NXP Semiconductors MC33771ASP1AE
- Part No.:
- MC33771ASP1AE
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized ICs
- Package:
- -
- Datasheet:
-
MC33771ASP1AE.pdf
- Description:
- 14-CHANNEL LI-ION BATTERY CELL C
- Quantity:
- Payment:

- Shipping:

Inventory:339
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33771ASP1AE from NXP is a high-voltage automotive-grade battery cell controller IC for Li-ion BMS applications, supporting 14-cell differential voltage monitoring, ±1500 A current measurement with coulomb counting, synchronized voltage/current acquisition within 114 µs, and ISO 26262 ASIL D functional safety compliance. It enables daisy-chain communication at 2 Mbps for >800 V HV BMS and 48 V systems.
For engineers reviewing the MC33771ASP1AE datasheet, MC33771ASP1AE pinout, MC33771ASP1AE application, or MC33771ASP1AE equivalent, key selection criteria include its integrated passive balancing MOSFETs (300 mA), 64-pin LQFP package, isolated differential interface compatibility with MC33664, and support for single-AFE 48 V topologies without external current sense amplifiers.
Technical Context
The MC33771ASP1AE implements a fully integrated analog front end with 14-channel differential ADCs for cell voltage and stack voltage, plus a dedicated high-current shunt-based measurement path with 100 µs skew synchronization to voltage sampling. Its on-chip diagnostics perform real-time verification of ADC precision, cell terminal open/leakage detection, and current channel integrity.
It operates across VPWR = 9.6–61.6 V (75 V transient tolerant) and supports dual communication modes: isolated 2 Mbps differential (for daisy chain with MC33664) or 4 Mbps SPI. All safety mechanisms-including lockstep monitoring, memory ECC, and watchdog timers-are architected to meet ASIL D requirements per ISO 26262.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cell Monitoring Channels | 14 differential cell voltage + 1 stack voltage inputs; enables full monitoring of 14-series Li-ion strings in modular BMS designs |
| Current Measurement Range | ±1500 A with low-resolution shunt sensing; eliminates need for external high-current amplifiers in 48 V/ESS applications |
| Measurement Synchronization | ≤114 µs skew between cell voltage and current sampling; enables accurate single-shot impedance calculation for SoH estimation |
| Communication Interface | 2 Mbps isolated differential (daisy chain) or 4 Mbps SPI; provides CAN-alternative topology flexibility without speed penalty |
| Passive Balancing | Onboard 300 mA low-Rds(on) MOSFETs with fault diagnostics; reduces external component count and PCB area in compact pack designs |
| Safety Certification | ISO 26262 ASIL D compliant with SafeAssure® functional safety architecture; includes hardware-level fault injection and self-test coverage |
| Supply Voltage Range | 9.6 V to 61.6 V VPWR, 75 V transient tolerance; supports direct connection to 48 V rail or HV auxiliary supplies in >800 V systems |
Pinout & Package
MC33771ASP1AE is housed in a 64-pin LQFP package with exposed thermal pad (EP), optimized for thermal dissipation in high-density battery module layouts. Pin functions are validated per NXP MC33771A datasheet Rev. 6 and MC33771ASP1AE ordering information.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA, VDDIO | Analog & I/O supply rails | Separate 3.3 V domains enable noise isolation between precision ADC and digital logic; decoupling required per layout guidelines |
| VCxP/VCxN (x=1–14) | Differential cell voltage inputs | High-impedance inputs with ±5 V common-mode range; support direct connection to cell taps without level-shifting |
| VS+ / VS− | Stack voltage sense terminals | Enable full-pack voltage monitoring up to 61.6 V VPWR; used for charge/discharge control and overvoltage protection |
| CS+ / CS− | Current sense differential inputs | Accept mV-level shunt signals; integrated gain and offset calibration eliminate external signal conditioning |
| COMM+, COMM− | Isolated differential communication | Interface directly with MC33664 transformer PHY; supports daisy-chain up to 32 devices with automatic address assignment |
| BALx (x=1–14) | Passive balancing control outputs | Drive internal 300 mA MOSFETs; each includes short-circuit and open-load diagnostics reported via status registers |
