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Home > Products > Integrated Circuits (ICs) > Interface > Specialized

NXP Semiconductors MC33689DDWB

Name: MC33689DDWB
Brand: NXP Semiconductors
SKU: MC33689DDWB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC33689DDWB

Manufacturer:: NXP Semiconductors

Category:: Specialized

Package:: 32-BSSOP (0.295", 7.50mm Width)

Datasheet:: MC33689DDWB.pdf

Description:: IC INTERFACE SPECIALIZED 32SOIC

Quantity:: RFQ Add To RFQ list

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Product details

Overview

MC33689DDWB from NXP (formerly Freescale) is a SPI-controlled System Basis Chip (SBC) integrating a LIN 2.0 transceiver, 5.0 V/50 mA LDO regulator, three protected high-side switches (HS1/HS2: 150 mA PWM-capable; HS3: 50 mA), current-sense op-amp, and window watchdog - all in a single 32-pin SOICW package. It serves as the central power, communication, and load-driving hub in automotive body electronics such as power window, mirror, and seat control modules.

For engineers reviewing the MC33689DDWB datasheet, MC33689DDWB pinout, MC33689DDWB application, or MC33689DDWB equivalent, key selection criteria include its LIN bus wake-up capability in Sleep/Stop modes, SPI-diagnosable fault reporting (undervoltage, overtemperature, overcurrent), 4 MHz SPI interface timing, and dual-mode high-side switch control (SPI + external PWM via IN pin).

Technical Context

The MC33689DDWB implements a multi-mode state machine (Normal/Sleep/Stop) with LIN bus or external wake-up inputs (L1/L2) triggering transitions. Its LIN physical layer supports programmable slew rates (normal/slow/fast) and waveshaping disable for >100 kbps operation, compliant with ISO 17987-4 and LIN 2.0.

SPI-controlled functions include real-time register access to diagnostic flags (VDDT, VSUV, VSOV, HSx faults), watchdog configuration (via WDC pin resistor), and high-side driver enable/disable/PWM gating. The integrated current-sense op-amp (E+/E−/OUT) provides rail-to-rail input and 1 MHz GBW for inline load monitoring without external components.

Key Specifications

Parameter	Value and Actual Design Meaning
LIN Data Rate	Up to 100 kbps with configurable slew rate; waveshaping disable enables higher rates in custom implementations.
5.0 V Regulator Output	4.75–5.25 V at 50 mA load; dropout ≤ 0.2 V ensures stable MCU supply under battery dip conditions (VSUP ≥ 5.5 V).
High-Side Switches	HS1/HS2: 150 mA rated, R_DS(on) ≤ 4.5 Ω @ 125°C; HS3: 50 mA rated, R_DS(on) ≤ 14 Ω @ 125°C; all feature overtemperature latch-off and clamp protection.
SPI Interface Speed	DC to 4.0 MHz operation; supports full-duplex command/response with t_VALID ≤ 50 ns for fast diagnostics and control loop updates.
Watchdog Timing	Selectable window watchdog period (10.6–215 ms) via external resistor on WDC pin; accuracy ±15% excluding resistor tolerance.
Operating Temperature	-40 °C to +125 °C ambient; junction limit +150 °C with thermal shutdown at +170 °C.
Current Sense Op-Amp	Rail-to-rail input (E+/E−), 1.0 MHz GBW, ±15 mV offset; enables accurate bidirectional load current measurement with external shunt.

Pinout & Package

MC33689DDWB uses a 32-pin SOICW (wide-body) package with exposed thermal pad (TGND pins 8, 9, 24, 25). Pin layout supports automotive PCB layout best practices: separate analog (AGND, E+, E−, OUT) and power grounds (TGND, GND), dedicated VS1/VS2 supplies for logic/LIN vs. high-side drivers, and LIN bus isolation via E+ and E− differential sense inputs.

