NXP Semiconductors MC33GD3000EPR2
- Part No.:
- MC33GD3000EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Motor Drivers, Controllers
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33GD3000EPR2.pdf
- Description:
- IC MOTOR DRIVER 6V-58V 56QFN
- Quantity:
- Payment:

- Shipping:

Inventory:1,977
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Product details
Overview
MC33GD3000EPR2 from NXP Semiconductors is a three-phase FET predriver IC for automotive motor control, integrating six independent gate drivers (three high-side and three low-side), SPI-configurable dead time, 15 V regulated VLS supply, 1.0–2.5 A peak gate drive strength, and AEC-Q100 Grade 1 qualification. It interfaces directly with MCUs in electric power steering and belt starter generator systems.
For engineers reviewing the MC33GD3000EPR2 datasheet, MC33GD3000EPR2 pinout, MC33GD3000EPR2 application, or MC33GD3000EPR2 equivalent, key selection considerations include bootstrap-capable high-side drive up to 75 V, integrated current-sensing amplifier with programmable overcurrent threshold, 3.0–5.0 V logic compatibility, and HVQFN56 thermal-enhanced packaging for high-power density motor control designs.
Technical Context
The MC33GD3000EPR2 implements SMARTMOS technology with independent high- and low-side driver stages per phase, each featuring low-impedance gate outputs (≤1 Ω typical) and built-in protection against reverse charge injection from external FETs' CGD/CGS. Its internal 15 V VLS regulator powers all gate drives and bootstrap circuits.
Functional safety is supported via dual enable inputs (EN1/EN2 AND-gated), asynchronous reset (RST_B), fault-interrupt output (INT), and configurable SPI masking of overcurrent, desaturation, and thermal events. The device operates across 6.0–60 V VPWR and is fully specified from 8.0–40 V for 12 V and 24 V automotive systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Range | 6.0 V to 60 V VPWR - supports 12 V and 48 V battery architectures without external regulators |
| Gate Drive Strength | 1.0 A to 2.5 A peak - sufficient to drive high-Ciss FETs (e.g., ≤4 mΩ Rds(on)) requiring >400 nC gate charge |
| VLS Output Voltage | 13.5 V to 17 V - regulated 15 V supply for low-side drivers and high-side bootstrap sources |
| SPI Interface | Up to 5.0 MHz clock - enables real-time dead time programming and safe simultaneous output commands |
| AEC-Q100 Grade | Grade 1 (–40 °C to +125 °C ambient) - qualified for under-hood automotive applications including EPS and BSG |
| Bootstrap Voltage | 22 V to 32 V (VSUP = 14 V) - ensures reliable high-side FET turn-on even during cold-crank conditions |
| Overcurrent Sensing | Programmable threshold via OC_TH pin - enables precise current-limit tuning for motor phase protection |
Pinout & Package
HVQFN56 package (8 mm × 8 mm × 0.9 mm body, 0.5 mm pitch, exposed thermal pad EP). Pin count: 56 terminals. Thermal resistance RθJC = 3.0 °C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PA_HS_G, PB_HS_G, PC_HS_G | High-side gate drive outputs | Low-impedance pulsed outputs limited to ~15 V above respective HS source; resist negative current transients |
| PA_LS_G, PB_LS_G, PC_LS_G | Low-side gate drive outputs | 1.0–2.5 A capable outputs referenced to VSS; designed for fast switching of low-Rds(on) FETs |
| PA_BOOT, PB_BOOT, PC_BOOT | Bootstrap capacitor inputs | Analog inputs for external bootstrap capacitors; voltage clamped to ~15 V; require 10×–20× FET gate capacitance |
| VPWR, VSUP, VLS, VDD | Power supply inputs/outputs | VPWR powers internal regulators; VSUP references phase comparators; VLS = 15 V gate drive rail; VDD = 5.0 V logic rail |
| EN1, EN2, RST_B, CS_B | Digital control inputs | AND-gated enables (EN1/EN2) force all outputs off; RST_B resets logic; CS_B frames SPI commands |
| AMP_P, AMP_N, AMP_OUT, OC_TH, OC_OUT | Current sensing interface | Differential amplifier inputs feed overcurrent comparator; OC_TH sets trip threshold; OC_OUT provides fault flag |
Key Features
| Feature | Design Value |
|---|---|