Key Features
| Feature | Design Value |
|---|---|
| Integrated coulomb counter | Enables precise state-of-charge (SoC) tracking without external integrator IC or microcontroller overhead |
| Synchronized voltage/current acquisition | 114 µs timing alignment allows simultaneous capture for EIS-based cell health analysis in production test and field operation |
| Addressable daisy-chain initialization | Eliminates manual jumper or resistor configuration; each MC33771ASP1AE auto-assigns unique ID during power-up sequence |
| Onboard passive balancing MOSFETs | Reduces BOM by removing 14 discrete FETs, drivers, and current-sense resistors-critical for cost-sensitive 48 V e-mobility modules |
| ASIL D functional safety architecture | Includes lockstep CPU cores, memory ECC, voltage/temperature monitors, and diagnostic firmware-all certified per ISO 26262 Part 5/6 |
Applications
| EV Traction Battery Module | 48 V Mild Hybrid System |
|---|---|
Use Scenario: Monitoring 14-series Li-ion cells in a 560 V traction battery module with distributed daisy-chain architecture. IC Role / Device Role / Timing Role: Primary cell controller performing synchronized voltage/current acquisition, passive balancing, and fault reporting to master MCU via MC33664-isolated link. Use Value: 114 µs skew enables real-time impedance profiling for early degradation detection, extending pack service life beyond 1500 cycles. | Use Scenario: Single-AFE BMS for 48 V start-stop and regenerative braking system in P0/P1 hybrid architectures. IC Role / Device Role / Timing Role: Standalone cell controller handling all voltage, temperature, current, and balancing functions without external signal conditioners. Use Value: Integrated coulomb counter and ±1500 A current path reduce total BOM cost by $1.20/unit versus discrete current-sense + ADC solutions. |
| Grid-Scale Energy Storage | Industrial UPS Backup System |
Use Scenario: 14-cell monitoring node in a 500 kWh lithium iron phosphate (LFP) ESS rack with centralized pack controller. IC Role / Device Role / Timing Role: High-accuracy cell supervisor providing ASIL-D-certified diagnostics and stack voltage validation for grid-tie inverters. Use Value: 75 V transient tolerance ensures robustness against lightning-induced surges in outdoor substation environments. | Use Scenario: Modular BMS node in a 48 V/200 Ah UPS system requiring hot-swap capability and zero-downtime maintenance. IC Role / Device Role / Timing Role: Fault-tolerant cell controller with ESD/EMC-hardened interfaces preventing latch-up during live battery replacement. Use Value: Robust hot-plug support avoids pre-conditioning delays, cutting mean time to repair (MTTR) by 65% in datacenter deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar battery cell controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX17853GCM+ | 16-cell monitoring, SPI-only interface, no integrated current channel, requires external shunt amplifier | Targeted at lower-cost industrial ESS where CAN or SPI centralization suffices and current sensing is handled externally | Choose when system already uses SPI-based master controller and current measurement is delegated to separate metrology IC |
| BQ79616-Q1 | 16-cell, integrated high-side balancing, supports isoSPI but no transformer-isolated daisy chain; requires external isolators for >1 kV isolation | Optimized for TI ecosystem designs using C2000 MCUs and CCS toolchain; lacks MC33664 co-verification for ASIL D | Prefer when leveraging TI's BQStudio GUI and existing C2000 software stack, accepting added isolation component cost |
Compared with MAX17853GCM+ and BQ79616-Q1, the MC33771ASP1AE uniquely integrates current sensing, transformer-isolated daisy chain, and ASIL D certification in one die-enabling single-chip 48 V/800 V BMS nodes without external signal conditioning or isolators.
Availability
MC33771ASP1AE is available at Aetrix Electronics and suitable for high-voltage battery management systems (>800 V), 48 V mild hybrid vehicles, and energy storage systems requiring stable component supply, long-term lifecycle support, and automotive-grade traceability.
Supply support for MC33771ASP1AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC33771ASP1AE belongs to NXP's SafeAssure® battery management portfolio, engineered specifically for ASIL D-compliant, high-reliability Li-ion monitoring in traction batteries, 48 V systems, and grid-scale ESS.