Pin/Terminal	Circuit Role	Design Meaning
HS1, HS2, HS3	High-side driver outputs	Drive inductive/resistive loads; HS1/HS2 support external PWM via IN pin; all feature current limiting and thermal shutdown.
LIN, TXD, RXD	LIN physical layer I/O	Bidirectional single-wire bus interface; TXD controls dominant/recessive states; RXD reports bus voltage level to MCU.
VDD, VCC, AGND	5.0 V regulator output & analog supply	VDD powers MCU and digital logic; VCC supplies current-sense op-amp; AGND isolates analog reference from noisy digital ground.
E+, E−, OUT	Current sense amplifier terminals	E+ and E− connect across shunt resistor; OUT delivers amplified differential voltage proportional to load current.
SCLK, MOSI, MISO, CS	SPI interface signals	Full-duplex serial control; CS active-low enables MISO output; MISO tri-states when CS high for bus sharing.
WDC, RST, INT	System supervision signals	WDC configures watchdog timeout; RST provides reset pulse on VDD fault; INT asserts low on enabled fault conditions.
L1, L2, VS1, VS2	Wake-up & power inputs	L1/L2 detect external switch closures or LIN bus activity; VS1 powers regulator/LIN; VS2 powers high-side drivers.

Key Features

Feature	Design Value
LIN 2.0-compliant transceiver	Integrated bus driver/receiver with programmable slew rate, internal pull-up (20–47 kΩ), and bus wake-up detection in Sleep/Stop modes.
SPI-diagnosable system health	Real-time register readout of 12+ fault flags including VDD undervoltage, VSUP overvoltage, HSx overcurrent, and junction overtemperature pre-warning.
Multi-mode power management	Three operational states: Normal (full function), Sleep (VDD off, wake via LIN/L1/L2), Stop (VDD on, wake via MCU/LIN/L1/L2) - enabling <45 μA quiescent current.
PWM-controllable high-side drivers	HS1 and HS2 support external PWM via IN pin; internal AND logic gates SPI enable with PWM signal - enabling precise dimming or motor speed control.
Integrated current sensing	On-chip op-amp with rail-to-rail input, 1 MHz bandwidth, and ±15 mV offset eliminates need for external amplification in load monitoring applications.
Robust automotive qualification	Qualified per AEC-Q100 Grade 1; withstands ISO 7637-2 pulses (±100 V transient on L1/L2), 4000 V HBM ESD, and load dump up to 40 V.

Applications

Power Window Control	Mirror Adjustment Module
Use Scenario: Driving bidirectional DC motors for window lift/drop with soft-start and stall detection. IC Role / Device Role / Timing Role: MC33689DDWB acts as main power controller and LIN slave node - regulating MCU supply, driving motor H-bridge high-side, monitoring current via E+/E−, and reporting faults over LIN. Use Value: Eliminates discrete regulators, current-sense amps, and LIN transceivers; reduces BOM count by ≥7 components while enabling diagnostic compliance per ISO 14229.	Use Scenario: Controlling stepper or DC motors for mirror folding, tilt, and rotation with position feedback. IC Role / Device Role / Timing Role: MC33689DDWB serves as LIN-connected actuator interface - supplying 5 V to motor driver IC, switching motor phases via HS1/HS2, and detecting overload via current-sense op-amp output. Use Value: Enables closed-loop current control without external op-amp; SPI-accessible fault registers allow rapid root-cause analysis during EOL testing or field diagnostics.
Seat Position Memory System	Roof Sunshade Actuator
Use Scenario: Managing multiple linear actuators for seat fore/aft, recline, and lumbar adjustment with end-stop detection. IC Role / Device Role / Timing Role: MC33689DDWB functions as distributed LIN node - powering seat MCU, driving each actuator's high-side switch (HS1–HS3), and measuring current to infer mechanical load and stall conditions. Use Value: Integrated 150 mA HS1/HS2 drivers handle typical seat motor peak currents (≤120 mA); thermal shutdown prevents damage during jammed-actuator events.	Use Scenario: Controlling sunshade motor with smooth start/stop and obstruction detection in convertible roof systems. IC Role / Device Role / Timing Role: MC33689DDWB operates as LIN slave controlling sunshade direction and speed - using HS1/HS2 for H-bridge drive, IN pin for PWM speed modulation, and current sense for pinch detection. Use Value: On-chip PWM gating synchronizes motor control with LIN command timing; current-sense output feeds MCU ADC for real-time torque estimation and automatic reversal on obstruction.

