My Inquiry
My Account
NXP Semiconductors MC33HB2000ES
- Part No.:
- MC33HB2000ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Motor Drivers, Controllers
- Package:
- 28-VQFN Exposed Pad
- Datasheet:
-
MC33HB2000ES.pdf
- Description:
- IC HALF BRIDGE DRIVER 3A 28HVQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,959
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33HB2000ES from NXP Semiconductors is a SMARTMOS monolithic H-bridge power IC for brushed DC and servo motor control, featuring SPI programmability, 10 A peak output current, <5.0 % current-sense error via CFB pin, and AEC-Q100 Grade 1 qualification for automotive use in throttle and EGR actuators.
For engineers reviewing the MC33HB2000ES datasheet, MC33HB2000ES pinout, MC33HB2000ES application, or MC33HB2000ES equivalent, key selection criteria include configurable slew rates (0.25–16 V/μs), four SPI-selectable current limits (5.4/7.0/8.8/10.7 A), integrated overtemperature/short-circuit diagnostics, and HVQFN-28 exposed-pad thermal performance (RΘJC = 0.39 °C/W).
Technical Context
The MC33HB2000ES integrates dual N-channel MOSFET half-bridges with programmable gate drive slew rates to balance EMI suppression and switching loss. Its SPI interface enables real-time configuration of current limits, fault masking, and H-bridge/half-bridge mode selection without requiring external logic.
Diagnostic architecture includes per-output short-to-ground/VPWR detection, open-load sensing, charge pump undervoltage monitoring, and thermal warning/shutdown-each reported via 16-bit fault register accessible through MISO. The CFB pin delivers 0.25 % of high-side load current with ≤5.0 % gain error across 2–10 A, supporting closed-loop current control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Output Current | 16 A transient (<5 ms), enabling robust start-up torque for automotive actuators |
| Continuous Average Load Current | 3.0 A at rated thermal conditions, defining steady-state motor drive capability |
| RDS(on) per MOSFET | Max 235 mΩ at TJ = 150 °C, minimizing conduction loss and heat generation |
| Supply Voltage Range | 5.0 V to 28 V VPWR, supporting 12 V/24 V automotive battery systems with 40 V transient tolerance |
| Current Sense Accuracy | <5.0 % error on CFB analog feedback signal, enabling precise real-time current regulation |
| Slew Rate Options | 8 SPI-selectable values from 0.25 V/μs to >16 V/μs, allowing EMI vs. thermal trade-off tuning |
| Operating Junction Temp | −40 °C to 150 °C continuous, meeting ASIL-B functional safety requirements per ISO 26262 |
Pinout & Package
MC33HB2000ES uses a 28-pin HVQFN package with exposed thermal pad (EP), optimized for high-power density and low junction-to-case thermal resistance (0.39 °C/W). Pin layout supports compact PCB routing with dedicated AGND/DGND/PGND separation and VPWR plane integration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT1 / OUT2 | H-bridge power outputs | Drive bi-directional brushed DC motor windings; each pair forms half-bridge with internal N-MOSFETs |
| IN1 / IN2 | Digital direction control inputs | Direct PWM logic to low-side FETs; prevent shoot-through via hardware interlock |
| ENBL | Global enable input | Logic HIGH activates full functionality; LOW forces tri-state outputs and Sleep mode (50 μA IVPWR) |
| DIS | Output disable input | Logic HIGH places outputs in tri-state Standby mode while retaining SPI and logic operation |
| CFB | Analog current feedback output | Provides 0.25 % of high-side load current (2–10 A range) with ≤5.0 % gain error for closed-loop control |
| FS_B | Open-drain fault status flag | Active-low signal indicating masked/unmasked faults (overtemp, short, open load, UV/OV) |
| MOSI / MISO / SCLK / CS_B | SPI interface signals | 16-bit daisy-chainable slave interface for configuration, diagnostics, and register access |
| VPWR / PGND / AGND / DGND / EP | Power and ground terminals | Multi-ground architecture minimizes noise coupling; EP must be soldered to large copper pour for thermal management |
Key Features
| Feature | Design Value |
|---|---|
| SPI-configurable slew rate | Eight discrete settings (0.25–16 V/μs) directly tune EMI emissions and switching losses |
| Programmable current limiting | Four thresholds (5.4/7.0/8.8/10.7 A) enable application-specific overload protection |
| Integrated diagnostic reporting | Per-output short-to-ground/VPWR, open-load, thermal warning, and charge pump UV/OV detection |
| High-accuracy current mirror | CFB output delivers 0.25 % of load current with ≤5.0 % error across 2–10 A for analog feedback |
| Automotive-grade thermal design | RΘJC = 0.39 °C/W (HVQFN) enables >3 A continuous operation without forced air cooling |
Applications
| Electronic Throttle Control | Exhaust Gas Recirculation (EGR) |
|---|---|
Use Scenario: Precise angular positioning of throttle valve in gasoline engines under varying load and temperature. IC Role / Device Role / Timing Role: H-bridge driver executing PWM-controlled bidirectional motor actuation with real-time current feedback. Use Value: Enables ASIL-B compliant closed-loop position control using CFB analog signal and SPI-reported fault status. | Use Scenario: Regulating EGR valve opening in diesel engines to reduce NOx emissions during transient acceleration. IC Role / Device Role / Timing Role: High-reliability motor driver delivering 10 A peak current for fast valve response with thermal derating. Use Value: Supports ISO 26262-compliant diagnostics including open-load detection and overtemperature shutdown. |
| Turbocharger Wastegate Actuation | Electric Coolant Pump Control |
Use Scenario: Controlling wastegate flap position to manage boost pressure in turbocharged ICE powertrains. IC Role / Device Role / Timing Role: SPI-programmable H-bridge providing configurable slew rate to minimize EMI near sensitive engine sensors. Use Value: Eight slew-rate options allow optimization for EMC compliance without sacrificing thermal performance. | Use Scenario: Driving brushless or brushed coolant pumps in 48 V mild-hybrid and electric vehicle thermal management systems. IC Role / Device Role / Timing Role: Motor driver operating across 5–28 V supply range with 40 V transient tolerance for load-dump immunity. Use Value: Integrated VPWR overvoltage protection triggers high-side recirculation braking and FS_B alert for system-level fault handling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar H-bridge motor driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33883 | Lower peak current (6 A), no SPI interface, fixed slew rate, lacks CFB analog feedback | Targeted at cost-sensitive non-safety-critical applications without diagnostic requirements | Select when SPI configurability, real-time current feedback, and ASIL-B diagnostics are not required |
| DRV3205-Q1 | Higher RDS(on) (350 mΩ), no integrated charge pump, requires external level-shifting for 3.3 V MCU interfacing | Designed for lower-power HVAC actuators; lacks HVQFN thermal performance and fault granularity | Choose only if board space allows SOIC-24 and thermal budget permits higher conduction loss |
Compared with MC33HB2000ES, MC33883 omits SPI-based diagnostics and current feedback, reducing design flexibility for safety-critical systems; DRV3205-Q1 trades off thermal efficiency and integrated biasing for simpler layout, making MC33HB2000ES preferable for high-reliability automotive actuators demanding precise current control and comprehensive fault reporting.
Availability
MC33HB2000ES is available at Aetrix Electronics and suitable for electronic throttle control, exhaust gas recirculation (EGR), turbocharger wastegate actuation, and electric coolant pump applications requiring stable component supply, automotive-grade reliability, and long-term lifecycle support.
Supply support for MC33HB2000ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and ASIL-certified power management ICs.
The MC33HB2000ES belongs to NXP's SMARTMOS automotive H-bridge family, engineered specifically for ISO 26262-compliant brushed DC motor control in powertrain and chassis subsystems where diagnostic coverage, thermal resilience, and SPI configurability are mandatory.
FAQ
What is the maximum continuous current rating for the MC33HB2000ES?
The MC33HB2000ES has a nominal continuous average load current rating of 3.0 A under specified thermal conditions. This value assumes proper PCB thermal design-including connection of the exposed pad (EP) to a large copper area-and operation within the −40 °C to 125 °C ambient temperature range. Peak current capability remains 16 A for transients under 5 ms, enabling robust motor start-up torque without exceeding safe junction temperatures in the MC33HB2000ES.
Does the MC33HB2000ES require an external charge pump capacitor?
Yes, the MC33HB2000ES requires an external 100 nF reservoir capacitor connected between the CCP pin and VPWR. This capacitor is essential for internal charge pump operation, which biases the high-side MOSFET gates. Without it, the MC33HB2000ES cannot fully turn ON its high-side switches, resulting in improper H-bridge function, reduced output current, and potential thermal stress. The datasheet explicitly states that the device "does not operate properly without the external reservoir capacitor."
How does the CFB pin on the MC33HB2000ES provide current feedback?
The CFB pin on the MC33HB2000ES delivers a ground-referenced analog current proportional to 0.25 % of the high-side output current (e.g., 2.5 mA for a 10 A load). It achieves ≤5.0 % gain error across 2–10 A, enabling accurate closed-loop current regulation. An external resistor (RCFB) converts this current to voltage; typical designs use 1 kΩ for 2.5 V full-scale. The MC33HB2000ES CFB circuit maintains accuracy even in noisy environments due to built-in filtering and high-frequency noise rejection.
Can the MC33HB2000ES operate without SPI communication?
Yes, the MC33HB2000ES supports standalone operation without SPI: default settings include 2.0 V/μs slew rate and 7.0 A current limit threshold. All basic H-bridge functions-direction control via IN1/IN2, enable/disable via ENBL/DIS, and fault signaling via FS_B-remain fully operational. However, advanced features like custom slew rates, alternate current limits, fault masking, and diagnostic register reads require SPI. The MC33HB2000ES retains full automotive safety functionality (e.g., overtemperature shutdown) regardless of SPI usage.
What package type and thermal characteristics define the MC33HB2000ES?
The MC33HB2000ES uses a 28-pin HVQFN package with exposed thermal pad (EP), delivering RΘJC = 0.39 °C/W-significantly lower than competing SOIC or PQFN variants. This enables efficient heat transfer to the PCB, supporting >3 A continuous operation without heatsinks. The package is AEC-Q100 Grade 1 qualified (−40 °C to 125 °C ambient), and its pin layout separates AGND/DGND/PGND to minimize noise coupling-critical for reliable MC33HB2000ES deployment in automotive ECU modules.
MC33HB2000ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 28-VQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Motor Type - Stepper:
- -
- Motor Type - AC, DC:
- -
- Function:
- -
- Output Configuration:
- Half Bridge
- Interface:
- Logic, PWM, SPI
- Technology:
- Power MOSFET
- Step Resolution:
- -
- Applications:
- DC Motors, General Purpose
- Current - Output:
- -
- Voltage - Supply:
- 3.3V ~ 5V
- Voltage - Load:
- 5V ~ 28V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 28-HVQFN (6x6)
MC33HB2000ES FAQ
1.How can I place an order for MC33HB2000ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33HB2000ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33HB2000ES reliable?
The price and inventory of MC33HB2000ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33HB2000ES is usually 5 days.
3.What payment methods are accepted for MC33HB2000ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33HB2000ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33HB2000ES?
MC33HB2000ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33HB2000ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33HB2000ES?
For technical support, including MC33HB2000ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33HB2000ES requirements.
6.How does Aetrix verify that MC33HB2000ES is sourced from the original manufacturer or authorized distributors?
All MC33HB2000ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33HB2000ES meets industry standards.
7.What is the process for return or replacement of MC33HB2000ES?
All MC33HB2000ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33HB2000ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33HB2000ES part is unused and in its original packaging.
Return procedure for MC33HB2000ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33HB2000ES Tags
-
DRV2603RUNR
Texas Instruments
-
DRV8837CDSGR
Texas Instruments
-
DRV8837DSGR
Texas Instruments
-
DRV8838DSGR
Texas Instruments
-
DRV8839DSSR
Texas Instruments
-
EMC2301-1-ACZL-TR
Microchip Technology
-
DRV8231ADSGR
Texas Instruments
-
EMC2302-2-AIZL-TR
Microchip Technology
-
DRV8800PWPR
Texas Instruments
-
DRV8835DSSR
Texas Instruments
-
EMC2303-1-KP-TR
Microchip Technology
-
DRV8876PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
