Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MC33772CTA1AE

Part No.:
MC33772CTA1AE
Manufacturer:
NXP Semiconductors
Category:
Battery Management
Package:
48-LQFP Exposed Pad
Datasheet:
AetrixMC33772CTA1AE.pdf
Description:
IC 6-CH LI-ION BATT CTRL 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:129

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MC33772CTA1AE from NXP Semiconductors is a SMARTMOS battery cell controller IC for automotive and industrial battery management systems, supporting 3–6 series Li-ion cells with ±0.7 mV cell voltage measurement error, integrated 300 mA passive cell balancing, and dual-interface operation (SPI or isolated daisy-chain TPL). It performs synchronized differential cell voltage, current, and temperature measurements while delivering coulomb counting and fault detection for HEV/EV traction packs and ESS applications.

For engineers reviewing the MC33772CTA1AE datasheet, MC33772CTA1AE pinout, MC33772CTA1AE application, or MC33772CTA1AE equivalent, this device requires attention to its 48-pin LQFP-EP package, VPWR operating range (6.0–30 V SPI / 7.0–30 V TPL), AEC-Q100 qualification, ASIL D functional safety support, and absence of TPL current measurement capability per ordering code "TA1".

Technical Context

The MC33772CTA1AE implements two independent ADC subsystems: ADC1-A/B for high-precision differential cell voltage measurement (15-bit resolution, ±0.7 mV error over –40 °C to +105 °C), and ADC2 for bidirectional current sensing via ISENSE± inputs with auto-ranging PGA (gains 4–256) and 16-bit conversion. Its communication architecture supports either 4.0 Mbit/s SPI or 2.0 Mbit/s isolated daisy-chain TPL - selected at power-up via SPI_COM_EN pin - with bi-directional transceivers enabling up to 63-node stacks.

It integrates seven GPIO/temperature sensor inputs (AN0–AN6), on-chip thermal monitoring (±3 K error), programmable OV/UV thresholds per cell (19.53 mV/LSB), and autonomous sleep-mode monitoring. The device uses internal charge pump (VCP) and pre-regulator (VPRE) to sustain operation across wide input voltage ranges while maintaining analog supply stability (VANA = 2.65 V, VCOM = 5.0 V).

Key Specifications

Parameter Value and Actual Design Meaning
Cell count support 3 to 6 series Li-ion cells - enables scalable BMS designs for 12 V auxiliary, 48 V mild-hybrid, and high-voltage EV battery stacks.
Cell voltage accuracy ±0.7 mV total error (0.1–4.85 V, –40 °C to +105 °C) - ensures reliable state-of-charge estimation and cell balancing decisions under thermal stress.
Communication interface SPI (4.0 Mbit/s) or isolated daisy-chain TPL (2.0 Mbit/s) - provides layout flexibility: SPI for short PCB traces, TPL for galvanically isolated multi-module stacks.
Passive cell balancing Onboard 300 mA drivers with diagnostics - allows active voltage equalization without external FETs or controllers, reducing BOM count and board area.
Operating ambient –40 °C to +125 °C (SPI mode) - meets AEC-Q100 Grade 0 requirements for under-hood automotive deployment.
Functional safety Designed to support ISO 26262 up to ASIL D - includes lockstep monitoring, memory ECC, and diagnostic coverage for critical BMS functions.
Supply voltage range 6.0–30 V (SPI), 7.0–30 V (TPL) - accommodates wide battery pack voltage swings while tolerating 40 V transients.

Pinout & Package

MC33772CTA1AE is housed in a thermally enhanced 48-pin LQFP-EP (exposed pad) package, optimized for heat dissipation in high-power battery monitoring applications. The exposed pad (GNDFLAG) must be soldered to the PCB's lowest-potential node and thermal plane.

Pin/Terminal Circuit Role Design Meaning
VPWR1 / VPWR2 Primary power supply inputs Dual-supply architecture improves noise immunity; both pins require local decoupling and must be connected to same battery stack rail.
CT_1 to CT_6 Differential cell terminal inputs High-impedance inputs (10 nA leakage) for measuring voltage across each cell; require LPF resistor termination per datasheet layout guidelines.
CB_1 to CB_6 Cell balance driver outputs Integrated 300 mA NMOS drivers with RDS(on) ≤ 0.5 Ω @ 125 °C - enable direct connection to balancing resistors without external switches.
ISENSE+ / ISENSE− Bidirectional current sense inputs Differential inputs with ±150 mV full-scale range and auto-ranging PGA - support shunt-based coulomb counting with <3 µVrms noise at 16-bit resolution.
AN0–AN6 GPIO / precision temperature sensor inputs Seven ratiometric analog inputs usable as thermistor interfaces (0–4.85 V range) or digital I/O; support OV/UT/OT fault routing to FAULT pin.
SPI_COM_EN Interface selection control Hardwired to VPRE selects SPI; grounded selects TPL - determines physical layer and timing behavior at power-on reset.
FAULT Open-drain fault output Active-low signal aggregating internal/external faults (OV/UV, thermal, open-line, short-circuit); requires external pull-up for system-level alerting.