Power Window Control

Mirror Adjustment Module

Use Scenario: Driving bidirectional DC motors for window lift/drop with soft-start and stall detection.

IC Role / Device Role / Timing Role: MC33689DDWB acts as main power controller and LIN slave node - regulating MCU supply, driving motor H-bridge high-side, monitoring current via E+/E−, and reporting faults over LIN.

Use Value: Eliminates discrete regulators, current-sense amps, and LIN transceivers; reduces BOM count by ≥7 components while enabling diagnostic compliance per ISO 14229.

Use Scenario: Controlling stepper or DC motors for mirror folding, tilt, and rotation with position feedback.

IC Role / Device Role / Timing Role: MC33689DDWB serves as LIN-connected actuator interface - supplying 5 V to motor driver IC, switching motor phases via HS1/HS2, and detecting overload via current-sense op-amp output.

Use Value: Enables closed-loop current control without external op-amp; SPI-accessible fault registers allow rapid root-cause analysis during EOL testing or field diagnostics.

Seat Position Memory System

Roof Sunshade Actuator

Use Scenario: Managing multiple linear actuators for seat fore/aft, recline, and lumbar adjustment with end-stop detection.

IC Role / Device Role / Timing Role: MC33689DDWB functions as distributed LIN node - powering seat MCU, driving each actuator's high-side switch (HS1–HS3), and measuring current to infer mechanical load and stall conditions.

Use Value: Integrated 150 mA HS1/HS2 drivers handle typical seat motor peak currents (≤120 mA); thermal shutdown prevents damage during jammed-actuator events.

Use Scenario: Controlling sunshade motor with smooth start/stop and obstruction detection in convertible roof systems.

IC Role / Device Role / Timing Role: MC33689DDWB operates as LIN slave controlling sunshade direction and speed - using HS1/HS2 for H-bridge drive, IN pin for PWM speed modulation, and current sense for pinch detection.

Use Value: On-chip PWM gating synchronizes motor control with LIN command timing; current-sense output feeds MCU ADC for real-time torque estimation and automatic reversal on obstruction.

Equivalent & Alternatives

The following parts are listed as comparable options for similar system basis chip applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33883DWR2	Higher current HS drivers (2 A), no integrated LIN transceiver; requires external LIN PHY; includes CAN interface.	Targeted at motor control nodes needing CAN + high-power drive, not LIN-only body modules.	Choose MC33883DWR2 only if CAN communication and >500 mA load drive are required - not a drop-in replacement for LIN-centric designs.
TLF35584QVVS1	Includes ASIL-B safety features, dual 5 V/150 mA regulators, and enhanced watchdog; no current-sense op-amp; LIN transceiver only.	Designed for safety-critical ADAS power domains; lacks integrated current sensing needed for load monitoring in comfort systems.	TLF35584QVVS1 suits ISO 26262-compliant clusters but adds cost/complexity unnecessary for non-safety LIN slaves like window controls.

Compared with MC33689DDWB, MC33883DWR2 trades integrated LIN for CAN and higher drive strength, while TLF35584QVVS1 adds functional safety at the expense of current-sense capability - making MC33689DDWB uniquely balanced for cost-sensitive, diagnostics-rich LIN body electronics.

Availability

MC33689DDWB is available at Aetrix Electronics and suitable for automotive body control modules, LIN-based seat/mirror/window systems, and industrial human-machine interface panels requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MC33689DDWB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive semiconductors, delivering secure, reliable, and energy-efficient solutions for vehicle networking, power management, and domain control.

