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NXP Semiconductors MC33HB2001EK

Part No.:
MC33HB2001EK
Manufacturer:
NXP Semiconductors
Category:
Motor Drivers, Controllers
Package:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Datasheet:
AetrixMC33HB2001EK.pdf
Description:
IC HALF BRIDGE DRIVER 32SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,546

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Product details

Overview

MC33HB2001EK from NXP Semiconductors is a SMARTMOS monolithic H-bridge power IC for brushed DC motor control, featuring SPI programmability, 10 A peak output current, 3.0 A continuous average load current, and AEC-Q100 Grade 1 qualification for automotive use in throttle and EGR actuators.

For engineers reviewing the MC33HB2001EK datasheet, MC33HB2001EK pinout, MC33HB2001EK application, or MC33HB2001EK equivalent, this page delivers verified thermal resistance (RΘJCBOTTOM = 0.66 °C/W), 32-pin SOICW exposed-pad package details, real-time current mirror feedback (<5.0 % error), and ISO 26262-compliant diagnostic reporting via SPI.

Technical Context

The MC33HB2001EK implements dual N-channel MOSFET half-bridges with configurable slew rates (0.25–16 V/μs) and four programmable current limits (5.4/7.0/8.8/10.7 A), enabling EMI optimization and thermal management in harsh automotive environments. Its integrated charge pump supports full enhancement of high-side switches across 5.0–28 V VPWR.

SPI-controlled diagnostics include per-output short-to-ground/VPWR detection, open-load sensing, overtemperature warning/shutdown, and VPWR/charge-pump voltage monitoring. The device operates in Sleep, Standby, Normal, and Fault modes, with FS_B providing active-low fault signaling and ENBL/DIS enabling hierarchical power-state control.

Key Specifications

Parameter Value and Actual Design Meaning
Peak Output Current 16 A transient (<5 ms), enabling robust surge handling during motor startup or stall conditions
Continuous Average Load Current 3.0 A at TJ ≤ 150 °C, defining sustained torque delivery capability under thermal equilibrium
Junction-to-Case Thermal Resistance 0.66 °C/W (bottom), confirming efficient heat transfer to PCB via exposed pad for high-power operation
RDS(on) per MOSFET 125 mΩ max at TJ = 150 °C, minimizing conduction losses and self-heating during PWM operation
SPI Clock Frequency 0.5–10 MHz, supporting fast register access and real-time fault clearing without MCU timing constraints
Current Mirror Accuracy <5.0 % error (2–10 A range), delivering reliable analog feedback for closed-loop current control
Operating Supply Range 5.0–28 V VPWR, covering 12 V automotive battery systems including cold-crank (5 V) and load-dump (40 V transient)

Pinout & Package

MC33HB2001EK uses a 32-pin SOICW package with thermally enhanced exposed pad (EP), optimized for high-current motor drive applications requiring low RΘJA (23.9 °C/W on 4-layer board) and mechanical compatibility with legacy SOIC footprints.

Pin/Terminal Circuit Role Design Meaning
OUT1 / OUT2 H-bridge output terminals Drive bi-directional brushed DC motors; each pair comprises HS1/LS1 and HS2/LS2 N-MOSFETs with independent control
IN1 / IN2 Digital input controls Determine motor direction via logic-level signals; enable shoot-through-free PWM commutation in H-bridge mode
ENBL Enable input Logic HIGH activates full functionality; LOW forces Sleep mode with <50 μA VPWR quiescent current
DIS Disable input Logic HIGH places outputs in high-impedance Standby mode without disabling internal logic or SPI interface
CFB Analog current feedback Provides 0.25 % of high-side load current (2–10 A range); enables real-time current monitoring with external RCFB
FS_B Fault status flag Open-drain active-LOW output signaling faults (overtemp, short-circuit, undervoltage) per mask register configuration
MOSI/MISO/SCLK/CS_B SPI interface 16-bit full-duplex slave interface for configuring slew rate, current limit, diagnostics, and reading fault registers
VPWR / PGND / AGND / DGND / EP Power and ground terminals Multi-pin VPWR/PGND routing minimizes IR drop; EP must be soldered to large copper pour for thermal conduction

Key Features

Feature Design Value
Eight SPI-selectable slew rates 0.25–16 V/μs range allows precise trade-off between EMI suppression and switching loss reduction
Four programmable current limits 5.4/7.0/8.8/10.7 A thresholds enable application-specific overload protection without hardware changes
Integrated current mirror feedback 0.25 % scaling factor with <5.0 % error provides accurate analog current signal for MCU ADC sampling
ISO 26262 ASIL-B ready diagnostics Real-time reporting of short-to-ground/VPWR, open load, overtemperature, and supply faults via SPI register map
Thermal resistance optimization RΘJCBOTTOM = 0.66 °C/W ensures die temperature stays within 150 °C limit under 3.0 A continuous load
36 V tolerant I/O pins IN1, IN2, DIS, ENBL, CS_B, SCLK, MOSI withstand transients up to 36 V, eliminating external level shifters

Applications

Electronic Throttle Control Exhaust Gas Recirculation (EGR)

Use Scenario: Precise angular positioning of throttle plate in gasoline engines using PWM-driven DC motor.

IC Role / Device Role / Timing Role: H-bridge driver executing bidirectional torque control with real-time current feedback and fault-safe shutdown.

Use Value: Enables ASIL-B compliant position control with <5.0 % current sensing accuracy and overtemperature warning before shutdown.

Use Scenario: Actuation of EGR valve in diesel powertrains to reduce NOx emissions under varying engine loads.

IC Role / Device Role / Timing Role: SPI-configurable motor driver managing valve opening/closing with programmable slew rate to suppress EMI near sensitive sensors.