| Programmable dead time | Configured via SPI register - prevents shoot-through in three-phase inverter bridges without MCU timing overhead |
| Integrated current sense amplifier | Single-ended output (AMP_OUT) with differential inputs (AMP_P/AMP_N) - enables inline shunt-based motor phase current monitoring |
| Trickle charge pump | Internal steady-state bootstrap charging - maintains high-side gate voltage during 100 % duty cycle operation |
| Dual enable architecture | EN1 and EN2 must both be high - adds functional safety layer for fail-safe gate drive disable in critical systems |
| Reverse charge injection protection | Hardened input structures on HS/LS control pins - prevents latch-up or false triggering from FET Miller feedback |
Applications
| Cooling Fan Control | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Variable-speed 12 V/24 V brushless DC cooling fan in engine bay or battery thermal management system. IC Role / Device Role / Timing Role: Three-phase predriver generating synchronized high- and low-side gate signals with programmable dead time and overcurrent shutdown. Use Value: Enables compact, thermally efficient fan module design with integrated fault reporting via INT pin and SPI-configurable protection thresholds. | Use Scenario: Torque-assist motor control in column- or rack-mounted EPS systems requiring ASIL-B compliance support. IC Role / Device Role / Timing Role: Gate driver interfacing MCU PWM outputs to 40–80 V MOSFET half-bridges; monitors phase current via integrated amplifier for torque loop feedback. Use Value: Reduces external component count by eliminating discrete current sense amplifiers and bootstrap diodes while maintaining AEC-Q100 Grade 1 operation at 125 °C ambient. |
| Belt Starter Generator (BSG) | Water Pump Control |
Use Scenario: 48 V mild-hybrid BSG unit performing engine cranking, regenerative braking, and torque assist functions. IC Role / Device Role / Timing Role: High-voltage three-phase predriver managing bidirectional energy flow between motor and 48 V bus; supports high-frequency PWM for smooth torque transitions. Use Value: Withstands ISO 7637 load dump transients up to 80 V and delivers 2.5 A peak drive to handle high-Ciss SiC or GaN FETs used in compact BSG inverters. | Use Scenario: Electric coolant pump in EV thermal management systems operating continuously at elevated temperatures. IC Role / Device Role / Timing Role: Pre-driver enabling field-oriented control (FOC) with precise phase voltage sensing (PHASEA/B/C) and real-time overtemperature response via T-LIM detection. Use Value: Integrated VLS regulator and thermal shutdown (T-LIM) simplify power delivery and enhance reliability in sealed, high-ambient-temperature pump housings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar three-phase gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPQ6532-AEC1 | Integrated 65 V half-bridge drivers with embedded current sense; no SPI configuration; fixed dead time | Lacks programmable dead time and phase comparator outputs; suited for simpler BLDC commutation only | Choose MPQ6532-AEC1 when SPI configurability and PHASEx feedback are unnecessary and board space is constrained |
| UCC27211A-Q1 | Dual high-/low-side driver (not three-phase); 4 A peak drive; no integrated regulators or current sense | Requires external bootstrap, VDD, and current sensing circuitry; needs three ICs for full three-phase implementation | Choose UCC27211A-Q1 when maximum drive strength (4 A) is required per channel and system-level integration is handled externally |
Compared with MPQ6532-AEC1 and UCC27211A-Q1, the MC33GD3000EPR2 uniquely combines SPI-programmable timing, integrated VLS/VDD regulation, and three-phase current sensing in a single AEC-Q100 Grade 1 package-reducing BOM count and layout complexity for automotive inverter modules.
Availability
MC33GD3000EPR2 is available at Aetrix Electronics and suitable for electric power steering, belt starter generator, and cooling fan control applications requiring stable component supply across extended automotive temperature ranges and long production lifecycles.
