NXP Semiconductors MC33879BPEKR2
- Part No.:
- MC33879BPEKR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MC33879BPEKR2.pdf
- Description:
- IC SW SERIAL OCTAL 32SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,839
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33879BPEKR2 from NXP Semiconductors is a configurable octal high-side/low-side serial switch IC with 16-bit SPI control, open-load detection current disable capability, and SMARTMOS power architecture. It delivers 0.75 Ω RDS(ON) at 25 °C, supports 5.5–27.5 V supply range, and integrates independent overtemperature protection and +45 V / –20 V output clamping for inductive load switching in automotive body electronics.
For engineers reviewing the MC33879BPEKR2 datasheet, MC33879BPEKR2 pinout, MC33879BPEKR2 application, or MC33879BPEKR2 equivalent, this page provides verified functional identity, validated HSOP32 package mapping, confirmed 32-pin terminal roles, exact SPI timing compliance (4 MHz), and two manufacturer-validated alternative parts with documented technical and application differences.
Technical Context
The MC33879BPEKR2 implements dual-mode configurable outputs-eight independently routable high-side or low-side switches-with hardware-selectable configuration per channel. Its SMARTMOS architecture combines CMOS logic, bipolar/MOS analog circuitry, and DMOS power FETs to enable direct microcontroller interfacing without external gate drivers.
It features 16-bit SPI interface (3.3 V/5.0 V compatible) with daisy-chain support, integrated Power-ON Reset, Sleep mode activation via EN or VDD ≤ 0.8 V, and fault reporting through DO pin with per-output diagnostic status. Two outputs (D5/S5 and D6/S6) support direct PWM control via IN5/IN6 pins with ≤2.0 kHz max frequency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 5.5 V to 27.5 V VPWR - enables operation across automotive battery transients including cold-crank (5.5 V) and load-dump (27.5 V). |
| RDS(ON) (Typical) | 0.75 Ω at 25 °C - ensures <1 W conduction loss at 1.2 A, reducing thermal stress in HSOP32 package. |
| Output Current Limit | 0.6 A to 1.2 A - programmable per-channel current limiting protects against short-circuit faults without external components. |
| Output Clamp Voltage | +45 V (low-side), –20 V (high-side) - suppresses inductive kickback during turn-off, eliminating need for external TVS diodes. |
| Standby Current | ≤5.0 µA at 13 V VPWR - meets ultra-low-power requirements for always-on vehicle modules. |
| SPI Clock Frequency | Up to 4.0 MHz - supports fast command updates for real-time load control in safety-critical systems. |
| Operating Temperature | –40 °C to +125 °C ambient - qualified for under-hood and chassis-mounted automotive applications. |
Pinout & Package
MC33879BPEKR2 is housed in HSOP32 (SOT1746-1), a thermally enhanced plastic small-outline package with 32 terminals, 0.65 mm pitch, and 7.5 mm × 11 mm × 2.22 mm body. Exposed pad (EP) must be connected to GND for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 1) | Digital ground reference | Primary return path for logic and internal bias circuits; EP connection recommended to this node. |
| VDD (Pin 2) | Logic supply input | Provides 3.1–5.5 V power to SPI interface; device enters Sleep mode if VDD ≤ 0.8 V. |
| S8 (Pin 3) | Source output 8 | High-side source terminal; connects to load when configured as high-side driver. |
| NC (Pins 4, 8, 9, 24, 25, 30) | No internal connection | Must remain unconnected; no routing or pull-up/pull-down required. |
| D8 (Pin 5) | Drain output 8 | Low-side drain terminal; connects to load when configured as low-side driver. |
| S2 (Pin 6) | Source output 2 | Configurable high-side source; paired with D2 for complementary drive. |
| D2 (Pin 7) | Drain output 2 | Configurable low-side drain; paired with S2 for H-bridge or single-ended use. |
| S1 (Pin 10) | Source output 1 | Primary high-side output; used in solenoid/relay control with D1 as return path. |
| D1 (Pin 11) | Drain output 1 | Primary low-side output; supports PWM via IN5/IN6 only on outputs 5 and 6. |
| D6 (Pin 12) | Drain output 6 | PWM-capable low-side output; OR-ed with IN6 for direct microcontroller pulse control. |
| S6 (Pin 13) | Source output 6 | PWM-capable high-side output; enables independent duty-cycle modulation of output 6. |
| IN6 (Pin 14) | PWM direct control input | Enables hardware-level PWM override of SPI bit 6; max 2.0 kHz frequency. |
| EN (Pin 15) | Enable input | Active-high global enable; forces all outputs OFF and disables diagnostics when low. |
| SCLK (Pin 16) | SPI clock input | Controls data latching on falling edge (DI) and shifting on rising edge (DO); max 4 MHz. |
| DI (Pin 17) | SPI data input | Serial command input; MSB-first 16-bit frame includes open-load detect enable bits. |
| CS (Pin 18) | SPI chip select | Active-low enable for SPI transaction; rising edge commits command data to outputs. |
| IN5 (Pin 19) | PWM direct control input | OR-ed with SPI bit 5; allows microcontroller to bypass SPI for real-time output 5 control. |
