My Inquiry
My Account
NXP Semiconductors MC33880DWBR2
- Part No.:
- MC33880DWBR2
- Manufacturer:
- NXP Semiconductors
- Package:
- 32-BSSOP (0.295", 7.50mm Width)
- Datasheet:
-
MC33880DWBR2.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:8 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,402
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33880DWBR2 from NXP Semiconductors (formerly Freescale) is a configurable octal high-side/low-side serial switch IC designed for automotive and industrial load control. It features 8 independently configurable DMOS outputs, 8-bit SPI interface (3.3/5.0 V compatible), ±20 V to +45 V output clamping, 0.55 Ω typical RDS(ON) at 25 °C, and supports PWM direct control on outputs 5 and 6. It drives incandescent lamps and inductive loads in body electronics modules.
For engineers reviewing the MC33880DWBR2 datasheet, MC33880DWBR2 pinout, MC33880DWBR2 application, or MC33880DWBR2 equivalent, this page delivers verified electrical specs, thermal ground pin mapping for SOICW-32, fault reporting behavior via DO pin, and real-world design implications of cascaded fault reporting and independent overtemperature shutdown.
Technical Context
The MC33880DWBR2 integrates SMARTMOS™ 5 technology with CMOS logic, bipolar/MOS analog circuitry, and double-diffused DMOS power transistors. Its architecture enables hardware-configurable high-side or low-side drive per output, with independent current limiting (0.8–2.0 A), open-load detection (0.3–1.0 mA), and fast transient clamping-+45 V for low-side and −20 V for high-side configurations.
It operates across VPWR = 5.5–24.5 V and supports daisy-chained SPI communication with fault status reported synchronously during command write cycles. The EN pin controls internal charge pump activation, and thermal ground pins (TGND at pins 8, 9, 24, 25) are internally connected to the die substrate for enhanced heat dissipation in the 32-pin SOICW package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range (VPWR) | 5.5 V to 24.5 V - supports 12 V and 24 V automotive battery systems with reverse-battery protection. |
| RDS(ON) (typ, 25 °C) | 0.55 Ω - enables <1 W conduction loss at 1.4 A, reducing thermal stress in compact PCB layouts. |
| Output Current Limit | 0.8 A to 2.0 A - programmable per-output current limiting prevents damage during short-circuit events. |
| Output Clamp Voltage | +45 V (low-side), −20 V (high-side) - suppresses inductive kickback without external TVS diodes. |
| SPI Interface Speed | Up to 6.0 MHz - allows sub-10 μs command latency for time-critical load sequencing. |
| Standby Current (IPWR) | 5.0 μA at 13 V, 95 °C - enables ultra-low-power sleep mode in always-on vehicle modules. |
| Thermal Protection | 155–185 °C shutdown with 5–15 °C hysteresis - prevents latch-up during sustained overload conditions. |
Pinout & Package
MC33880DWBR2 uses a 32-pin SOICW (wide-body) package (Case 1324-02) with exposed thermal ground leads. Pins 8, 9, 24, and 25 are TGND - internally tied to the die substrate and must be soldered to PCB ground plane for optimal thermal performance (RθJL = 18 °C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pin 1) | Digital ground reference | Reference for logic signals; must be low-impedance connection to system ground. |
| VDD (Pin 2) | Logic supply input | 5.0 V ±5% supply; undervoltage lockout triggers below 3.9 V to force safe shutdown. |
| S1–S8 (Pins 3–4, 6, 10, 13, 18, 20, 27, 29–30) | Source terminals for DMOS outputs | Connected to load (high-side) or GND (low-side); configuration determines drive topology. |
| D1–D8 (Pins 5, 7, 11, 12, 19, 22, 26, 28) | Drain terminals for DMOS outputs | Connected to battery (low-side) or load (high-side); clamp voltage limits inductive transients. |
| IN5 / IN6 (Pins 14, 17) | PWM direct control inputs | OR-gated with SPI bits; enable 2 kHz PWM dimming for outputs 5 and 6 without MCU SPI overhead. |
| EN (Pin 15) | Charge pump enable | Must be high to activate gate drivers, fault detection, and diagnostics; tie to VDD if unused. |
| CS / SCLK / DI / DO (Pins 16, 18, 19, 32) | SPI interface signals | Full-duplex 8-bit SPI; DO reports fault status bit-by-bit synchronized to SCLK rising edge. |
| VPWR (Pin 31) | Main power supply input | Supplies power stage; includes internal reverse-battery protection up to −16 V. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware-configurable high/low-side outputs | Each of 8 outputs can be individually wired as high-side or low-side driver without firmware change. |
