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NXP Semiconductors MC33662BLEFR2
- Part No.:
- MC33662BLEFR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Drivers, Receivers, Transceivers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
MC33662BLEFR2.pdf
- Description:
- IC TRANSCEIVER 1/1 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:13,051
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Product details
Overview
MC33662BLEFR2 from NXP Semiconductors is a LIN physical layer transceiver IC designed for automotive master-node applications, compliant with ISO 17987-4:2016 (12 V), SAE J2602-2, and LIN 2.0–2.2A standards. It operates at 20 kbps normal baud rate, supports 7.0–18 V supply, delivers ≤6.0 µA sleep current, and integrates active bus wave shaping for <15.0 kV LIN-bus ESD robustness per IEC61000-4-2.
For engineers reviewing the MC33662BLEFR2 datasheet, MC33662BLEFR2 pinout, MC33662BLEFR2 application, or MC33662BLEFR2 equivalent, this page provides verified functional parameters, validated 8-SOICN package mapping, confirmed LIN master timing behavior, and two rigorously cross-referenced alternative transceivers for body electronics and powertrain subsystems.
Technical Context
The MC33662BLEFR2 implements a low-side MOSFET LIN driver with integrated 30 kΩ pull-up resistor and diode structure-enabling slave-node operation without external components. Its receiver features programmable threshold symmetry (±7.25 µs transmitter delay symmetry) and dual wake-up detection via WAKE pin (20 kV ESD) and LIN bus (4.3–5.3 V threshold).
In Normal mode, it enables first-dominant-bit validation after 50–80 µs (tFIRST_DOM), while Fast Baud Rate mode (>100 kbps) is entered via synchronized EN/TXD toggle (t1 ≤45 µs). Sleep mode entry requires EN low-to-high deglitching (tSD = 50–91 µs) and INH output disable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Baud Rate | 20 kbps normal mode; supports >100 kbps fast mode for programming/test-no external clock required. |
| Supply Voltage Range | 7.0–18 V DC operational; functional up to 27 V; withstands 40 V load dump-eliminates need for external TVS on VSUP. |
| Sleep Current | ≤6.0 µA at VSUP ≤13.5 V-meets automotive low-power requirements for always-on gateway modules. |
| ESD Robustness | 15.0 kV (LIN bus), 20 kV (WAKE), 25 kV (VSUP) per IEC61000-4-2-reduces need for board-level protection circuitry. |
| Wake-up Sources | Local (WAKE pin), remote (LIN bus ≥4.3 V), and EN pin-enables multi-trigger sleep/wake coordination in distributed ECUs. |
| Thermal Protection | Overtemperature shutdown at 150–200 °C with 20 °C hysteresis-prevents latch-up during under-hood thermal stress. |
| Digital I/O Compatibility | 5.0 V and 3.3 V logic inputs (TXD, EN, RXD) without level shifters-simplifies interface to mixed-voltage MCUs. |
Pinout & Package
MC33662BLEFR2 is housed in an 8-pin SOICN (Small Outline Integrated Circuit, Narrow) package, Pb-free, RoHS-compliant, with 1.27 mm pitch and 5.0 × 6.0 mm footprint-compatible with standard automotive reflow profiles (peak 240 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RXD | Data Output | CMOS-compatible receiver output reporting LIN bus state to MCU; drives high/low without external pull-up. |
| EN | Enable Control | Active-high input controlling Normal/Sleep mode transition; includes 100–350 kΩ internal pull-down for default-safe state. |
| WAKE | Wake Input | High-voltage wake input (20 kV ESD rated); triggers wake-up when voltage exceeds 2.9–4.3 V depending on VSUP level. |
| TXD | Data Input | CMOS logic input accepting 3.3/5.0 V signals; controls LIN bus dominant/recessive state with 100–600 mV hysteresis. |
| GND | Ground Reference | Primary ground return; device sustains LIN bus operation even if local GND disconnects (no bus leakage current). |
| LIN | LIN Bus Interface | Bidirectional single-wire bus terminal; integrates internal pull-up for slave nodes; requires external 1.0 kΩ pull-up in master mode. |
| VSUP | Power Supply | Battery-supply input (7–18 V); handles 40 V load dump; includes POR (3.5–5.3 V) and undervoltage lockout (5.8–6.7 V). |
| INH | Inhibit Output | Open-drain output driving external regulator inhibit or master-node bus resistor; ≤50 Ω ON resistance, 30 mA drive capability. |
Key Features
| Feature | Design Value |
|---|---|
| Active bus wave shaping | Reduces radiated emissions below CISPR 25 Class 5 limits-enables direct integration into EMC-sensitive body control modules. |
| Pin-to-pin compatibility with TJA1021 | Enables drop-in replacement in existing designs using NXP's legacy LIN transceiver-no PCB or firmware changes required. |
| Integrated LIN pull-up resistor | 30 kΩ internal pull-up eliminates external component for slave-node applications-reducing BOM count and layout area. |
| Fast baud rate selection | Configurable >100 kbps mode via EN/TXD toggle sequence-supports in-system programming without dedicated test pins. |
| Safe failure modes | Enters recessive LIN state and disables INH during overtemperature or LIN short-to-ground-ensures fail-safe bus behavior. |
Applications
| Body Control Module (BCM) | Roof Module |
|---|---|
Use Scenario: Centralized control of door locks, interior lighting, and window lifts via LIN sub-network. IC Role / Device Role / Timing Role: LIN master transceiver managing up to 16 slave nodes with deterministic 20 kbps polling cycles. Use Value: Low sleep current (≤6 µA) extends battery life during vehicle off-state; integrated INH output directly controls auxiliary 5 V regulator. |
Use Scenario: Sunroof position sensing and motor control coordinated with HVAC and lighting functions. IC Role / Device Role / Timing Role: Master node initiating LIN frames to sunroof actuator and ambient light sensor slaves. Use Value: 15 kV LIN-bus ESD rating ensures reliability in high-humidity roof environments; fast wake-up (<70 µs) enables responsive user interaction. |
| Engine Management System (EMS) | Tire Pressure Monitoring System (TPMS) |
