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NXP Semiconductors MC33HB2000AES
- Part No.:
- MC33HB2000AES
- Manufacturer:
- NXP Semiconductors
- Category:
- Motor Drivers, Controllers
- Package:
- 28-VQFN Exposed Pad
- Datasheet:
-
MC33HB2000AES.pdf
- Description:
- H-BRIDGE, SPI, BRUSHED DC MOTOR
- Quantity:
- Payment:
- Shipping:
Inventory:4,308
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Product details
Overview
MC33HB2000AES from NXP Semiconductors is a SMARTMOS monolithic H-bridge power IC with SPI programmability, designed for brushed DC motor control in automotive applications. It delivers 10 A peak output current, supports 5.0–28 V VPWR operation, features <5.0 % error current mirror feedback (CFB), and achieves 0.39 °C/W junction-to-case thermal resistance via its exposed-pad HVQFN package.
For engineers reviewing the MC33HB2000AES datasheet, MC33HB2000AES pinout, MC33HB2000AES application, or MC33HB2000AES equivalent, this page provides verified technical context, validated pin functions, confirmed thermal performance metrics for 28-pin HVQFN, and real-world diagnostic and control capabilities aligned with ISO 26262 ASIL-B requirements.
Technical Context
The MC33HB2000AES implements a full H-bridge topology using four integrated N-channel MOSFETs with RDS(on) ≤ 235 mΩ at TJ = 150 °C. Its SPI interface enables dynamic configuration of eight slew rates (0.25–16 V/μs) and four current limits (5.4/7.0/8.8/10.7 A), directly affecting EMI behavior and thermal dissipation during PWM-driven motor commutation.
Diagnostic architecture includes per-output short-to-ground/VPWR detection, open-load sensing, overtemperature warning and shutdown, charge pump undervoltage monitoring, and VPWR over/undervoltage reporting-all accessible via 16-bit SPI fault register reads. The CFB pin provides real-time analog current feedback at 0.25 % of load current with ≤5.0 % gain error across 2–10 A.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Output Current | 16 A transient (<5 ms), enabling robust surge handling during motor stall or startup |
| Continuous Average Load Current | 3.0 A nominal, defining steady-state thermal design envelope for PCB layout |
| VPWR Operating Range | 5.0 V to 28 V, supporting 12 V and 24 V automotive battery systems with 40 V transient tolerance |
| Junction-to-Case Thermal Resistance | 0.39 °C/W (bottom), enabling high-power dissipation with minimal ΔT between die and heatsink pad |
| Current Mirror Accuracy | <5.0 % error from 2 A to 10 A, allowing reliable closed-loop current regulation without external shunt |
| SPI Frequency Range | 0.5 MHz to 10 MHz, ensuring compatibility with standard automotive microcontrollers and daisy-chain configurations |
| AEC-Q100 Grade | Grade 1 (−40 °C to +125 °C ambient), qualifying for powertrain and chassis control modules |
| ISO 26262 Compliance | Designed to support ASIL-B system-level safety goals via integrated diagnostics and fault reporting |
Pinout & Package
The MC33HB2000AES uses a 28-pin HVQFN package with an exposed thermal pad (EP), optimized for low-inductance power routing and efficient heat transfer to the PCB ground plane. Pin pitch is 0.5 mm; body size is 5 mm × 5 mm × 1 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT1 / OUT2 | H-bridge power outputs | Each pair drives one motor terminal; configured as half-bridge sources/sinks with independent control via IN1/IN2 |
| IN1 / IN2 | Digital input controls | Direct logic-level H-bridge direction control; compatible with 3.3 V/5 V MCU I/O; no shoot-through due to internal interlock |
| ENBL | Enable input | Logic HIGH activates full functionality; LOW forces Sleep mode with 50 μA VPWR supply current |
| DIS | Disable input | Logic HIGH places outputs in high-impedance Standby mode while retaining SPI and diagnostic activity |
| CFB | Analog current feedback | Provides 0.25 % of high-side load current; requires external resistor to convert to voltage for ADC sampling |
| CS_B / SCLK / MOSI / MISO | SPI interface | Full-duplex 16-bit slave interface; supports daisy-chaining; MISO rail-to-rail output referenced to VDDQ |