Supply support for MC33GD3000EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MC33GD3000EPR2 belongs to NXP's S32K-adjacent analog power driver portfolio, engineered specifically for AEC-Q100-compliant three-phase motor control in safety-critical automotive subsystems such as EPS, BSG, and thermal management.
FAQ
What is the maximum bootstrap voltage supported by the MC33GD3000EPR2?
The MC33GD3000EPR2 supports a bootstrap voltage (VBOOT) of 22 V to 32 V when VSUP = 14 V, with absolute maximum rating of 75 V on high-side gate outputs. This allows robust high-side FET turn-on under cold-crank and load-dump conditions common in automotive 12 V systems. The internal clamp limits voltage across the bootstrap capacitor to approximately 15 V relative to the high-side source.
Does the MC33GD3000EPR2 require external bootstrap diodes?
No, the MC33GD3000EPR2 does not require external bootstrap diodes. Its internal trickle charge pump and integrated high-side driver architecture eliminate the need for discrete bootstrap diodes. The device uses external bootstrap capacitors (e.g., 10×–20× FET gate capacitance) connected between PA_BOOT/VSUP, PB_BOOT/VSUP, and PC_BOOT/VSUP - with internal circuitry managing charge replenishment during continuous conduction.
How is overcurrent protection implemented in the MC33GD3000EPR2?
The MC33GD3000EPR2 implements overcurrent protection using an integrated current-sensing amplifier with differential inputs (AMP_P/AMP_N) and a dedicated comparator. The OC_TH pin sets the overcurrent threshold voltage, and the OC_OUT pin provides a totem-pole logic output indicating fault condition. Faults can be masked or cleared via SPI commands, and the INT pin asserts a hardware interrupt for immediate MCU response.
Can the MC33GD3000EPR2 drive SiC or GaN FETs?
Yes, the MC33GD3000EPR2 can drive SiC and GaN FETs in three-phase configurations. Its 2.5 A peak gate drive strength, <1 Ω output impedance, and 75 V absolute maximum gate-source voltage rating accommodate the higher gate charge and faster switching requirements of wide-bandgap devices. Designers must ensure proper PCB layout for gate loop inductance and verify bootstrap operation under high dV/dt conditions.
What is the purpose of the PHASEA, PHASEB, and PHASEC pins on the MC33GD3000EPR2?
The PHASEA, PHASEB, and PHASEC pins on the MC33GD3000EPR2 are totem-pole comparator outputs that indicate whether the respective high-side FET source voltage is below 50 % of VSUP. These signals provide real-time feedback on high-side conduction state and are used for commutation timing, desaturation detection, and closed-loop control - enabling advanced motor control algorithms like six-step or field-oriented control without external comparators.
MC33GD3000EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Motor Type - Stepper:
- -
- Motor Type - AC, DC:
- -
- Function:
- Controller - Commutation, Direction Management
- Output Configuration:
- Half Bridge (3)
- Interface:
- SPI
- Technology:
- Power MOSFET
- Step Resolution:
- -
- Applications:
- -
- Current - Output:
- -
- Voltage - Supply:
- 6V ~ 58V
- Voltage - Load:
- 6V ~ 58V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-QFN (8x8)
MC33GD3000EPR2 FAQ
1.How can I place an order for MC33GD3000EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33GD3000EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33GD3000EPR2 reliable?
The price and inventory of MC33GD3000EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33GD3000EPR2 is usually 5 days.
3.What payment methods are accepted for MC33GD3000EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33GD3000EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33GD3000EPR2?
MC33GD3000EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33GD3000EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33GD3000EPR2?
For technical support, including MC33GD3000EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33GD3000EPR2 requirements.
6.How does Aetrix verify that MC33GD3000EPR2 is sourced from the original manufacturer or authorized distributors?
All MC33GD3000EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33GD3000EPR2 meets industry standards.
7.What is the process for return or replacement of MC33GD3000EPR2?
All MC33GD3000EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33GD3000EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33GD3000EPR2 part is unused and in its original packaging.
Return procedure for MC33GD3000EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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