Use Value: Delivers 10 A peak current for fast valve response while maintaining thermal stability via 0.66 °C/W junction-to-case path.

Turbocharger Wastegate Control Electric Coolant Pump Drive

Use Scenario: Closed-loop control of turbo wastegate actuator to regulate boost pressure in forced-induction engines.

IC Role / Device Role / Timing Role: High-reliability H-bridge providing bidirectional motor drive with diagnostic coverage for open-load and short-circuit faults.

Use Value: Supports ISO 26262 functional safety requirements through SPI-accessible fault registers and FS_B latched alerting.

Use Scenario: Variable-speed driving of electric coolant pumps in hybrid/electric vehicle thermal management systems.

IC Role / Device Role / Timing Role: Motor controller operating across 5–28 V VPWR range, accommodating start-stop battery voltage sag and load-dump transients.

Use Value: Ensures continuous operation with 125 mΩ RDS(on) MOSFETs and integrated overvoltage protection placing load in braking mode during VPWR spikes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar H-bridge motor driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC33HB2002EK Same SOICW-32 package and pinout; adds independent half-bridge disable control and enhanced SPI register set Supports more complex multi-actuator systems requiring individual bridge isolation Select when needing per-bridge disable capability beyond MC33HB2001EK's global DIS function
DRV8876PWPR 36-V, 10-A H-bridge in 20-pin HTSSOP; no SPI interface; uses analog current sense and fixed 2.5-A current limit Targeted at cost-sensitive industrial motors without functional safety or programmability requirements Choose for non-automotive applications where SPI configurability and ASIL-B diagnostics are unnecessary

Compared with MC33HB2001EK, MC33HB2002EK extends configurability for multi-bridge coordination, while DRV8876PWPR offers simpler analog control at lower system cost-neither is pin-compatible, but both address overlapping motor drive use cases with distinct safety and interface trade-offs.

Availability

MC33HB2001EK is available at Aetrix Electronics and suitable for electronic throttle control, exhaust gas recirculation (EGR), turbocharger wastegate actuation, and electric coolant pump applications requiring stable component supply, AEC-Q100 Grade 1 compliance, and ISO 26262 functional safety support.

Supply support for MC33HB2001EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and power management ICs.

The MC33HB2001EK belongs to NXP's SMARTMOS automotive H-bridge family, engineered specifically for high-reliability DC motor control in powertrain and chassis systems demanding ASIL-B compliance and robust thermal performance.

FAQ

What is the maximum continuous current rating for the MC33HB2001EK?

The MC33HB2001EK has a nominal continuous average load current rating of 3.0 A at junction temperature ≤150 °C. This value assumes proper PCB thermal design-including connection of the exposed pad (EP) to a low-impedance ground plane-and operation within the 5.0–28 V VPWR range. Peak current capability reaches 16 A for transients under 5 ms.

Does the MC33HB2001EK require an external charge pump capacitor?

Yes, the MC33HB2001EK requires an external 100 nF capacitor connected between the CCP pin and VPWR. This reservoir capacitor is essential for internal charge pump operation, which biases the high-side N-MOSFET gates. Without it, the device cannot fully enhance the high-side switches, resulting in improper H-bridge functionality and potential failure to drive loads.

How does the current mirror output (CFB) on the MC33HB2001EK work?

The CFB pin on the MC33HB2001EK provides a ground-referenced analog current proportional to the high-side output current at a scaling factor of 0.25 %. It delivers less than 5.0 % error across a 2.0–10 A load range. An external resistor (RCFB) converts this current to voltage; for example, 1 kΩ yields 2.5 mV/A. The signal remains stable in noisy environments due to built-in filtering.

Can the MC33HB2001EK operate without SPI communication?

Yes, the MC33HB2001EK can operate without SPI: default settings apply-2.0 V/μs slew rate and 7.0 A current limit threshold. Parallel inputs (IN1/IN2/ENBL/DIS) remain fully functional for basic H-bridge control. However, advanced diagnostics, programmable limits, and fault register access require SPI initialization and polling.

What thermal resistance values define the MC33HB2001EK's cooling performance?

The MC33HB2001EK specifies RΘJCBOTTOM = 0.66 °C/W (junction-to-case bottom), RΘJB = 7.1 °C/W (junction-to-board), and RΘJA = 23.9 °C/W (junction-to-ambient on 4-layer board). These values confirm its suitability for high-power automotive motor drives when mounted with low-thermal-resistance soldering to a thermally robust PCB layout.

MC33HB2001EK Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging:
Tube
Product Status:
Active
Motor Type - Stepper:
-
Motor Type - AC, DC:
-
Function:
-
Output Configuration:
Half Bridge (2)
Interface:
SPI
Technology:
Power MOSFET
Step Resolution:
-
Applications:
DC Motors, General Purpose
Current - Output:
-
Voltage - Supply:
5V ~ 28V
Voltage - Load:
5V ~ 28V
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-SOIC-EP

MC33HB2001EK FAQ

1.How can I place an order for MC33HB2001EK through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33HB2001EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33HB2001EK reliable?

The price and inventory of MC33HB2001EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33HB2001EK is usually 5 days.

3.What payment methods are accepted for MC33HB2001EK?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33HB2001EK transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33HB2001EK?

MC33HB2001EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33HB2001EK order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33HB2001EK?

For technical support, including MC33HB2001EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33HB2001EK requirements.

6.How does Aetrix verify that MC33HB2001EK is sourced from the original manufacturer or authorized distributors?

All MC33HB2001EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33HB2001EK meets industry standards.

7.What is the process for return or replacement of MC33HB2001EK?

All MC33HB2001EK units undergo pre-shipment inspection (PSI). If there is an issue with MC33HB2001EK, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33HB2001EK part is unused and in its original packaging.

Return procedure for MC33HB2001EK:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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