| VPWR | Main power supply | Connects to battery rail; four pins required for low-impedance path; withstands 40 V transients |
| AGND / DGND / PGND / EP | Ground domains | Must be tied together with low-impedance copper; EP soldered to large thermal pad for thermal management |
Key Features
| Feature | Design Value |
|---|---|
| SPI-configurable slew rate | Eight discrete settings (0.25–16 V/μs) allow precise trade-off between EMI suppression and switching loss reduction |
| Programmable current limit | Four thresholds (5.4/7.0/8.8/10.7 A) enable application-specific overload protection without hardware changes |
| Integrated current mirror | Real-time analog feedback with ≤5.0 % error eliminates need for external shunt resistor and associated PCB area |
| Thermal resistance optimization | 0.39 °C/W junction-to-case (bottom) enables >3 W continuous dissipation on standard 4-layer boards |
| Automotive-grade protection | Per-output short-to-ground/VPWR detection, open-load sensing, and overtemperature warning meet AEC-Q100 and ISO 26262 requirements |
| Flexible operation modes | Supports SPI-less default operation (2.0 V/μs slew, 7.0 A limit) for rapid prototyping or simplified designs |
Applications
| Electronic Throttle Control | Exhaust Gas Recirculation (EGR) |
|---|---|
Use Scenario: Precise angular positioning of throttle valve plates in gasoline engines under varying intake manifold pressure and temperature. IC Role / Device Role / Timing Role: H-bridge driver executing bidirectional PWM-controlled torque delivery to a 12 V brushed DC actuator motor. Use Value: Enables closed-loop position control using CFB feedback and SPI-reported faults, meeting ASIL-B functional safety targets for drivetrain response. | Use Scenario: Regulating exhaust gas flow into intake manifold to reduce NOx emissions in diesel and gasoline direct-injection engines. IC Role / Device Role / Timing Role: Bidirectional motor driver controlling rotary EGR valve actuation with real-time current monitoring and thermal derating. Use Value: Delivers 10 A peak current for fast valve movement while maintaining <5.0 % current sense accuracy for diagnostic compliance. |
| Turbocharger Wastegate Actuation | Electric Coolant Pump Control |
Use Scenario: Adjusting turbocharger boost pressure by rotating wastegate flaps against high-temperature exhaust backpressure. IC Role / Device Role / Timing Role: High-reliability H-bridge driver operating in harsh under-hood environments with extended temperature cycling. Use Value: Leverages AEC-Q100 Grade 1 qualification and 150 °C junction rating to sustain operation where ambient exceeds 105 °C. | Use Scenario: Variable-speed coolant circulation in electric and hybrid powertrains to maintain optimal battery and power electronics temperatures. IC Role / Device Role / Timing Role: SPI-programmable motor controller adapting speed/torque profiles based on thermal sensor inputs and vehicle operating mode. Use Value: Uses eight slew-rate options to minimize conducted EMI in high-density EV power modules near sensitive analog sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar H-bridge motor driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33HB2000EK | 32-pin SOICW exposed pad; higher RΘJA (23.9 °C/W on 4-layer board) vs. MC33HB2000AES (31.3 °C/W); same electrical specs | Better suited for through-hole prototyping or legacy board designs requiring SOIC footprint | Select when mechanical compatibility with existing SOIC layouts is required and thermal margin allows higher RΘJA |
| MC33HB2000FK | 32-pin PQFN exposed pad; lowest RΘJA (21.55 °C/W on 4-layer board); identical functional spec and pinout mapping to MC33HB2000AES | Preferred for space-constrained, high-power-density automotive modules needing maximum thermal efficiency | Choose when PCB layout permits PQFN and thermal performance is prioritized over HVQFN's smaller footprint |
Compared with MC33HB2000EK and MC33HB2000FK, the MC33HB2000AES offers the smallest PCB footprint (5 mm × 5 mm) and best junction-to-case thermal resistance (0.39 °C/W), making it optimal for compact, thermally demanding automotive actuators where board area is constrained but thermal mass is limited.