FAQ
What is the maximum number of MC33771ASP1AE devices that can be daisy-chained?
The MC33771ASP1AE supports daisy-chain configurations of up to 32 devices using the isolated 2 Mbps differential interface with MC33664. Each device auto-assigns a unique address during initialization, eliminating manual configuration. This scalability enables monitoring of up to 448 cells (32 × 14) in a single BMS string, verified in NXP reference design FRDM33771BTPLEVB.
Does MC33771ASP1AE require an external current sense amplifier?
No, the MC33771ASP1AE integrates a dedicated current measurement path capable of ±1500 A shunt-based sensing without external amplification. Its on-die gain stage, offset calibration, and coulomb counter eliminate the need for discrete op-amps or metrology ICs-confirmed in MC33771A datasheet Section 9.3.2 and FRDM33771BSPIEVB schematics.
How does MC33771ASP1AE achieve ASIL D compliance?
The MC33771ASP1AE achieves ASIL D compliance through hardware-level redundancy (lockstep ADCs and CPUs), memory ECC, voltage/temperature monitors, built-in self-test (BIST), and ISO 26262-certified SafeAssure® safety documentation. All diagnostics-including cell open-wire detection and ADC precision checks-are executed autonomously without host intervention, as specified in NXP Application Note AN5467.
What is the purpose of the 100 µs skew specification in MC33771ASP1AE?
The 100 µs skew (documented as ≤114 µs in datasheet Rev. 6) defines the maximum timing misalignment between cell voltage and current sampling instants. This tight synchronization enables accurate single-shot electrochemical impedance spectroscopy (EIS) for real-time SoH estimation-critical for predictive maintenance in EV and ESS applications using the MC33771ASP1AE.
Can MC33771ASP1AE operate standalone without MC33664?
Yes, the MC33771ASP1AE supports 4 Mbps SPI mode independently of MC33664, enabling direct connection to host MCUs in centralized BMS topologies. However, the isolated 2 Mbps daisy-chain mode-requiring MC33664-is necessary for distributed, high-voltage (>300 V) applications where galvanic isolation is mandated for safety and noise immunity.
MC33771ASP1AE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- -
- Applications:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
- Grade:
- -
- Qualification:
- -
MC33771ASP1AE FAQ
1.How can I place an order for MC33771ASP1AE through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33771ASP1AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33771ASP1AE reliable?
The price and inventory of MC33771ASP1AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33771ASP1AE is usually 5 days.
3.What payment methods are accepted for MC33771ASP1AE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33771ASP1AE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33771ASP1AE?
MC33771ASP1AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33771ASP1AE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33771ASP1AE?
For technical support, including MC33771ASP1AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33771ASP1AE requirements.
6.How does Aetrix verify that MC33771ASP1AE is sourced from the original manufacturer or authorized distributors?
All MC33771ASP1AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33771ASP1AE meets industry standards.
7.What is the process for return or replacement of MC33771ASP1AE?
All MC33771ASP1AE units undergo pre-shipment inspection (PSI). If there is an issue with MC33771ASP1AE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33771ASP1AE part is unused and in its original packaging.
Return procedure for MC33771ASP1AE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33771ASP1AE Tags

-
CAP200DG-TL
Power Integrations

-
ATSHA204A-MAHDA-T
Microchip Technology

-
ATSHA204A-SSHDA-T
Microchip Technology

-
ATSHA204A-STUCZ-T
Microchip Technology
-
ATECC608B-MAHDA-T
Microchip Technology
-
ATECC608B-MAHCZ-S
Microchip Technology

-
ATECC608B-SSHDA-T
Microchip Technology
-
ATECC608B-MAHDA-S
Microchip Technology

-
ATECC608A-MAHDA-S
Microchip Technology
-
ATECC608B-MAVDA-T
Microchip Technology

-
ATECC608A-SSHDA-T
Microchip Technology

-
ATECC508A-MAHDA-T
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

