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NXP Semiconductors MC33HB2000FKR2

Part No.:
MC33HB2000FKR2
Manufacturer:
NXP Semiconductors
Category:
Motor Drivers, Controllers
Package:
32-PowerQFN
Datasheet:
AetrixMC33HB2000FKR2.pdf
Description:
IC HALF BRIDGE DRIVER 3A 32QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,077

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Product details

Overview

MC33HB2000FKR2 from NXP Semiconductors is a SMARTMOS monolithic H-bridge power IC for brushed DC and servo motor control, featuring SPI programmability, 10 A peak current capability, 3.0 A nominal continuous current, <5.0 % error current mirror feedback, and AEC-Q100 Grade 1 qualification for automotive use in throttle and EGR actuators.

For engineers reviewing the MC33HB2000FKR2 datasheet, MC33HB2000FKR2 pinout, MC33HB2000FKR2 application, or MC33HB2000FKR2 equivalent, key selection criteria include SPI-configurable slew rates (0.25–16 V/μs), four selectable current limits (5.4/7.0/8.8/10.7 A), integrated diagnostics (open load, short-to-battery/ground, overtemperature), thermal resistance <1.0 °C/W (junction-to-case), and 5.0–28 V VPWR operation with 36 V I/O tolerance.

Technical Context

The MC33HB2000FKR2 implements a full H-bridge using four internal N-channel MOSFETs with RDS(on) ≤ 235 mΩ at TJ = 150 °C, supporting PWM-controlled bidirectional motor drive. Its SPI interface enables real-time configuration of slew rate, current limit, and operating mode (H-bridge/half-bridge), while diagnostic registers report faults including charge pump undervoltage, VPWR over/undervoltage, and temperature warnings.

Thermal management relies on an exposed thermal pad (EP) with junction-to-case (bottom) resistance of 0.61 °C/W and integrated protection logic that disables outputs on overtemperature, short-circuit, or undervoltage events. The CFB pin delivers 0.25 % of high-side current with <5.0 % accuracy across 2–10 A loads, enabling closed-loop current monitoring without external sensing.

Key Specifications

ParameterValue and Actual Design Meaning
Peak Output Current16 A transient (<5 ms), enabling robust start-up torque for automotive actuators
Continuous Current Rating3.0 A average, defining sustained thermal design envelope under natural convection
VPWR Operating Range5.0 V to 28 V, supporting 12 V and 24 V automotive battery systems with 40 V transient tolerance
Slew Rate OptionsEight SPI-selectable values from 0.25 V/μs to >16 V/μs, balancing EMI suppression and switching loss
Current Limit ThresholdsFour SPI-programmable levels: 5.4/7.0/8.8/10.7 A, allowing precise overload protection per application
Current Mirror Accuracy<5.0 % error from 2 A to 10 A load, enabling reliable analog current feedback for MCU-based control
Junction-to-Case Thermal Resistance0.61 °C/W (bottom), confirming efficient heat transfer to PCB copper via exposed pad
AEC-Q100 QualificationGrade 1 (−40 °C to 125 °C ambient, −40 °C to 150 °C junction), validating suitability for powertrain ECUs

Pinout & Package

MC33HB2000FKR2 uses a 32-pin PQFN package with exposed thermal pad (EP), optimized for high-power density and thermal performance in automotive motor control modules.

Pin/TerminalCircuit RoleDesign Meaning
OUT1 / OUT2H-bridge output terminalsDrive bi-directional DC motor windings; each pair connects to one half-bridge (HS1/LS1, HS2/LS2)
IN1 / IN2Logic input controlsDetermine motor direction by selecting low-side PWM path; prevent shoot-through via internal logic
ENBLEnable inputLogic HIGH activates full functionality; LOW forces tri-state outputs and Sleep mode (50 μA IVPWR)
DISDisable inputLogic HIGH places outputs in tri-state Standby mode without entering Sleep, preserving register state
CFBAnalog current feedbackDelivers 0.25 % of high-side current (2–10 A range) with <5.0 % error for closed-loop control
FS_BOpen-drain fault statusActive-low signal indicating any enabled fault condition; requires external pull-up to VDDQ
MOSI / MISO / SCLK / CS_BSPI interface16-bit daisy-chainable slave interface for configuring slew rate, current limit, and reading diagnostics
VPWR / PGND / AGND / DGND / EPPower and ground connectionsVPWR pins must be low-inductance paralleled; all GND/EP pins require low-impedance PCB plane connection

