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NXP Semiconductors MC33HB2000FK
- Part No.:
- MC33HB2000FK
- Manufacturer:
- NXP Semiconductors
- Category:
- Motor Drivers, Controllers
- Package:
- 32-PowerQFN
- Datasheet:
-
MC33HB2000FK.pdf
- Description:
- IC HALF BRIDGE DRIVER 3A 32QFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,985
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Product details
Overview
MC33HB2000FK from NXP Semiconductors is a SMARTMOS monolithic H-bridge power IC with SPI programmability, designed for brushed DC motor control in automotive powertrain systems. It delivers 10 A peak output current, supports 5.0–28 V VPWR operation, integrates low-RDS(on) MOSFETs (235 mΩ max at 150 °C), and provides real-time analog current feedback via CFB pin with <5.0 % error - used in electronic throttle and EGR actuators.
For engineers reviewing the MC33HB2000FK datasheet, MC33HB2000FK pinout, MC33HB2000FK application, or MC33HB2000FK equivalent, key selection considerations include its AEC-Q100 Grade 1 qualification, ISO 26262 functional safety support, 32-pin PQFN exposed-pad thermal package, eight SPI-selectable slew rates (0.25–16 V/μs), and four programmable current limits (5.4/7.0/8.8/10.7 A).
Technical Context
The MC33HB2000FK implements a full H-bridge topology using four integrated N-channel MOSFETs with independent high-side/low-side switching control via IN1/IN2 logic inputs and ENBL/DIS enable/disable hierarchy. Its internal charge pump enables full enhancement of high-side FETs across the 5–28 V VPWR range, while the current mirror (CFB) delivers proportional analog feedback referenced to AGND.
SPI communication (CS_B/MOSI/MISO/SCLK) enables runtime configuration of slew rate, current limit, fault masking, and bridge mode (H-bridge/half-bridge), with daisy-chain capability. Fault reporting includes open load, short-to-ground/VPWR per output, overtemperature warning/shutdown, VPWR over/undervoltage, and charge pump undervoltage - all accessible via 16-bit status register reads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Output Current | 16 A transient (<5 ms), enabling robust short-circuit handling during motor stall or startup |
| Continuous Average Load Current | 3.0 A nominal, defining steady-state thermal design envelope under natural convection |
| RDS(on) per MOSFET | 235 mΩ max at TJ = 150 °C, directly determining I²R conduction losses and junction temperature rise |
| VPWR Operating Range | 5.0–28 V, supporting 12 V and 24 V automotive battery systems including cold-crank and load-dump transients up to 40 V |
| Current Feedback Accuracy | <5.0 % error from 2–10 A load, enabling closed-loop torque control without external shunt amplifiers |
| Junction-to-Case Thermal Resistance | 0.61 °C/W (bottom), confirming efficient heat transfer to PCB copper through exposed pad for high-power operation |
| Slew Rate Range | 0.25–16 V/μs (8 SPI-selectable steps), allowing EMI reduction or fast switching trade-offs per application requirements |
| Ambient Temperature Range | −40 °C to +125 °C, meeting under-hood automotive environmental requirements for engine compartment placement |
Pinout & Package
MC33HB2000FK uses a 32-pin PQFN package with thermally enhanced exposed pad (EP), optimized for high-current motor drive and automotive thermal cycling reliability. The package footprint matches industry-standard 10 mm × 10 mm body size with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT1 / OUT2 | H-bridge power outputs | Each pair drives one motor terminal; configured as half-bridge sources/sinks with independent PWM control |
| IN1 / IN2 | Digital direction control inputs | Logic-level signals (3.3/5 V compatible) that determine forward/reverse motor rotation without shoot-through risk |
| ENBL | Global enable input | Active-high signal placing device into Sleep mode (50 μA IVPWR) when low; required for safe power sequencing |
| DIS | Output disable input | Active-high signal tri-stating both outputs while retaining logic functionality - used for dynamic braking or fault recovery |
| CFB | Analog current feedback output | Ground-referenced 0.25 % of high-side current; enables real-time load monitoring with external RCFB scaling |
| FS_B | Open-drain fault status flag | Active-low output signaling any enabled fault condition; requires external pull-up to VDDQ for MCU interrupt generation |
| VPWR | Main power supply input | Must be connected to multiple pins (12,13,29,30) with low-inductance routing to minimize voltage spikes during switching |
| PGND / AGND / DGND / EP | Ground terminals | All must be tied together with low-impedance copper pour beneath exposed pad to ensure stable reference and thermal performance |
Key Features
| Feature | Design Value |
|---|---|
| SPI-configurable slew rate | Eight discrete settings (0.25–16 V/μs) allow precise EMI compliance tuning without hardware changes |
| Programmable current limiting | Four thresholds (5.4/7.0/8.8/10.7 A) enable one device to serve multiple motor sizes and torque profiles |
| Integrated diagnostic reporting | Real-time detection of open load, short-to-ground/VPWR, overtemperature, and VPWR faults - all readable via SPI status register |
| High-accuracy current mirror | CFB output delivers 1/400th of high-side current with <5.0 % error across 2–10 A, eliminating need for external sense resistors |
| Automotive-grade protection | Includes overvoltage shutdown (40 V transient tolerance), undervoltage lockout, thermal warning/shutdown, and charge pump supervision |
| Flexible interface compatibility | VDDQ biasing supports 3.3 V or 5.0 V MCU logic levels; all digital I/Os tolerate up to 36 V, simplifying system-level voltage translation |
Applications
| Electronic Throttle Control | Exhaust Gas Recirculation (EGR) |
|---|---|
Use Scenario: Precise angular positioning of throttle plate in gasoline engines during transient acceleration and idle stabilization. IC Role / Device Role / Timing Role: H-bridge driver executing PWM-controlled bidirectional actuation of 12 V brushed DC throttle motor with real-time current feedback. Use Value: Enables closed-loop torque control using CFB signal to prevent stalling and ensure fail-safe return-to-idle behavior under fault conditions. | Use Scenario: Regulating exhaust gas flow into intake manifold to reduce NOx emissions in diesel and gasoline direct injection engines. IC Role / Device Role / Timing Role: Bidirectional motor driver controlling EGR valve position via SPI-synchronized slew rate and current limit adaptation to varying backpressure. Use Value: Eight selectable slew rates suppress EMI near sensitive engine control sensors while maintaining responsive valve actuation across temperature extremes. |
| Turbocharger Wastegate Actuation | Electric Coolant Pump Control |
Use Scenario: Adjusting turbo boost pressure by rotating wastegate flap against high-temperature exhaust gas forces in turbocharged powertrains. IC Role / Device Role / Timing Role: High-reliability H-bridge delivering 10 A peak current to 24 V brushed DC actuator motor with thermal derating up to 150 °C junction temperature. Use Value: Junction-to-case thermal resistance of 0.61 °C/W ensures stable operation under sustained high-load conditions without external heatsinking. | Use Scenario: Variable-speed circulation of engine coolant in start-stop and electric vehicle thermal management systems. IC Role / Device Role / Timing Role: SPI-programmable motor driver enabling adaptive speed control based on coolant temperature and engine load via CAN-linked MCU. Use Value: Four programmable current limits allow single BOM to support multiple pump models (low/high flow) without hardware redesign. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar H-bridge motor driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33HB2000EK | 32-pin SOICW exposed pad package; higher RΘJA (23.9 °C/W on 4-layer board vs. 21.55 °C/W for FK); same electrical specs | Better suited for prototyping or lower-power applications where thermal margin exceeds requirement and through-hole assembly is preferred | Select MC33HB2000EK only if SOICW footprint and reflow compatibility are required; avoid for high-ambient or space-constrained designs |
| MC33HB2000AES | 28-pin HVQFN package; slightly better RΘJCBOTTOM (0.39 °C/W vs. 0.61 °C/W) but higher RΘJA on single-layer board (88.5 vs. 63.4 °C/W) | Optimized for compact layouts with minimal PCB area; requires tighter layout control due to smaller pad pitch and higher thermal sensitivity | Choose MC33HB2000AES when board area is critical and thermal management uses aggressive copper pours or forced airflow |
Compared with MC33HB2000EK and MC33HB2000AES, the MC33HB2000FK offers the best balance of thermal performance (lowest RΘJA on both 1s and 2s2p boards) and manufacturability in PQFN, making it the default choice for production automotive modules requiring high reliability and repeatable thermal behavior.
Availability
MC33HB2000FK is available at Aetrix Electronics and suitable for electronic throttle control, exhaust gas recirculation (EGR), and turbocharger wastegate actuation requiring stable component supply across automotive production lifecycles.