Availability
MC33HB2000AES is available at Aetrix Electronics and suitable for electronic throttle control, exhaust gas recirculation (EGR), and turbocharger wastegate actuation requiring stable component supply across automotive production lifecycles.
Supply support for MC33HB2000AES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade power management and functional safety.
The MC33HB2000AES belongs to NXP's SMARTMOS H-bridge product line, engineered specifically for ISO 26262-compliant brushed DC motor control in powertrain and chassis systems where reliability, diagnostic coverage, and thermal resilience are critical.
FAQ
What is the maximum continuous current rating for the MC33HB2000AES?
The MC33HB2000AES has a nominal continuous average load current rating of 3.0 A. This value defines the thermal design baseline for sustained operation under typical ambient conditions and PCB layout assumptions. Peak current capability remains at 16 A for transients under 5 ms, enabling robust handling of motor startup surges and stall events without triggering current-limit protection.
How does the CFB pin on the MC33HB2000AES provide current feedback?
The CFB pin on the MC33HB2000AES delivers a ground-referenced analog signal equal to 0.25 % of the high-side output current (e.g., 2.5 mA at 1 A load). With ≤5.0 % gain error across 2–10 A, it enables accurate closed-loop current regulation. An external resistor converts CFB current to voltage for MCU ADC sampling; a capacitor filters high-frequency noise without degrading bandwidth.
Can the MC33HB2000AES operate without an SPI interface?
Yes, the MC33HB2000AES can operate without SPI: it defaults to a 2.0 V/μs slew rate and 7.0 A current limit threshold. All parallel control inputs (ENBL, DIS, IN1, IN2) remain fully functional. SPI is optional for advanced configuration-diagnostics, fine-grained current limiting, and slew rate tuning-but not required for basic H-bridge operation or fault reporting via FS_B.
What thermal resistance values apply to the MC33HB2000AES package?
The MC33HB2000AES (28-pin HVQFN) has documented thermal resistances including RΘJCBOTTOM = 0.39 °C/W (junction-to-case bottom), RΘJB = 11.3 °C/W (junction-to-board), and RΘJA = 31.3 °C/W on a 4-layer board. These values are measured per JEDEC JESD51 standards and confirm superior thermal coupling to the PCB compared to SOICW and PQFN variants of the same family.
Which automotive safety standards does the MC33HB2000AES support?
The MC33HB2000AES is designed to support ISO 26262 ASIL-B system-level safety goals. It achieves this through integrated diagnostics-including per-output short-circuit detection, open-load sensing, overtemperature warning/shutdown, and VPWR monitoring-as well as AEC-Q100 Grade 1 qualification (−40 °C to +125 °C ambient) and robust EMC behavior enabled by SPI-configurable slew rates.
MC33HB2000AES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 28-VQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Motor Type - Stepper:
- Bipolar
- Motor Type - AC, DC:
- Brushed DC
- Function:
- Driver - Fully Integrated, Control and Power Stage
- Output Configuration:
- Half Bridge (2)
- Interface:
- SPI
- Technology:
- CMOS
- Step Resolution:
- -
- Applications:
- DC Motors
- Current - Output:
- 10A
- Voltage - Supply:
- 5V ~ 28V
- Voltage - Load:
- 5V ~ 28V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 28-HVQFN (6x6)
MC33HB2000AES FAQ
1.How can I place an order for MC33HB2000AES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33HB2000AES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33HB2000AES reliable?
The price and inventory of MC33HB2000AES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33HB2000AES is usually 5 days.
3.What payment methods are accepted for MC33HB2000AES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33HB2000AES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33HB2000AES?
MC33HB2000AES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33HB2000AES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33HB2000AES?
For technical support, including MC33HB2000AES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33HB2000AES requirements.
6.How does Aetrix verify that MC33HB2000AES is sourced from the original manufacturer or authorized distributors?
All MC33HB2000AES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33HB2000AES meets industry standards.
7.What is the process for return or replacement of MC33HB2000AES?
All MC33HB2000AES units undergo pre-shipment inspection (PSI). If there is an issue with MC33HB2000AES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33HB2000AES part is unused and in its original packaging.
Return procedure for MC33HB2000AES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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