Key Features

Feature Design Value
Synchronized cell voltage and current measurement ADC1 and ADC2 operate on shared clock domain with deterministic latency - enables accurate coulomb counting and SOC estimation without time-skew errors.
Programmable cell OV/UV thresholds 8-bit configurable thresholds (19.53 mV/LSB resolution) per cell - allows fine-grained protection tuning across aging and temperature gradients.
Integrated VPRE and VCP regulators On-chip 5.0 V pre-regulator (15 mA load) and charge pump (2×VPRE) - eliminate need for external LDOs and reduce component count in space-constrained modules.
Hot-plug capable architecture Supports live insertion into powered battery stacks without latch-up or damage - critical for modular BMS serviceability and field upgrades.
Comprehensive fault detection suite Detects open lines, shorts, leakage, thermal faults, and supply anomalies - with dedicated diagnostics for cell balance drivers and GPIO inputs.

Applications

Automotive Battery Junction Box Energy Storage System (ESS) Rack Monitor

Use Scenario: Centralized monitoring of 12 V auxiliary battery and 48 V mild-hybrid pack in modern vehicles, with fault reporting to vehicle gateway via CAN.

IC Role / Device Role / Timing Role: Primary cell controller performing real-time voltage, temperature, and current acquisition; synchronizes measurements across multiple MC33772C devices in daisy-chain topology.

Use Value: Enables ASIL-B compliant junction box design with single-chip integration of cell balancing, coulomb counting, and isolation-ready communication - reducing interconnect complexity and validation effort.

Use Scenario: Monitoring 16S–24S LiFePO₄ stacks in commercial ESS cabinets, where thermal runaway prevention and cycle-life optimization are critical.

IC Role / Device Role / Timing Role: High-accuracy cell supervisor executing periodic voltage sweeps, temperature profiling, and balancing commands under microcontroller orchestration.

Use Value: ±0.7 mV cell voltage accuracy and integrated 300 mA balancing allow precise state-of-health tracking over 5,000+ cycles, extending usable battery life by up to 18% versus lower-accuracy alternatives.

Uninterruptible Power Supply (UPS) Module E-bike Battery Management Unit

Use Scenario: Compact 8S–12S UPS for telecom edge sites, requiring fast fault response (<100 µs) and low-quiescent-current sleep mode during grid-connected standby.

IC Role / Device Role / Timing Role: Standalone BMS controller managing cell balancing, overvoltage cutoff, and thermal shutdown - operates autonomously during AC loss events.

Use Value: Sleep-mode current of 32 µA (SPI, 25 °C) extends backup runtime; integrated VCOM regulator powers external logic, eliminating need for auxiliary LDO.

Use Scenario: Lightweight, vibration-resistant BMS for mid-drive e-bikes using 10S–14S NMC packs, deployed in cost-sensitive consumer electronics.

IC Role / Device Role / Timing Role: Cost-optimized cell monitor with GPIO-based thermistor inputs and SPI interface to low-cost MCU - avoids expensive isolated communication components.

Use Value: 48-pin LQFP-EP package enables compact 2-layer PCB layout; "TA1" variant excludes TPL hardware, lowering unit cost while retaining full cell measurement capability.

Equivalent & Alternatives

The following parts are listed as comparable options for similar battery cell controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC33772CTP1AE Includes TPL current measurement option; adds ISENSE+/- functionality within TPL protocol stack. Required when daisy-chain topology mandates current data transmission alongside voltage data without SPI bus contention. Select MC33772CTP1AE only if TPL-based current telemetry is needed; MC33772CTA1AE lacks this feature per ordering code "TA1".
MC33771CTA1AE Single-cell measurement channel (vs. 6-channel MC33772C); identical pinout and register map but reduced cell count support. Suitable for smaller battery stacks (1–3 cells) where full 6-channel capability is unnecessary and cost reduction is prioritized. MC33771CTA1AE shares software compatibility but cannot replace MC33772CTA1AE in 4–6 cell configurations due to hardware channel limitation.

Compared with MC33772CTP1AE, MC33772CTA1AE omits TPL current measurement capability - reducing complexity and cost for SPI-only or voltage-only monitoring systems. Against MC33771CTA1AE, it delivers full 6-channel scalability essential for medium-to-high voltage battery packs, with no software porting required.

Availability

MC33772CTA1AE is available at Aetrix Electronics and suitable for automotive battery junction boxes, energy storage system rack monitors, and uninterruptible power supply modules requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant performance.

Supply support for MC33772CTA1AE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and power management ICs.

The MC33772C product line delivers high-accuracy, ASIL-capable battery cell controllers for next-generation electric mobility and grid-scale energy storage - designed to simplify BMS architecture while meeting stringent automotive reliability standards.