The MC33689DDWB belongs to NXP's System Basis Chip portfolio, designed specifically for cost-optimized, diagnostics-enabled LIN slave nodes in automotive comfort electronics - emphasizing integration, robustness, and SPI-based system visibility.

FAQ

What is the maximum LIN bus data rate supported by the MC33689DDWB?

The MC33689DDWB is specified for LIN 2.0 compliance at up to 100 kbps with standard waveshaping enabled. Its LIN transceiver allows waveshaping to be disabled via SPI configuration, permitting higher custom data rates in applications where waveform fidelity is relaxed - though timing margins must be validated per ISO 17987-4 for non-standard operation. The MC33689DDWB does not guarantee conformance beyond 100 kbps.

How does the MC33689DDWB handle overtemperature conditions in its high-side switches?

The MC33689DDWB monitors junction temperature and disables HS1, HS2, or HS3 upon reaching 155–190 °C (depending on operating condition), latching the switch OFF and setting corresponding fault bits in the SPI status register. Recovery requires either a power cycle or explicit SPI command to clear the flag and re-enable - preventing automatic restart during unsafe thermal conditions. This behavior applies identically to MC33689DDWB HS1, HS2, and HS3 outputs.

Can the MC33689DDWB's current-sense op-amp measure bidirectional load current?

Yes - the MC33689DDWB's current-sense op-amp accepts differential inputs at E+ and E− with rail-to-rail common-mode range (-0.1 V to VCC + 0.1 V), enabling measurement across a bidirectional shunt resistor. When paired with an external precision shunt and MCU ADC, it supports both sourcing and sinking current detection in H-bridge or relay-driven loads - a capability confirmed in the MC33689DDWB datasheet Section 3.3 and Figure 2 block diagram.

What is the purpose of the WDC pin on the MC33689DDWB, and how is it configured?

The WDC pin on the MC33689DDWB sets the window watchdog timeout period using an external resistor (10–100 kΩ). The formula t_WDC = 0.991 × R + 0.648 (R in kΩ, t in ms) determines the period, ranging from ~10.6 ms to 215 ms. Leaving WDC open selects the longest period (~160 ms). This pin directly configures the watchdog independent of SPI, providing hardware-level fail-safe timing critical for MC33689DDWB deployments in automotive safety zones.

Does the MC33689DDWB support wake-up from Stop mode via the LIN bus?

Yes - the MC33689DDWB supports LIN bus wake-up from Stop mode, where VDD remains powered but the core logic is halted. Upon detecting a valid LIN recessive-to-dominant transition, the device asserts INT low within ≤20 μs (typical), then restores full functionality after ~90 μs (t_WUCS). This behavior is explicitly documented in MC33689DDWB datasheet Table 4 and Figure 10, enabling ultra-low-power always-on LIN slave operation.

MC33689DDWB Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 32-BSSOP (0.295", 7.50mm Width)

Packaging:: Tube

Product Status:: Obsolete

Applications:: Mirror Control

Interface:: SPI Serial

Voltage - Supply:: 5.5V ~ 18V

Supplier Device Package:: 32-SOIC

Grade:: Automotive

Qualification:: -

Mounting Type:: Surface Mount

MC33689DDWB FAQ

1.How can I place an order for MC33689DDWB through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33689DDWB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33689DDWB reliable?

The price and inventory of MC33689DDWB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33689DDWB is usually 5 days.

3.What payment methods are accepted for MC33689DDWB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33689DDWB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33689DDWB?

MC33689DDWB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33689DDWB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33689DDWB?

For technical support, including MC33689DDWB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33689DDWB requirements.

6.How does Aetrix verify that MC33689DDWB is sourced from the original manufacturer or authorized distributors?

All MC33689DDWB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33689DDWB meets industry standards.

7.What is the process for return or replacement of MC33689DDWB?

All MC33689DDWB units undergo pre-shipment inspection (PSI). If there is an issue with MC33689DDWB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33689DDWB part is unused and in its original packaging.

Return procedure for MC33689DDWB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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