Supply support for MC33HB2000FK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The MC33HB2000FK belongs to NXP's SMARTMOS automotive power driver family, engineered specifically for ISO 26262-compliant brushed DC motor control in powertrain and chassis systems - emphasizing functional safety, thermal resilience, and SPI-based configurability.
FAQ
What is the maximum allowable VPWR transient voltage for the MC33HB2000FK?
The MC33HB2000FK supports a maximum VPWR transient voltage of 40 V during events such as load dump. This rating is defined in the Absolute Maximum Ratings table and applies regardless of operating mode. Exceeding 40 V may cause avalanche breakdown; external clamping (e.g., Zener diode or TVS) is recommended for systems prone to transients. The MC33HB2000FK itself does not include internal transient suppression beyond this limit.
Does the MC33HB2000FK require an external charge pump capacitor?
Yes, the MC33HB2000FK requires an external 100 nF capacitor connected between CCP and VPWR pins. This reservoir capacitor is mandatory for proper operation of the internal charge pump, which biases the high-side MOSFET gates. Omitting or undersizing this capacitor will result in incomplete high-side FET turn-on, increased RDS(on), excessive heating, and potential fault triggering. The MC33HB2000FK will not function correctly without it.
How does the CFB pin on the MC33HB2000FK provide current feedback?
The CFB pin on the MC33HB2000FK outputs a ground-referenced analog signal equal to 0.25 % of the high-side output current (1/400× IOUT). It achieves <5.0 % accuracy across 2–10 A loads and operates independently of VPWR fluctuations. An external resistor (RCFB) converts this current to voltage; typical values range from 100 Ω to 1 kΩ depending on ADC input range. The MC33HB2000FK's CFB circuit includes noise filtering capability and remains functional even in high-frequency EMI environments.
Can the MC33HB2000FK operate without SPI configuration?
Yes, the MC33HB2000FK can operate without SPI: it defaults to 2.0 V/μs slew rate and 7.0 A current limit upon power-up. All basic H-bridge functions - IN1/IN2 direction control, ENBL/DIS enable/disable, and fault flag (FS_B) - remain fully operational. SPI is optional for advanced features like custom slew rate selection, current limit adjustment, fault masking, or half-bridge mode. The MC33HB2000FK maintains full functional safety compliance even in default SPI-less mode.
What is the thermal resistance from junction to case (RΘJCBOTTOM) for the MC33HB2000FK?
The MC33HB2000FK has a junction-to-case (bottom) thermal resistance of 0.61 °C/W, measured per JEDEC JESD51-8. This value reflects heat transfer efficiency from the silicon die to the exposed thermal pad on the package underside. It is critical for calculating junction temperature rise under load and confirms the MC33HB2000FK's suitability for high-power automotive applications where PCB copper area serves as the primary heatsink. This RΘJCBOTTOM is lower than MC33HB2000EK (0.66 °C/W) and higher than MC33HB2000AES (0.39 °C/W).
MC33HB2000FK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-PowerQFN
- Packaging:
- Tray
- Product Status:
- Active
- Motor Type - Stepper:
- -
- Motor Type - AC, DC:
- -
- Function:
- -
- Output Configuration:
- Half Bridge
- Interface:
- Logic, PWM, SPI
- Technology:
- Power MOSFET
- Step Resolution:
- -
- Applications:
- DC Motors, General Purpose
- Current - Output:
- -
- Voltage - Supply:
- 3.3V ~ 5V
- Voltage - Load:
- 5V ~ 28V
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-PQFN (8x8)
MC33HB2000FK FAQ
1.How can I place an order for MC33HB2000FK through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33HB2000FK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33HB2000FK reliable?
The price and inventory of MC33HB2000FK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33HB2000FK is usually 5 days.
3.What payment methods are accepted for MC33HB2000FK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33HB2000FK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33HB2000FK?
MC33HB2000FK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33HB2000FK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33HB2000FK?
For technical support, including MC33HB2000FK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33HB2000FK requirements.
6.How does Aetrix verify that MC33HB2000FK is sourced from the original manufacturer or authorized distributors?
All MC33HB2000FK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33HB2000FK meets industry standards.
7.What is the process for return or replacement of MC33HB2000FK?
All MC33HB2000FK units undergo pre-shipment inspection (PSI). If there is an issue with MC33HB2000FK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33HB2000FK part is unused and in its original packaging.
Return procedure for MC33HB2000FK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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