portable electronics requiring intelligent power-path management, fast charging, and seamless dead-battery boot - targeting next-generation wearables, IoT sensors, and compact consumer devices.
FAQ
What is the maximum input voltage the MC32BC3770CSR2 can withstand?
The MC32BC3770CSR2 has an absolute maximum input voltage rating of 20 V on the VBUS pin, with operational input range specified from 4.0 V to 6.2 V. This 20 V tolerance provides robust protection against USB-C transients and adapter surges while enabling compatibility with wide-input USB/DCP sources. The device incorporates internal OVP circuitry that disables the converter if VBUS exceeds 6.7 V (typical), ensuring safe operation under fault conditions.
How does the MC32BC3770CSR2 handle charging from a completely dead battery?
The MC32BC3770CSR2 enables system boot from a dead battery (<2.5 V) using its dual-path architecture: when VBUS is applied, VSYS powers the host processor immediately while the charger initiates trickle mode (90 mA) on CHGOUT. This allows the system to initialize and configure charge parameters via I²C before transitioning to pre-charge and fast-charge stages - a capability confirmed in the functional description and Figure 1 application diagram of the MC32BC3770CSR2 datasheet.
What is the purpose of the NOBAT pin on the MC32BC3770CSR2?
NOBAT is a logic input pin on the MC32BC3770CSR2 used for battery presence detection. It features an internal 300 kΩ pull-up to VL and suspends charging immediately if a logic-high threshold is detected - indicating either missing battery or faulty pack communication. When unused, it must be tied to ground per datasheet guidance. This pin directly controls charger enablement independent of I²C commands, providing hardware-level safety for battery insertion validation.
Can the MC32BC3770CSR2 operate as a USB On-The-Go (OTG) power source?
Yes, the MC32BC3770CSR2 supports USB OTG functionality by operating as a boost regulator to generate 5.0–5.2 V at PMID, delivering up to 900 mA. Activation is possible via I²C command or assertion of the CHGENB pin, with regulation accuracy of ±250 mV over load and battery voltage ranges. This capability is explicitly documented in Section 5.2 "Features" and Table 4 electrical characteristics under "Boost converter" parameters.
What thermal protection mechanisms does the MC32BC3770CSR2 implement?
The MC32BC3770CSR2 implements two-tier thermal protection: hard shutdown at 150 °C (TSD) and active thermal regulation starting at 100 °C (TCF), where fast-charge current is linearly reduced at 3.33 %/°C to maintain system power (VSYS) while preventing battery damage. Both thresholds and the regulation slope are guaranteed by design and characterization per datasheet Note 11, and status is reported via INTB interrupt.
MC32BC3770CSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 25-WFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Battery Chemistry:
- Lithium Ion/Polymer
- Number of Cells:
- 1
- Current - Charging:
- Constant - Programmable
- Programmable Features:
- Current
- Fault Protection:
- -
- Charge Current - Max:
- 2A
- Battery Pack Voltage:
- 4.475V (Max)
- Voltage - Supply (Max):
- 6.2V
- Interface:
- I2C
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 25-WLCSP (2.27x2.17)
MC32BC3770CSR2 FAQ
1.How can I place an order for MC32BC3770CSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32BC3770CSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32BC3770CSR2 reliable?
The price and inventory of MC32BC3770CSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32BC3770CSR2 is usually 5 days.
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Once your MC32BC3770CSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32BC3770CSR2?
For technical support, including MC32BC3770CSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32BC3770CSR2 requirements.
6.How does Aetrix verify that MC32BC3770CSR2 is sourced from the original manufacturer or authorized distributors?
All MC32BC3770CSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32BC3770CSR2 meets industry standards.
7.What is the process for return or replacement of MC32BC3770CSR2?
All MC32BC3770CSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32BC3770CSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32BC3770CSR2 part is unused and in its original packaging.
Return procedure for MC32BC3770CSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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