| S5 (Pin 20) | Source output 5 | High-side output 5; supports direct PWM when paired with IN5 and SCLK disabled. |
| D5 (Pin 21) | Drain output 5 | Low-side output 5; shares same PWM capability and timing constraints as D6. |
| D3 (Pin 22) | Drain output 3 | Standard low-side output; supports open-load detection and fault reporting via DO. |
| S3 (Pin 23) | Source output 3 | Standard high-side output; provides independent overtemperature shutdown. |
| D4 (Pin 26) | Drain output 4 | Configurable low-side output; fault detection threshold is 2.5–5.0 V for open/short events. |
| S4 (Pin 27) | Source output 4 | Configurable high-side output; clamp voltage limits transient to –20 V during turn-off. |
| D7 (Pin 28) | Drain output 7 | Full-diagnostic output; reports fault status on DO pin as logic [1] during open/short conditions. |
| S7 (Pin 29) | Source output 7 | Full-diagnostic output; supports cascade fault reporting in multi-device daisy-chain systems. |
| VPWR (Pin 31) | Battery supply input | Primary power rail (–16 V to +45 V); includes internal reverse-battery protection. |
| DO (Pin 32) | SPI data output | Tri-state fault-reporting output; logic [1] indicates fault on any output; MSB-first status word. |
| EP (Exposed Pad) | Thermal & electrical ground | Internally connected to die substrate; must be soldered to PCB GND plane for thermal compliance. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware-configurable high-/low-side outputs | Each of eight channels independently routable as high-side (Sx) or low-side (Dx) without external components. |
| Open-load detection current disable | Per-output enable/disable of open-load sensing current via SPI register, reducing quiescent current in LED applications. |
| Independent overtemperature protection | Local thermal shutdown at 155–185 °C per output with 5–15 °C hysteresis prevents latch-up during overload. |
| Cascade fault reporting | Single DO pin reports faults across multiple daisy-chained MC33879BPEKR2 devices without additional wiring. |
| Internal +45 V / –20 V output clamping | Eliminates need for external flyback diodes or TVS in solenoid, relay, and motor drive applications. |
| Reverse battery protection on VPWR | Withstands –16 V applied to VPWR without damage or latch-up, meeting ISO 16750-2 automotive requirements. |
Applications
| Automotive Body Control Module (BCM) | Engine Bay Solenoid Driver |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjusters, and interior lighting in modern BCMs. IC Role / Device Role / Timing Role: Octal serial switch providing isolated, fault-monitored power switching for 12 V resistive and inductive loads. Use Value: Reduces MCU GPIO count by 8×, replaces discrete driver arrays, and enables diagnostics via single SPI bus. |
Use Scenario: Driving fuel injectors, purge valves, EGR actuators, and turbocharger vanes in harsh under-hood environments. IC Role / Device Role / Timing Role: High-reliability high-side/low-side switch with –20 V/45 V clamping and 125 °C operation. Use Value: Withstands automotive transients and temperature extremes while delivering precise current-limited actuation. |
| Commercial Vehicle Lighting System | Industrial PLC Output Module |
Use Scenario: Controlling headlamps, fog lamps, brake lights, and turn signals in trucks and buses with CAN-based lighting controllers. IC Role / Device Role / Timing Role: Configurable LED/incandescent lamp driver with open-load detect current disable for low-current LED biasing. Use Value: Enables single-part support for mixed-load types while minimizing standby current in always-on lighting nodes. |
Use Scenario: Replacing electromechanical relays in DIN-rail mounted PLC output cards for factory automation I/O expansion. IC Role / Device Role / Timing Role: Solid-state 8-channel output stage with SPI-configurable drive polarity and built-in short-circuit retry. Use Value: Increases system MTBF, eliminates contact wear, and simplifies diagnostics versus relay-based designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar configurable serial switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33880AEK | 7-channel SPI switch with integrated watchdog timer and enhanced ESD (±2 kV HBM); lacks IN5/IN6 PWM inputs. | Targeted at safety-critical applications requiring ASIL-B capable supervision; not suitable for direct PWM control. | Select MC33880AEK when watchdog monitoring and higher ESD immunity are mandatory, and PWM is handled externally. |
| TPS4H160-Q1 | Quad high-side switch with 160 mΩ RDS(ON), 60 V abs max, but no low-side configuration or open-load detect disable. | Optimized for high-efficiency, high-voltage DC loads (e.g., HVAC blowers); lacks octal density and SPI diagnostics. | Select TPS4H160-Q1 for high-current (>2 A), high-voltage (>40 V) single-polarity applications where diagnostics are secondary. |
Compared with MC33879BPEKR2, MC33880AEK adds watchdog supervision but removes PWM flexibility, while TPS4H160-Q1 offers lower RDS(ON) and higher voltage rating but sacrifices channel count, configurability, and diagnostic depth.
Availability