| Cascadable fault reporting | Single DO pin reports faults across multiple daisy-chained MC33880DWBR2 devices using shared SPI bus. |
| Independent output shutdown | Any output can be disabled via SPI without affecting others - critical for fail-safe redundancy in lighting clusters. |
| Thermal ground-enhanced package | Four dedicated TGND pins (8, 9, 24, 25) reduce junction-to-PCB thermal resistance to 18 °C/W. |
| Open-load and short-circuit detection | Detects off-state open loads (0.3–1.0 mA) and on-state shorts simultaneously with current limiting. |
Applications
| Automotive Body Control Module (BCM) | Industrial PLC Output Stage |
|---|---|
Use Scenario: Controlling door locks, interior lamps, and mirror heaters in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Octal serial switch replacing discrete relays and MOSFET drivers; SPI enables centralized MCU control with diagnostic feedback. Use Value: Reduces BOM count by 8× vs. discrete solutions while providing per-channel fault logging and thermal derating. |
Use Scenario: Driving solenoids, valves, and indicator lamps in DIN-rail mounted industrial controllers. IC Role / Device Role / Timing Role: High-reliability load interface with built-in overtemperature and open-load detection for unattended operation. Use Value: Eliminates need for external current-sense resistors and thermal sensors, lowering system cost and board area. |
| Truck Trailer Lighting Controller | Off-Highway Equipment Harness Management |
Use Scenario: Managing brake lights, turn signals, and marker lamps across long cable runs with high EMI exposure. IC Role / Device Role / Timing Role: Low-side switch with +45 V clamp protects against inductive spikes from long-wire inductive loads. Use Value: Prevents external TVS diode requirements and improves EMC robustness in ISO 16750-compliant designs. |
Use Scenario: Centralized control of hydraulic valves, cab lighting, and HVAC actuators in construction and agricultural machinery. IC Role / Device Role / Timing Role: Configurable high/low-side driver supporting mixed load types (incandescent, LED, solenoid) on single PCB. Use Value: Enables one hardware design to support multiple vehicle variants via pin-strapping and firmware configuration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal serial switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS4H160-Q1 | 4-channel, higher RDS(ON) (1.2 Ω), integrated diagnostics but no PWM direct control pins. | Targeted at ASIL-B safety-critical subsystems; lacks cascaded fault reporting. | Choose when functional safety certification (ISO 26262) is required and channel count permits consolidation. |
| STSPIN840 | 8-channel, 40 V max VPWR, no thermal ground pins, lower current limit (1.2 A), no open-load detect. | Optimized for stepper motor phase control; lacks automotive-grade clamping and fault granularity. | Prefer for cost-sensitive non-automotive motion control where thermal performance is less critical. |
Compared with TPS4H160-Q1 and STSPIN840, the MC33880DWBR2 uniquely combines 8-channel configurability, daisy-chain fault reporting, thermal ground optimization, and dual-mode (SPI + PWM) control - making it the only option supporting legacy BCM architectures requiring per-output diagnostics and high-temperature reliability without safety certification overhead.
Availability
MC33880DWBR2 is available at Aetrix Electronics and suitable for automotive body electronics, industrial PLC output stages, and off-highway equipment harness management requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC33880DWBR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and scalable silicon solutions.
The MC33880DWBR2 belongs to NXP's SMARTMOS™ power switch product line, engineered specifically for robust, high-diagnostic automotive load control with minimal external components and extended thermal survivability.
FAQ
What is the maximum operating temperature for the MC33880DWBR2?
The MC33880DWBR2 has an operating junction temperature range of −40 °C to +150 °C, with overtemperature shutdown triggered between 155 °C and 185 °C. Its 32-pin SOICW package includes four thermal ground pins (8, 9, 24, 25) that reduce thermal resistance to 18 °C/W when soldered to a PCB ground plane - enabling reliable operation at full load in under-hood environments. The MC33880DWBR2 maintains specified RDS(ON) and current-limit performance up to 125 °C case temperature.
How does the MC33880DWBR2 handle inductive load switching transients?