FAQ

What communication interfaces does the MC33772CTA1AE support?

The MC33772CTA1AE supports two mutually exclusive communication modes: 4.0 Mbit/s SPI or 2.0 Mbit/s isolated daisy-chain transformer physical layer (TPL). Interface selection is determined at power-up by the SPI_COM_EN pin state - tied to VPRE for SPI, grounded for TPL. The MC33772CTA1AE does not support concurrent operation of both interfaces.

Does the MC33772CTA1AE include current measurement capability?

Yes, the MC33772CTA1AE includes a dedicated ADC2 current-sense module with ISENSE+ and ISENSE− inputs, supporting bidirectional shunt-based current measurement with auto-ranging PGA (gains 4–256) and 16-bit resolution. However, it does not support TPL-based current data transmission - that feature is exclusive to the "TP" variant (e.g., MC33772CTP1AE).

What is the maximum number of cells the MC33772CTA1AE can monitor?

The MC33772CTA1AE supports 3 to 6 series-connected lithium-ion cells, as confirmed by its six differential cell terminal inputs (CT_1 through CT_6) and corresponding cell balance drivers (CB_1 through CB_6). Operation with fewer than three cells is not guaranteed per datasheet Section 7.1 - minimum stack size is required for full parameter specification compliance.

Is the MC33772CTA1AE qualified for automotive use?

Yes, the MC33772CTA1AE is AEC-Q100 qualified (Grade 0) and designed to support ISO 26262 up to ASIL D. It operates over –40 °C to +125 °C ambient (SPI mode), features built-in diagnostics for open/short detection, thermal monitoring, and supply fault detection, and includes hardware mechanisms such as lockstep checking and memory ECC to meet automotive functional safety requirements.

What package type and thermal characteristics apply to the MC33772CTA1AE?

The MC33772CTA1AE uses a 48-pin LQFP-EP package with an exposed thermal pad (GNDFLAG). Its thermal resistance is RΘJB = 11 °C/W (junction-to-board) and RΘJA = 30 °C/W on a four-layer PCB. The exposed pad must be soldered to the PCB's lowest-potential node and thermal plane to maintain junction temperature below +150 °C under full load conditions.

MC33772CTA1AE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
48-LQFP Exposed Pad
Packaging:
Tray
Product Status:
Active
Function:
Battery Cell Controller
Battery Chemistry:
Lithium Ion
Number of Cells:
3 ~ 6
Fault Protection:
Over/Under Voltage
Interface:
I2C, SPI
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-HLQFP (7x7)

MC33772CTA1AE FAQ

1.How can I place an order for MC33772CTA1AE through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33772CTA1AE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33772CTA1AE reliable?

The price and inventory of MC33772CTA1AE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33772CTA1AE is usually 5 days.

3.What payment methods are accepted for MC33772CTA1AE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33772CTA1AE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33772CTA1AE?

MC33772CTA1AE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33772CTA1AE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33772CTA1AE?

For technical support, including MC33772CTA1AE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33772CTA1AE requirements.

6.How does Aetrix verify that MC33772CTA1AE is sourced from the original manufacturer or authorized distributors?

All MC33772CTA1AE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33772CTA1AE meets industry standards.

7.What is the process for return or replacement of MC33772CTA1AE?

All MC33772CTA1AE units undergo pre-shipment inspection (PSI). If there is an issue with MC33772CTA1AE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33772CTA1AE part is unused and in its original packaging.

Return procedure for MC33772CTA1AE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC33772CTA1AE Tags

  • MC33772CTA1AE
  • MC33772CTA1AE PDF
  • MC33772CTA1AE Datasheet
  • MC33772CTA1AE Specifications
  • MC33772CTA1AE Images
  • NXP Semiconductors
  • NXP Semiconductors MC33772CTA1AE
  • Buy MC33772CTA1AE
  • MC33772CTA1AE Price
  • MC33772CTA1AE Distributor
  • MC33772CTA1AE Supplier
  • MC33772CTA1AE Wholesale
Related Products
BQ29700DSER
BQ29700DSER

Texas Instruments

S-8241ABKMC-GBKT2G
S-8241ABKMC-GBKT2G

ABLIC Inc.

S-8241ABPMC-GBPT2G
S-8241ABPMC-GBPT2G

ABLIC Inc.

BQ27427YZFR
BQ27427YZFR

Texas Instruments

BQ27426YZFR
BQ27426YZFR

Texas Instruments

STC3117IJT
STC3117IJT

STMicroelectronics

STC3115IJT
STC3115IJT

STMicroelectronics

BQ76925RGER
BQ76925RGER

Texas Instruments

NPM1100-QDAA-R
NPM1100-QDAA-R

Nordic Semiconductor ASA

BQ27441DRZR-G1A
BQ27441DRZR-G1A

Texas Instruments

STC3115AIQT
STC3115AIQT

STMicroelectronics

S-8252AAL-M6T1U
S-8252AAL-M6T1U

ABLIC Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER