NXP Semiconductors MC33HB2000ESR2

Overview

MC33HB2000ESR2 from NXP Semiconductors is a SMARTMOS monolithic H-bridge power IC for brushed DC and servo motor control, featuring SPI programmability, 10 A peak output current, 3.0 A nominal continuous current, <5.0 % current-sense error via CFB pin, and AEC-Q100 Grade 1 qualification for automotive use in throttle and EGR actuators.

For engineers reviewing the MC33HB2000ESR2 datasheet, MC33HB2000ESR2 pinout, MC33HB2000ESR2 application, or MC33HB2000ESR2 equivalent, key selection criteria include SPI-configurable slew rates (0.25–16 V/μs), four selectable current limits (5.4/7.0/8.8/10.7 A), integrated diagnostics (open load, short-to-battery/ground, overtemperature), and thermal resistance <1.0 °C/W (junction-to-case).

Technical Context

The MC33HB2000ESR2 implements a full H-bridge using four internal N-channel MOSFETs with R_DS(on) ≤ 235 mΩ at T_J = 150 °C, supporting PWM-controlled bidirectional motor drive. Its SPI interface enables real-time configuration of slew rate, current limit, and operating mode (H-bridge/half-bridge), while fault reporting includes charge pump undervoltage, VPWR over/undervoltage, and per-output short-circuit detection.

Thermal management relies on an exposed pad package (HVQFN) with junction-to-case thermal resistance of 0.39 °C/W and integrated temperature warning/overtemperature shutdown. The CFB pin delivers a ground-referenced analog current mirror signal (1/400 × I_OUT) with accuracy better than ±5.0 % across 2.0–10 A load range, enabling closed-loop current monitoring without external sensing.

Key Specifications

Pinout & Package

MC33HB2000ESR2 uses a 28-pin HVQFN package with exposed thermal pad (EP), optimized for automotive PCB layouts requiring low-inductance power routing and high thermal conductivity. Pin numbering follows standard top-view index-area orientation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar H-bridge motor driver applications.

Compared with MC33HB2000ESR2, MC33883GEKR2 offers higher thermal headroom but sacrifices analog current feedback and fine-grained SPI control, while DRV8876NQRHBRQ1 reduces system complexity at the expense of diagnostic depth and EMI optimization capability.

Availability

MC33HB2000ESR2 is available at Aetrix Electronics and suitable for electronic throttle control, exhaust gas recirculation (EGR), turbocharger wastegate actuation, and electric coolant pump applications requiring stable component supply across automotive production lifecycles.

Supply support for MC33HB2000ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive-grade power management and functional safety.

The MC33HB2000ESR2 belongs to NXP's SMARTMOS H-bridge product line, engineered specifically for ISO 26262-compliant motor control in powertrain and chassis systems where reliability, diagnostics, and thermal resilience are critical.

FAQ

What is the maximum transient voltage the MC33HB2000ESR2 can withstand on its VPWR pin?

The MC33HB2000ESR2 supports a maximum transient voltage of 40 V on the VPWR pin during events such as load dump. This rating ensures robustness in automotive 12 V and 24 V systems. Exceeding 40 V may cause avalanche breakdown; external protection (e.g., Zener clamp or capacitor) is recommended. The MC33HB2000ESR2's overvoltage protection automatically places the load in high-side recirculation mode and signals the fault via FS_B.

How does the CFB pin on the MC33HB2000ESR2 provide current feedback, and what accuracy can be expected?

The CFB pin on the MC33HB2000ESR2 delivers a ground-referenced analog current mirror signal equal to 0.25 % of the high-side output current (1/400 × I_HS). It achieves better than ±5.0 % accuracy across a 2.0 A to 10 A load range. An external resistor (R_CFB) converts this current to voltage, and a capacitor filters high-frequency noise. This eliminates the need for external shunts and op-amps in closed-loop motor control designs using the MC33HB2000ESR2.

Can the MC33HB2000ESR2 operate without an SPI interface, and what are the default settings?

Yes, the MC33HB2000ESR2 can operate without SPI connection. In this mode, it defaults to a 2.0 V/μs slew rate and a 7.0 A current limit threshold. All basic H-bridge functions remain active via parallel control pins (ENBL, DIS, IN1, IN2). SPI is optional for advanced configuration-such as selecting alternate slew rates (0.25–16 V/μs), current limits (5.4/8.8/10.7 A), or diagnostic masking-but not required for fundamental motor drive operation of the MC33HB2000ESR2.

What thermal performance metrics define the MC33HB2000ESR2's ability to dissipate heat in automotive environments?

The MC33HB2000ESR2 achieves a junction-to-case (bottom) thermal resistance of 0.39 °C/W in its 28-pin HVQFN package, verified under JEDEC JESD51-8 test conditions. Combined with an exposed thermal pad (EP) soldered to a low-impedance PCB ground plane, this enables efficient heat transfer to the board. Its operational junction temperature spans −40 °C to 150 °C, with transient capability up to 195 °C, making the MC33HB2000ESR2 suitable for under-hood automotive applications with high ambient thermal stress.

Which fault conditions does the MC33HB2000ESR2 detect and report via its SPI interface and FS_B pin?

The MC33HB2000ESR2 detects and reports charge pump undervoltage, VPWR overvoltage/undervoltage, per-output short-to-ground and short-to-VPWR, open load, die temperature warning, and overtemperature shutdown. These faults are stored in a 16-bit SPI-accessible register and signaled externally via the active-low open-drain FS_B pin. Fault masking is configurable via SPI, allowing selective reporting-for example, disabling short-to-ground alerts during startup transients-while maintaining full diagnostic visibility for the MC33HB2000ESR2.