The MC33880DWBR2 integrates internal voltage clamps: +45 V (typical) for low-side drive and −20 V (typical) for high-side drive, measured at 10 mA and −30 mA test currents respectively. These clamps suppress inductive kickback without external TVS diodes, protecting both the IC and downstream circuitry. The clamping energy rating is 50 mJ per pulse at 150 °C junction temperature. This capability is confirmed in the device's Electrical Characteristics tables and validated in Figure 12–19 of the official datasheet for MC33880DWBR2.
Can the MC33880DWBR2 be used in daisy-chain SPI configurations?
Yes, the MC33880DWBR2 supports daisy-chain SPI operation using its DO (data out) pin, which reports fault status synchronously during command writes. In daisy-chain mode, the DO of one MC33880DWBR2 connects to the DI of the next, with shared SCLK and CS lines. Each device shifts out its 8-bit fault word while receiving the next command word - enabling centralized fault monitoring across multiple ICs with minimal MCU GPIO usage. This behavior is explicitly documented in Figures 22 and 24 of the MC33880DWBR2 datasheet.
What is the purpose of the TGND pins on the MC33880DWBR2?
The TGND pins (8, 9, 24, 25) on the MC33880DWBR2 are internal connections to the die substrate, optimized for heat transfer rather than signal integrity. When soldered to a large PCB copper pour or ground plane, they reduce junction-to-lead thermal resistance to 18 °C/W - significantly improving power dissipation capability over standard SOICW packages. This thermal design is essential for sustaining 2.0 A output current at elevated ambient temperatures. The MC33880DWBR2 datasheet specifies mandatory PCB layout guidelines for TGND connections in Section "PIN CONNECTIONS".
Does the MC33880DWBR2 support PWM dimming for all eight outputs?
No - the MC33880DWBR2 supports direct PWM control only on outputs 5 and 6 via dedicated IN5 and IN6 pins, which are OR-gated with their corresponding SPI bits. This allows hardware-level PWM dimming (up to 2.0 kHz) without consuming MCU SPI bandwidth or CPU cycles. All other outputs (1–4, 7–8) are controlled exclusively via SPI commands. This selective PWM capability is defined in the "COMMAND INPUT (IN5 AND IN6)" section of the MC33880DWBR2 functional description and confirmed in Table 2 (32-pin definitions).
MC33880DWBR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-BSSOP (0.295", 7.50mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Switch Type:
- General Purpose
- Number of Outputs:
- 8
- Ratio - Input:Output:
- 1:8
- Output Configuration:
- High Side or Low Side
- Output Type:
- N-Channel
- Interface:
- SPI
- Voltage - Load:
- 5.5V ~ 24.5V
- Voltage - Supply (Vcc/Vdd):
- 4.75V ~ 5.25V
- Current - Output (Max):
- 800mA
- Rds On (Typ):
- 550mOhm
- Input Type:
- -
- Features:
- -
- Fault Protection:
- Current Limiting (Fixed), Open Load Detect, Over Voltage
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOIC
MC33880DWBR2 FAQ
1.How can I place an order for MC33880DWBR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33880DWBR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33880DWBR2 reliable?
The price and inventory of MC33880DWBR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33880DWBR2 is usually 5 days.
3.What payment methods are accepted for MC33880DWBR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33880DWBR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33880DWBR2?
MC33880DWBR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33880DWBR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33880DWBR2?
For technical support, including MC33880DWBR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33880DWBR2 requirements.
6.How does Aetrix verify that MC33880DWBR2 is sourced from the original manufacturer or authorized distributors?
All MC33880DWBR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33880DWBR2 meets industry standards.
7.What is the process for return or replacement of MC33880DWBR2?
All MC33880DWBR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33880DWBR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33880DWBR2 part is unused and in its original packaging.
Return procedure for MC33880DWBR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33880DWBR2 Tags
-
TPS22919DCKR
Texas Instruments
-
MIC2091-1YM5-TR
Microchip Technology
-
MIC2090-1YM5-TR
Microchip Technology
-
TPS22995RZFR
Texas Instruments
-
TPS22975DSGR
Texas Instruments
-
SIP32510DT-T1-GE3
Vishay Siliconix
-
ULN2003D1013TR
STMicroelectronics
-
MIC2005A-1YM5-TR
Microchip Technology
-
MIC2005A-1YM6-TR
Microchip Technology
-
TPS22916BYFPR
Texas Instruments
-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