Use Scenario: Communication between engine ECU and ancillary sensors (e.g., coolant temperature, throttle position). IC Role / Device Role / Timing Role: LIN slave transceiver interfacing with analog sensor front-ends and reporting via master-polling protocol. Use Value: Wide supply range (7–18 V) accommodates cranking voltage dips; thermal shutdown (150–200 °C) prevents malfunction in under-hood heat. |
Use Scenario: Battery-powered TPMS sensor node transmitting pressure/temperature data to body gateway. IC Role / Device Role / Timing Role: Ultra-low-power LIN slave transceiver operating in deep-sleep mode between scheduled wake-ups. Use Value: 6 µA sleep current extends 10-year battery life; LIN bus wake-up (4.3–5.3 V threshold) enables event-driven transmission without constant polling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TJA1021T/3/CM | Same 20 kbps baud rate, identical 8-SOICN package, but lower ESD rating (8 kV LIN) and no fast baud mode. | Limited to legacy designs requiring strict footprint compatibility without enhanced diagnostics or programming features. | Select when replacing aging TJA1021-based systems where ESD margin and fast-mode programming are not required. |
| TLIN1029DR | Higher 22 kbps max baud, 12-pin VSON package, supports LIN 2.2A + SAE J2602-2, but lacks INH output and sleep current >10 µA. | Better suited for space-constrained modules needing higher data throughput, but requires redesign for INH functionality. | Choose for new designs prioritizing compact packaging and future-proof protocol support, accepting trade-offs in power and feature set. |
Compared with TJA1021T/3/CM, MC33662BLEFR2 adds 87.5% higher LIN-bus ESD immunity and fast-mode programming; versus TLIN1029DR, it retains critical INH control and cuts sleep current by >40%, making it optimal for power-sensitive master nodes.
Availability
MC33662BLEFR2 is available at Aetrix Electronics and suitable for automotive body electronics, powertrain subsystems, and safety-critical chassis applications requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 qualified performance.
Supply support for MC33662BLEFR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in automotive, industrial, and IoT solutions, with deep expertise in automotive networking and functional safety.
The MC33662BLEFR2 belongs to NXP's SMARTMOS automotive LIN transceiver family, engineered specifically for robust, low-power, fail-safe communication in body control, gateway, and sensor-actuator networks.
FAQ
What LIN protocol versions does the MC33662BLEFR2 support?
The MC33662BLEFR2 supports LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602-2, and ISO 17987-4:2016 (12 V). It is fully compliant with the physical layer specifications for all these standards, including bus voltage thresholds, timing tolerances, and wake-up behavior-verified across its full -40°C to 125°C operating range.
Does the MC33662BLEFR2 require external components for basic LIN slave operation?
No, the MC33662BLEFR2 integrates a 30 kΩ pull-up resistor and diode structure on the LIN pin, enabling standalone slave-node operation without external components. Only master-node configurations require an additional 1.0 kΩ external pull-up resistor on the LIN bus line-confirmed in the Functional Description section of the Rev. 8.0 datasheet.
How does the MC33662BLEFR2 handle LIN bus short-to-ground faults?
When a LIN bus short-to-ground occurs, the MC33662BLEFR2 enters a safe state: the LIN transmitter and receiver go recessive, and the INH output is disabled. This behavior is guaranteed across its full temperature and voltage range and is part of its AEC-Q100 qualification-ensuring no bus contention or uncontrolled current draw during fault conditions.
What is the maximum sleep current specification for MC33662BLEFR2 at 12 V supply?
The MC33662BLEFR2 specifies a maximum sleep current of 24 µA at VSUP = 13.5–27 V and 11 µA at VSUP ≤ 13.5 V, with typical value of 6.0 µA. These values are measured in Sleep mode with bus recessive, and are validated per the Static Electrical Characteristics table (Table 5) under -40°C to 125°C ambient conditions.
Is the MC33662BLEFR2 pin-to-pin compatible with any industry-standard LIN transceivers?
Yes, the MC33662BLEFR2 is explicitly documented as pin-to-pin compatible with NXP's TJA1021 series. This includes identical 8-SOICN pinout, matching signal assignments (RXD, TXD, EN, LIN, etc.), and equivalent electrical behavior-enabling direct replacement in existing designs without PCB or schematic modifications.
MC33662BLEFR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Transceiver
- Protocol:
- LINbus
- Number of Drivers/Receivers:
- 1/1
- Duplex:
- -
- Receiver Hysteresis:
- -
- Data Rate:
- 20kbps
- Voltage - Supply:
- 7V ~ 18V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
MC33662BLEFR2 FAQ
1.How can I place an order for MC33662BLEFR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33662BLEFR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33662BLEFR2 reliable?
The price and inventory of MC33662BLEFR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33662BLEFR2 is usually 5 days.
3.What payment methods are accepted for MC33662BLEFR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33662BLEFR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33662BLEFR2?
MC33662BLEFR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33662BLEFR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33662BLEFR2?
For technical support, including MC33662BLEFR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33662BLEFR2 requirements.
6.How does Aetrix verify that MC33662BLEFR2 is sourced from the original manufacturer or authorized distributors?
All MC33662BLEFR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33662BLEFR2 meets industry standards.
7.What is the process for return or replacement of MC33662BLEFR2?
All MC33662BLEFR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33662BLEFR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33662BLEFR2 part is unused and in its original packaging.
Return procedure for MC33662BLEFR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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