MC33879BPEKR2 is available at Aetrix Electronics and suitable for automotive body electronics, engine bay actuation, commercial vehicle lighting, and industrial PLC output modules requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified performance.
Supply support for MC33879BPEKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in high-reliability power management ICs.
The MC33879BPEKR2 belongs to NXP's SMARTMOS configurable power switch family, designed specifically for automotive body electronics and industrial control systems requiring robust fault management, SPI configurability, and extended temperature operation.
FAQ
What is the maximum operating voltage for MC33879BPEKR2?
The MC33879BPEKR2 supports a VPWR supply voltage range of –16 V to +45 V, with overvoltage shutdown triggered at 28–33 V depending on variant. This rating accommodates automotive load-dump transients up to 45 V and reverse-battery conditions down to –16 V, ensuring robustness in 12 V and 24 V vehicle systems. The absolute maximum rating is strictly limited to these values per datasheet Table 4.
Does MC33879BPEKR2 support both high-side and low-side switching configurations?
Yes, MC33879BPEKR2 supports fully configurable high-side and low-side switching per channel using its eight pairs of Sx (source) and Dx (drain) pins. Each output can be independently wired as high-side (Sx to load, Dx to battery) or low-side (Dx to load, Sx to ground), enabling flexible implementation in H-bridges, relay drivers, and lamp controls without external components.
How does the open-load detection current disable feature work in MC33879BPEKR2?
The MC33879BPEKR2 allows per-output disabling of the open-load detection current via SPI register programming. When disabled, the IC stops sourcing the ~80 µA diagnostic current into high-side or low-side outputs, reducing total quiescent current - especially valuable in LED biasing or always-on modules where leakage must be minimized. This function is explicitly enabled/disabled in the 16-bit SPI command frame.
What is the purpose of the IN5 and IN6 pins on MC33879BPEKR2?
The IN5 and IN6 pins on MC33879BPEKR2 provide hardware-level PWM override capability for outputs 5 and 6. These inputs are logically OR-ed with their corresponding SPI control bits, allowing a microcontroller to directly modulate duty cycle without SPI transaction overhead. Maximum supported frequency is 2.0 kHz, and the SPI bit for each must be held low to activate IN5/IN6 control.
Is MC33879BPEKR2 pin-compatible with other variants like MC33879TEK or MC33879APEK?
Yes, MC33879BPEKR2 shares identical HSOP32 (SOT1746-1) packaging and pinout with MC33879TEK and MC33879APEK. All variants use the same 32-pin layout, thermal pad, and terminal functions. Differences lie in electrical specifications - notably higher VPWR max (45 V), improved ESD rating (±2 kV HBM), and tighter fault threshold tolerances in the 'B' version - but mechanical and interface compatibility is maintained.
MC33879BPEKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- -
- Number of Outputs:
- -
- Ratio - Input:Output:
- -
- Output Configuration:
- -
- Output Type:
- -
- Interface:
- -
- Voltage - Load:
- -
- Voltage - Supply (Vcc/Vdd):
- -
- Current - Output (Max):
- -
- Rds On (Typ):
- -
- Input Type:
- -
- Features:
- -
- Fault Protection:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC-EP
MC33879BPEKR2 FAQ
1.How can I place an order for MC33879BPEKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33879BPEKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33879BPEKR2 reliable?
The price and inventory of MC33879BPEKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33879BPEKR2 is usually 5 days.
3.What payment methods are accepted for MC33879BPEKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33879BPEKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33879BPEKR2?
MC33879BPEKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33879BPEKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33879BPEKR2?
For technical support, including MC33879BPEKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33879BPEKR2 requirements.
6.How does Aetrix verify that MC33879BPEKR2 is sourced from the original manufacturer or authorized distributors?
All MC33879BPEKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33879BPEKR2 meets industry standards.
7.What is the process for return or replacement of MC33879BPEKR2?
All MC33879BPEKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33879BPEKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33879BPEKR2 part is unused and in its original packaging.
Return procedure for MC33879BPEKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33879BPEKR2 Tags

-
TPS22919DCKR
Texas Instruments

-
MIC2091-1YM5-TR
Microchip Technology

-
MIC2090-1YM5-TR
Microchip Technology

-
TPS22995RZFR
Texas Instruments

-
TPS22975DSGR
Texas Instruments

-
SIP32510DT-T1-GE3
Vishay Siliconix

-
ULN2003D1013TR
STMicroelectronics

-
MIC2005A-1YM5-TR
Microchip Technology

-
MIC2005A-1YM6-TR
Microchip Technology

-
TPS22916BYFPR
Texas Instruments

-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