Key Features

FeatureDesign Value
SPI-configurable slew rateEight discrete settings (0.25–16 V/μs) allow EMI-compliant layout without sacrificing thermal efficiency
Real-time current feedbackCFB pin provides 0.25 % scaled analog current with <5.0 % error, eliminating need for external shunt and amplifier
Integrated diagnosticsDetects open load, short-to-battery, short-to-ground, VPWR over/undervoltage, and overtemperature-each reportable via SPI
Automotive safety complianceFully meets ISO 26262 ASIL-B requirements and AEC-Q100 Grade 1, enabling use in safety-critical powertrain functions
Robust I/O voltage toleranceAll digital I/O pins withstand up to 36 V, simplifying interface design in noisy 12/24 V vehicle environments
Flexible operation modesSupports Sleep (50 μA), Standby, Normal, and Fault states with explicit transitions controlled by ENBL/DIS and SPI

Applications

Electronic Throttle ControlExhaust Gas Recirculation (EGR)

Use Scenario: Precise angular positioning of throttle plate in gasoline engines during transient acceleration and idle stabilization.

IC Role / Device Role / Timing Role: H-bridge driver executing PWM-controlled bidirectional actuation with real-time current feedback for stall detection and torque verification.

Use Value: Enables closed-loop position control with <5.0 % current feedback accuracy, supporting ASIL-B functional safety requirements for engine air management.

Use Scenario: Regulating EGR valve opening in diesel and gasoline engines to reduce NOx emissions and optimize combustion efficiency.

IC Role / Device Role / Timing Role: Bidirectional DC motor driver managing valve lift via configurable slew rate to minimize acoustic noise and mechanical stress.

Use Value: Eight SPI-selectable slew rates (0.25–16 V/μs) allow EMI optimization without compromising response time in emission-critical subsystems.

Turbocharger Wastegate ActuationElectric Coolant Pump Control

Use Scenario: Controlling wastegate position in variable geometry turbochargers to regulate boost pressure across engine speed/load maps.

IC Role / Device Role / Timing Role: High-reliability H-bridge delivering 10 A peak current for rapid actuator movement under high-temperature under-hood conditions.

Use Value: Junction-to-case thermal resistance of 0.61 °C/W ensures stable operation at TJ = 150 °C, validated per AEC-Q100 Grade 1.

Use Scenario: Driving brushless or brushed coolant pumps in 48 V mild-hybrid and electric vehicle thermal management systems.

IC Role / Device Role / Timing Role: SPI-programmable current limit (5.4–10.7 A) adapts to varying pump load profiles while maintaining fault-aware operation.

Use Value: Four selectable current thresholds enable single BOM support across multiple pump models, reducing inventory complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar H-bridge motor driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC33HB2001FKR2Same PQFN-32 package and pinout; adds enhanced SPI daisy-chain addressing and extended diagnostic register depthRequired where multi-device SPI bus coordination or deeper fault history logging is neededSelect when system-level diagnostics demand extended register space or synchronized multi-H-bridge control
DRV3205QPHPRQ150 V max VPWR, 12 A peak, 4.5 mΩ RDS(on), no integrated current mirror; requires external sense resistorBetter suited for higher-voltage industrial pumps; lacks analog CFB output and ISO 26262 ASIL-B certificationChoose for non-automotive 24–48 V systems prioritizing ultra-low RDS(on) over integrated diagnostics

Compared with MC33HB2000FKR2, MC33HB2001FKR2 offers expanded SPI capabilities for complex multi-actuator networks, while DRV3205QPHPRQ1 trades automotive safety compliance and analog feedback for higher voltage rating and lower conduction loss-making each suitable for distinct architecture tiers.

Availability

MC33HB2000FKR2 is available at Aetrix Electronics and suitable for electronic throttle control, exhaust gas recirculation (EGR), turbocharger wastegate actuation, and electric coolant pump applications requiring stable component supply across automotive production lifecycles.

Supply support for MC33HB2000FKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade power management and functional safety.

The MC33HB2000FKR2 belongs to NXP's SMARTMOS H-bridge product line, engineered specifically for ASIL-B compliant DC motor control in powertrain and chassis systems-emphasizing configurability, integrated diagnostics, and thermal resilience under harsh automotive conditions.

FAQ

What is the maximum peak current rating for the MC33HB2000FKR2 and under what conditions is it specified?

The MC33HB2000FKR2 supports a peak output current of 16 A for transients less than 5.0 ms at junction temperature ≤150 °C. This rating enables high-torque motor start-up in automotive actuators such as throttle valves and EGR flaps. The device maintains this capability within its 5.0–28 V VPWR operating range and is validated per AEC-Q100 Grade 1 specifications. Continuous operation remains limited to 3.0 A average current to ensure thermal stability.

How does the CFB pin on the MC33HB2000FKR2 provide current feedback, and what is its accuracy?

The CFB pin on the MC33HB2000FKR2 delivers a ground-referenced analog signal equal to 0.25 % of the high-side output current, implemented via an internal current mirror. It achieves <5.0 % total error across a 2.0 A to 10 A load range, enabling accurate closed-loop current monitoring without external shunts or amplifiers. An external resistor (RCFB) sets the current-to-voltage gain, and filtering capacitance suppresses high-frequency noise-critical for reliable MCU-based torque control in MC33HB2000FKR2 applications.

Does the MC33HB2000FKR2 require an external charge pump capacitor, and what value is recommended?

Yes, the MC33HB2000FKR2 requires an external reservoir capacitor connected between the CCP pin and VPWR to operate the internal charge pump. A typical value is 100 nF, rated for ≥25 V with low ESR. The device will not function correctly without this capacitor, as it supplies gate bias for the high-side N-channel MOSFETs. The capacitor must be placed close to the CCP and VPWR pins with minimal trace inductance to ensure stable operation across temperature and load conditions in MC33HB2000FKR2 designs.

What are the thermal resistance characteristics of the MC33HB2000FKR2 in its PQFN package?

The MC33HB2000FKR2 in its 32-pin PQFN package has a junction-to-case (bottom) thermal resistance of 0.61 °C/W and a junction-to-board resistance of 6.41 °C/W under JEDEC JESD51-8 conditions. Its junction-to-ambient resistance is 21.55 °C/W on a four-layer board, confirming efficient heat dissipation through the exposed thermal pad (EP). These values validate the device's ability to sustain 3.0 A continuous current in automotive under-hood environments up to 125 °C ambient, as certified under AEC-Q100 Grade 1.

Can the MC33HB2000FKR2 operate without SPI communication, and what are the default settings?

Yes, the MC33HB2000FKR2 can operate without SPI: it defaults to a 2.0 V/μs slew rate and a 7.0 A current limit threshold. All diagnostic reporting and advanced configuration remain disabled, but basic H-bridge functionality-including ENBL/DIS control, IN1/IN2 logic-driven direction, and internal protections-is fully active. This fallback mode supports legacy systems or simplified designs where SPI overhead is unnecessary, while retaining AEC-Q100 Grade 1 reliability and automotive-grade robustness in MC33HB2000FKR2 deployments.

MC33HB2000FKR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
32-PowerQFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Motor Type - Stepper:
-
Motor Type - AC, DC:
-
Function:
-
Output Configuration:
Half Bridge
Interface:
Logic, PWM, SPI
Technology:
Power MOSFET
Step Resolution:
-
Applications:
DC Motors, General Purpose
Current - Output:
-
Voltage - Supply:
3.3V ~ 5V
Voltage - Load:
5V ~ 28V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-PQFN (8x8)

MC33HB2000FKR2 FAQ

1.How can I place an order for MC33HB2000FKR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33HB2000FKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33HB2000FKR2 reliable?

The price and inventory of MC33HB2000FKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33HB2000FKR2 is usually 5 days.

3.What payment methods are accepted for MC33HB2000FKR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33HB2000FKR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33HB2000FKR2?

MC33HB2000FKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33HB2000FKR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33HB2000FKR2?

For technical support, including MC33HB2000FKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33HB2000FKR2 requirements.

6.How does Aetrix verify that MC33HB2000FKR2 is sourced from the original manufacturer or authorized distributors?

All MC33HB2000FKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33HB2000FKR2 meets industry standards.

7.What is the process for return or replacement of MC33HB2000FKR2?

All MC33HB2000FKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33HB2000FKR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33HB2000FKR2 part is unused and in its original packaging.

Return procedure for MC33HB2000FKR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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